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    Process to open connection vias on a planarized surface
    2.
    发明申请
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号：US20070245557A1

    公开(公告)日：2007-10-25

    申请号：US11411555

    申请日：2006-04-25

    申请人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    发明人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    IPC分类号： H01K3/10

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

    摘要： A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer. The mask can then be lifted off and an electrically conductive material can be deposited into the via. Forming the via by a subtractive method rather than by a liftoff process allows the alumina to be deposited in a manner that does not result in voids. The use of reactive ion milling allows the via to be well defined and formed with substantially vertical side walls rather than in a conical or outward spreading fashion as would be formed by other material removal processes such as wet etching.

    摘要翻译： 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 在其中形成有形成有接触垫的区域形成诸如氧化铝填充层，磁性成形层等的基板。 诸如磁极和/或磁性后屏蔽的结构形成在衬底之上，并被厚层氧化铝覆盖。 可以通过在氧化铝层中不形成空隙或接缝的高沉积速率工艺来施加氧化铝。 然后可以通过化学机械抛光工艺（CMP）将氧化铝层平坦化，然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层，从而在氧化铝层中形成通孔。 然后可以将掩模剥离，并且可以将导电材料沉积到通孔中。 通过减法法而不是通过剥离工艺形成通孔允许以不会导致空隙的方式沉积氧化铝。 使用反应离子研磨允许通孔被良好地限定并且形成有基本垂直的侧壁，而不是以其它材料去除工艺（例如湿蚀刻）形成的锥形或向外扩展方式。

    Process to open connection vias on a planarized surface
    3.
    发明授权
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号：US07523550B2

    公开(公告)日：2009-04-28

    申请号：US11411555

    申请日：2006-04-25

    申请人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    发明人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    IPC分类号： H01K3/10

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

    摘要： A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

    摘要翻译： 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 诸如磁极和/或磁性后屏蔽的结构形成在衬底上并被厚层氧化铝覆盖。 然后可以通过化学机械抛光工艺（CMP）将氧化铝层平坦化，然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层，从而在氧化铝层中形成通孔。

    Thermally assisted recording head with near field transducer having integral heatsink
    7.
    发明授权
    Thermally assisted recording head with near field transducer having integral heatsink 有权
    具有集成散热片的近场传感器的热辅助记录头

    公开(公告)号：US08339739B2

    公开(公告)日：2012-12-25

    申请号：US12807296

    申请日：2010-08-31

    申请人： Hamid Balamane ,  Jordan Asher Katine ,  Neil Leslie Robertson ,  Barry Cushing Stipe

    发明人： Hamid Balamane ,  Jordan Asher Katine ,  Neil Leslie Robertson ,  Barry Cushing Stipe

    IPC分类号： G11B5/187

    CPC分类号： G11B5/314 ,  G11B5/3136 ,  G11B5/6088 ,  G11B2005/0021

    摘要： A write head structure for use with thermally assisted recording is disclosed. Improved heat sinking is provided for removing thermal energy created by a ridge aperture near field light transducer. Metal films conduct heat away from the region near the ridge aperture to the high pressure air film at the ABS between the head and media. This heat is further dissipated by the media. The metal films have varying thickness to improve lateral conductivity and may be composed of Au combined with a harder metal such as Ru to improve wear characteristics at the ABS.

    摘要翻译： 公开了一种用于热辅助记录的写头结构。 提供改进的散热用于去除由场光传感器附近的脊孔产生的热能。 金属膜将热量从脊孔附近的区域传导到头部和介质之间的ABS处的高压空气膜。 这种热量被介质进一步消散。 金属膜具有不同的厚度以改善横向导电性，并且可以由Au与诸如Ru的较硬金属组合以提高ABS的磨损特性。

    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same
    8.
    发明授权
    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same 有权
    带有近场传感器的凹槽波导的热辅助记录头及其制造方法

    公开(公告)号：US08169881B2

    公开(公告)日：2012-05-01

    申请号：US12347084

    申请日：2008-12-31

    申请人： Hamid Balamane ,  Thomas Dudley Boone, Jr. ,  Neil Leslie Robertson ,  Barry Cushing Stipe ,  Timothy Carl Strand

    发明人： Hamid Balamane ,  Thomas Dudley Boone, Jr. ,  Neil Leslie Robertson ,  Barry Cushing Stipe ,  Timothy Carl Strand

    IPC分类号： G11B7/135

    CPC分类号： G11B5/3163 ,  G11B5/314 ,  G11B5/6088 ,  G11B2005/0021

    摘要： According to one embodiment, an apparatus includes a near field transducer comprising a conductive metal film having a main body and a ridge extending from the main body and an optical waveguide for illumination of the near field transducer, a light guiding core layer of the optical waveguide being spaced from the near field transducer by less than about 100 nanometers and greater than 0 nanometers. In another embodiment, a method includes forming a near field transducer structure and removing a portion of the near field transducer structure. The method also includes forming a cladding layer adjacent a remaining portion of the near field transducer structure, wherein a portion of the cladding layer extends along the remaining portion of the near field transducer structure and forming a core layer above the cladding layer. Other apparatuses and methods are also included in the invention.

    摘要翻译： 根据一个实施例，一种装置包括近场换能器，其包括具有主体和从主体延伸的脊的导电金属膜和用于照射近场换能器的光波导，光波导的导光芯层 与近场传感器间隔小于约100纳米且大于0纳米。 在另一实施例中，一种方法包括形成近场换能器结构并去除近场换能器结构的一部分。 该方法还包括在近场换能器结构的剩余部分附近形成包覆层，其中包层的一部分沿着近场换能器结构的剩余部分延伸并在包层上方形成芯层。 本发明还包括其他装置和方法。

    Method of laser cutting a metal line on an MR head with a laser
    10.
    发明授权
    Method of laser cutting a metal line on an MR head with a laser 失效
    用激光切割MR头上的金属线的方法

    公开(公告)号：US06049056A

    公开(公告)日：2000-04-11

    申请号：US4693

    申请日：1998-01-08

    申请人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    发明人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    IPC分类号： B23K26/40 ,  B23K26/08

    CPC分类号： B23K26/40 ,  B23K26/362 ,  B23K2203/26 ,  B23K2203/50 ,  Y10T29/49032

    摘要： A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line. The method traverses minimum energy, short laser pulses at a high pulse rate across the line, the melted material withdrawing from the melted area and being heaped on top of adjacent portions of the delete pad by surface tension and the melted material cooling to room temperature before the next pulse so that there is no cumulative heating and therefore no damage to or debris from the underlying structure. The conductive material of the line is incrementally plowed to each side of a severed path by successive overlapping laser pulses so that when the series of laser pulses has traversed the width of the delete pad the conductive line has been severed.

    摘要翻译： 在MR头上的MR焊盘之间形成薄膜导电线，用于在磁头堆叠组件与磁盘堆叠组件合并之前的组装步骤期间保护MR传感器免受静电放电（ESD）的影响。 导线可以具有减小的厚度删除焊盘。 激光束具有足够的能量来切断在删除焊盘处的导线，但是不足以损坏或者导致来自导电线下面或周围的结构的碎屑被切断导线。 该方法穿过线路以高脉冲速度穿过最小能量，短激光脉冲，熔化的材料从熔化区域退出，并通过表面张力堆积在删除焊盘的相邻部分的顶部，并将熔融的材料冷却至室温 下一个脉冲，使得没有累积加热，因此没有来自底层结构的损坏或碎屑。 线的导电材料通过连续重叠的激光脉冲逐渐地被切割到切断路径的每一侧，使得当一系列激光脉冲已经穿过删除焊盘的宽度时，导线已被切断。