Abstract:
A system, apparatus, and method for exhaust gas recirculation (EGR) is disclosed. The EGR apparatus includes an EGR circuit having an input configured to receive an exhaust gas from an engine exhaust port, an output configured to return the exhaust gas to an intake port of the engine, and an EGR path configured to circulate the exhaust gas between the input and the output. The EGR apparatus also includes an EGR compressor connected to the EGR circuit in the EGR path downstream of the input and EGR compressor configured to compress the exhaust gas for circulation to the output. The EGR apparatus further includes a valve system positioned in the EGR circuit and upstream of the EGR compressor to selectively cut off a flow of the exhaust gas to the EGR compressor and selectively inject ambient air into the EGR path.
Abstract:
A system and method for waste heat recovery in exhaust gas recirculation is disclosed. The system includes an engine having an intake manifold and an exhaust manifold, an exhaust conduit connected to the exhaust manifold, and a turbocharger having a turbine and a compressor, the turbine being connected to the exhaust conduit to receive a portion of the exhaust gas from the exhaust manifold. The system also includes an EGR system connected to the exhaust conduit to receive a portion of the exhaust gas, with the EGR system including an EGR conduit that is connected to the exhaust conduit to receive a portion of the exhaust gas, a heat exchanger connected to the EGR conduit and being configured to extract heat from the exhaust gas, and a waste heat recovery system connected to the heat exchanger and configured to capture the heat extracted by the heat exchanger.
Abstract:
A system, apparatus, and method for exhaust gas recirculation (EGR) is disclosed. The EGR apparatus includes an EGR circuit having an input configured to receive an exhaust gas from an engine exhaust port, an output configured to return the exhaust gas to an intake port of the engine, and an EGR path configured to circulate the exhaust gas between the input and the output. The EGR apparatus also includes an expansion turbine connected to the EGR circuit in the EGR path downstream of the input to receive the exhaust gas, the expansion turbine configured to expand the exhaust gas and reduce a pressure thereof. The EGR apparatus further includes an EGR compressor connected to the EGR path downstream of the expansion turbine and decoupled from the expansion turbine, the EGR compressor configured to compress the exhaust gas for circulation to the output.
Abstract:
The present application provides a wind turbine system. The wind turbine system may include a number of blades, a number of wind speed sensors positioned on the blades, a controller in communication with the wind speed sensors, and one or more performance adjustment, mechanisms in communication with the controller. The controller activates the performance adjustment mechanisms in response to the wind speed sensors.
Abstract:
The present application provides a wind turbine system. The wind turbine system may include a number of blades, a number of wind speed sensors positioned on the blades, a controller in communication with the wind speed sensors, and one or more performance adjustment, mechanisms in communication with the controller. The controller activates the performance adjustment mechanisms in response to the wind speed sensors.
Abstract:
A method and an apparatus for measuring an air flow at an airfoil surface are provided, wherein at least one pressure sensor adapted to detect an air flow associated with a rotor blade surface and a pressure transducer which converts the detected air flow into an electrical signal indicating the air flow are provided. The pressure sensor is arranged within the boundary layer of the air flow at the airfoil surface such that the boundary layer profile may be determined from the electrical signal. The air flow sensor is adapted for rotor blades of a wind turbine to assist in adjusting a pitch angle of the rotor blades.
Abstract:
The invention provides slurry-less chemical-mechanical polishing processes which are effective in planarizing oxide materials, especially siliceous oxides, even where the starting oxide layer has significant topographical variation. The processes of the invention are preferably characterized by the use of a fixed abrasive polishing element and by use of an aqueous liquid medium containing a polyelectrolyte for at least a portion of the polishing process involving reduction in the amount of topographic variation (height differential) across the oxide material on the substrate. The method reduces or eliminates the transfer of topographic variations to levels below the desired planarization level. The processes enable elimination of special endpoint detection techniques. The processes are also especially suitable for polishing interlevel dielectrics.
Abstract:
A method for polishing a dielectric layer containing silicon provides a fluorine-based inorganic compound during a polishing process. The dielectric layer is polished in the presence of the fluorine based compound to accelerate a polishing rate of the dielectric layer.
Abstract:
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
Abstract:
The invention provides slurry-less chemical-mechanical polishing processes which are effective in planarizing oxide materials, especially siliceous oxides, even where the starting oxide layer has significant topographical variation. The processes of the invention are preferably characterized by the use of a fixed abrasive polishing element and by use of an aqueous liquid medium containing a polyelectrolyte for at least a portion of the polishing process involving reduction in the amount of topographic variation (height differential) across the oxide material on the substrate. The method reduces or eliminates the transfer of topographic variations to levels below the desired planarization level. The processes enable elimination of special endpoint detection techniques. The processes are also especially suitable for polishing interlevel dielectrics.