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    Thin film probe sheet and semiconductor chip inspection system
    1.
    发明申请
    Thin film probe sheet and semiconductor chip inspection system 审中-公开
    薄膜探针片和半导体芯片检测系统

    公开(公告)号：US20060094162A1

    公开(公告)日：2006-05-04

    申请号：US11253575

    申请日：2005-10-20

    申请人： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    发明人： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    IPC分类号： H01L21/50

    CPC分类号： G01R1/0735 ,  Y10T29/49156

    摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

    摘要翻译： 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

    THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM
    2.
    发明申请
    THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM 审中-公开
    薄膜探针片和半导体芯片检查系统

    公开(公告)号：US20110014727A1

    公开(公告)日：2011-01-20

    申请号：US12883982

    申请日：2010-09-16

    申请人： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    发明人： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    IPC分类号： H01L21/66 ,  H05K3/02

    CPC分类号： G01R1/0735 ,  Y10T29/49156

    摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

    摘要翻译： 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

    PROBE CARD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    5.
    发明申请
    PROBE CARD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
    探针卡和制造半导体集成电路器件的方法

    公开(公告)号：US20110281380A1

    公开(公告)日：2011-11-17

    申请号：US13107317

    申请日：2011-05-13

    申请人： Yasunori NARIZUKA ,  Etsuko Takane ,  Akio Hasebe

    发明人： Yasunori NARIZUKA ,  Etsuko Takane ,  Akio Hasebe

    IPC分类号： H01L21/66 ,  G01R31/00

    CPC分类号： G01R3/00 ,  G01R1/07314

    摘要： Provided is a probe card for LSI inspection that can achieve electrical conduction to electrodes on an LSI with a low load without damaging the electrodes and a structural body therebelow, even if the electrodes are arranged at a narrow pitch and in a complex manner. A contact terminal is formed in a truncated square pyramidal recess provided on a film-shaped probe. A dent is often formed on a surface of the film-shaped probe just above the contact terminal. A resin coating film is formed so as to eliminate the dent and flatten the surface of the film-shaped probe. At this time, it is preferred that an amount of cure shrinkage of a resin paste for forming the resin coating film is 0.1% or less.

    摘要翻译： 提供了一种用于LSI检查的探针卡，即使以窄间距和复杂的方式布置电极，也可以在低负载下实现对LSI上的电极的导电而不损坏电极及其结构体。 接触端子形成在设置在膜状探针上的截头方形锥形凹部中。 通常在接触端子正上方的膜状探针的表面上形成凹痕。 形成树脂涂膜，以消除凹陷并使膜形探针的表面变平。 此时，用于形成树脂涂膜的树脂糊剂的固化收缩率优选为0.1％以下。