摘要:
An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream.
摘要:
An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream.
摘要:
A compact antenna includes a main antenna patch. A first feed point and a second feed point connect with the main antenna patch to provide current in the main antenna. Excitation of the first feed point produces polarization in a first direction along the main antenna patch and excitation of the second feed point produces polarization in a second direction different from the first direction.
摘要:
A system includes a support device and an elongated spiral antenna coupled to the support device. The elongated spiral antenna has a contracted portion and an expanded portion. The expanded portion provides beam steering and directivity. The system also includes a feed line coupled to the elongated spiral antenna. A method for forming the elongated spiral antenna uses a predetermined formula to form arms of the elongated spiral antenna. The arms can be formed by printing the arms on a printed circuit board.
摘要:
A system includes a support device and an elongated spiral antenna coupled to the support device. The elongated spiral antenna has a contracted portion and an expanded portion. The expanded portion provides beam steering and directivity. The system also includes a feed line coupled to the elongated spiral antenna. A method for forming the elongated spiral antenna uses a predetermined formula to form arms of the elongated spiral antenna. The arms can be formed by printing the arms on a printed circuit board.
摘要:
Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.
摘要:
Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要:
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要:
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要:
A transceiver circuit includes a transmitter to send communication signals and a receiver to receive communication signals sent by other transmitters. The transceiver circuit also includes a switch to connect the transmitter and the receiver to at least one antenna. The switch controls at least two directions of polarization of the at least one antenna.