公开(公告)号：US09818684B2

公开(公告)日：2017-11-14

申请号：US15066724

申请日：2016-03-10

申请人： Amkor Technology, Inc.

发明人： David Hiner ,  Michael Kelly ,  Ronald Huemoeller ,  Young Rae Kim ,  JiYoung Chung ,  MinHo Chang ,  DoHyun Na

IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2224/81 ,  H01L2224/83

摘要： A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. Also for example, various aspects of the present disclosure provide a method of manufacturing a semiconductor device comprising such an interposer die.

公开(公告)号：US09543242B1

公开(公告)日：2017-01-10

申请号：US14823689

申请日：2015-08-11

申请人： Amkor Technology, Inc.

发明人： Michael Kelly ,  David Hiner ,  Ronald Huemoeller ,  Roger St. Amand

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L25/07

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/071 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

摘要翻译： 半导体器件结构和制造半导体器件的方法。 作为非限制性示例，本公开的各个方面提供了包括薄细间距再分布结构的各种半导体封装结构及其制造方法。

公开(公告)号：US20190189552A1

公开(公告)日：2019-06-20

申请号：US16260674

申请日：2019-01-29

申请人： Amkor Technology, Inc.

发明人： Michael Kelly ,  David Hiner ,  Ronald Huemoeller ,  Roger St. Amand

IPC分类号： H01L23/498 ,  H01L21/683 ,  H01L23/31 ,  H01L21/48 ,  H01L25/07

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/071 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

公开(公告)号：US10192816B2

公开(公告)日：2019-01-29

申请号：US15854095

申请日：2017-12-26

申请人： Amkor Technology, Inc.

发明人： Michael Kelly ,  David Hiner ,  Ronald Huemoeller ,  Roger St. Amand

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L25/07

摘要： A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

公开(公告)号：US20180240744A1

公开(公告)日：2018-08-23

申请号：US15854095

申请日：2017-12-26

申请人： Amkor Technology, Inc.

发明人： Michael Kelly ,  David Hiner ,  Ronald Huemoeller ,  Roger St. Amand

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L25/07 ,  H01L21/683 ,  H01L21/48

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/071 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

公开(公告)号：US20180005987A1

公开(公告)日：2018-01-04

申请号：US15707646

申请日：2017-09-18

申请人： Amkor Technology, Inc.

发明人： David Hiner ,  Michael Kelly ,  Ronald Huemoeller

IPC分类号： H01L25/065 ,  H01L21/56 ,  H01L25/00 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/92244 ,  H01L2224/95001 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

公开(公告)号：US10784232B2

公开(公告)日：2020-09-22

申请号：US16700592

申请日：2019-12-02

申请人： Amkor Technology, Inc.

发明人： David Hiner ,  Michael Kelly ,  Ronald Huemoeller

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L25/00 ,  H01L23/498 ,  H01L21/48

摘要： A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

公开(公告)号：US20170263544A1

公开(公告)日：2017-09-14

申请号：US15066724

申请日：2016-03-10

申请人： Amkor Technology, Inc.

发明人： David Hiner ,  Michael Kelly ,  Ronald Huemoeller ,  Young Rae Kim ,  JiYoung Chung ,  MinHo Chang ,  DoHyun Na

IPC分类号： H01L23/498 ,  H01L23/31

CPC分类号： H01L23/3107 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2224/81 ,  H01L2224/83

摘要： A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. Also for example, various aspects of the present disclosure provide a method of manufacturing a semiconductor device comprising such an interposer die.

公开(公告)号：US09653428B1

公开(公告)日：2017-05-16

申请号：US15207186

申请日：2016-07-11

申请人： Amkor Technology, Inc.

发明人： David Hiner ,  Michael Kelly ,  Ronald Huemoeller

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L25/0655 ,  H01L21/563 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/95001 ,  H01L2224/97

摘要： A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

公开(公告)号：US10943858B2

公开(公告)日：2021-03-09

申请号：US16260674

申请日：2019-01-29

申请人： Amkor Technology, Inc.

发明人： Michael Kelly ,  David Hiner ,  Ronald Huemoeller ,  Roger St. Amand

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L25/07

摘要： A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.