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    Thin film probe sheet and semiconductor chip inspection system
    1.
    发明申请
    Thin film probe sheet and semiconductor chip inspection system 审中-公开
    薄膜探针片和半导体芯片检测系统

    公开(公告)号：US20060094162A1

    公开(公告)日：2006-05-04

    申请号：US11253575

    申请日：2005-10-20

    申请人： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    发明人： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    IPC分类号： H01L21/50

    CPC分类号： G01R1/0735 ,  Y10T29/49156

    摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

    摘要翻译： 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

    THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM
    2.
    发明申请
    THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM 审中-公开
    薄膜探针片和半导体芯片检查系统

    公开(公告)号：US20110014727A1

    公开(公告)日：2011-01-20

    申请号：US12883982

    申请日：2010-09-16

    申请人： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    发明人： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

    IPC分类号： H01L21/66 ,  H05K3/02

    CPC分类号： G01R1/0735 ,  Y10T29/49156

    摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

    摘要翻译： 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

    Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device
    6.
    发明申请
    Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device 审中-公开
    传输电路，连接片，探头片，探针卡，半导体检测系统及制造半导体器件的方法

    公开(公告)号：US20080029763A1

    公开(公告)日：2008-02-07

    申请号：US11740301

    申请日：2007-04-26

    申请人： Susumu Kasukabe ,  Terutaka Mori ,  Yasunori Narizuka ,  Norio Chujo

    发明人： Susumu Kasukabe ,  Terutaka Mori ,  Yasunori Narizuka ,  Norio Chujo

    IPC分类号： H01L23/48 ,  G01R31/26 ,  H01L23/58 ,  H01L29/40

    CPC分类号： G01R31/31905 ,  G01R1/0735 ,  G01R31/2874 ,  G01R31/2879 ,  G01R31/2889 ,  H01L2924/0002 ,  H01P3/081 ,  H01L2924/00

    摘要： A probe sheet or a connecting sheet with good transmission characteristics and flexibility comprising contact terminals capable of contacting at a plurality of points and in high density, without applying damages on an electrode pad which is a contact subject is provided. Further, a high-speed transmission circuit capable of designing signal wirings with aligned impedance to have wide width even with a thin insulating film is achieved to provide a probe sheet or a connecting sheet with reduced loss of high-speed transmission signals. Moreover, the transmission circuit is applied to a probe card using a probe sheet, an inspecting method of (a method of manufacturing) a semiconductor device using the same, and a connecting sheet having an excellent high-frequency characteristic.

    摘要翻译： 提供了具有良好传输特性和柔性的探针片或连接片，包括能够在多个点和高密度下接触的接触端子，而不对作为接触物体的电极焊盘施加损伤。 此外，实现了即使使用薄绝缘膜，能够设计具有均匀阻抗的宽度宽的宽度的高速传输电路，以提供具有降低的高速传输信号损失的探针片或连接片。 此外，使用探针片将传输电路应用到探针卡，使用其的制造半导体器件的制造方法的检查方法以及具有优异的高频特性的连接片。

    Manufacturing method of semiconductor integrated circuit device
    8.
    发明授权
    Manufacturing method of semiconductor integrated circuit device 失效
    半导体集成电路器件的制造方法

    公开(公告)号：US07534629B2

    公开(公告)日：2009-05-19

    申请号：US11448071

    申请日：2006-06-07

    申请人： Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Motoji Murakami ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Susumu Kasukabe

    发明人： Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Motoji Murakami ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Susumu Kasukabe

    IPC分类号： H01L21/66

    CPC分类号： G01R1/0735

    摘要： By using a membrane probe formed by using a manufacturing technique for semiconductor integrated circuit devices, the yield of probing collectively performed on a plurality of chips is to be enhanced. A probe card is formed by using a plurality of pushers, each pusher being formed of a POGO pin insulator, POGO pins, an FPC connector, a membrane probe HMS, an impact easing sheet, an impact easing plate, a chip condenser YRS and so on, wherein one or two POGO pins press a plurality of metal films arranged like islands. One or more cuts are made into what matches the chip to be tested in the area of the membrane probe in a direction substantially parallel to the extending direction of wiring electrically connected to probes formed in the membrane probe.

    摘要翻译： 通过使用通过使用半导体集成电路器件的制造技术形成的膜探针，将提高在多个芯片上共同执行的探测的产量。 通过使用多个推动器形成探针卡，每个推动器由POGO针绝缘体，POGO针，FPC连接器，膜探针HMS，冲击缓冲片，冲击缓冲板，芯片冷凝器YRS等形成 其中一个或两个POGO销按压布置成岛状的多个金属膜。 将一个或多个切口制成与膜探针区域中基本上平行于电连接到形成在膜探针中的探针的布线的延伸方向的方向匹配的待测芯片。

    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
    9.
    发明授权
    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device 失效
    探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法

    公开(公告)号：US07423439B2

    公开(公告)日：2008-09-09

    申请号：US11543021

    申请日：2006-10-05

    申请人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    发明人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0735 ,  G01R3/00

    摘要： In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.

    摘要翻译： 一种证明卡，包括：探针片，其具有与设置在晶片上的电极接触的接触端子，从接触端子引出的布线和电连接到布线的电极; 以及多层布线基板，其具有与所述探针片的电极电连接的电极，其中，所述接触端子和所述晶片的电极之间的接触由一个或多个粘合保持器建立，所述粘合保持器从所述端子组的端子组的背面 端子触点，端子组通过具有弹簧的压块与电极焊盘接触。 通过组合粘合保持器，将探针片附接到粘合保持器和多个芯片的装置同时测试。

    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
    10.
    发明申请
    Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device 失效
    探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法

    公开(公告)号：US20070103178A1

    公开(公告)日：2007-05-10

    申请号：US11543021

    申请日：2006-10-05

    申请人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    发明人： Susumu Kasukabe ,  Teruo Shoji ,  Akio Hasebe ,  Yoshinori Deguchi ,  Yasunori Narizuka

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0735 ,  G01R3/00

    摘要： In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.

    摘要翻译： 一种证明卡，包括：探针片，其具有与设置在晶片上的电极接触的接触端子，从接触端子引出的布线和电连接到布线的电极; 以及多层布线基板，其具有与所述探针片的电极电连接的电极，其中，所述接触端子和所述晶片的电极之间的接触由一个或多个粘合保持器建立，所述粘合保持器从所述端子组的端子组的背面 端子触点，端子组通过具有弹簧的压块与电极焊盘接触。 通过组合粘合保持器，将探针片附接到粘合保持器和多个芯片的装置同时测试。