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    Modular probe card
    2.
    发明授权
    Modular probe card 有权
    模块式探针卡

    公开(公告)号：US07372286B2

    公开(公告)日：2008-05-13

    申请号：US11322408

    申请日：2006-01-03

    申请人： Yi-Chang Lee ,  An-Hong Liu ,  Hsiang-Ming Huang ,  Yao-Jung Lee ,  Yeong-Her Wang

    发明人： Yi-Chang Lee ,  An-Hong Liu ,  Hsiang-Ming Huang ,  Yao-Jung Lee ,  Yeong-Her Wang

    IPC分类号： G01R1/073

    CPC分类号： G01R1/07378

    摘要： A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.

    摘要翻译： 模块化探针卡包括印刷电路板，插入件和探针头，其中印刷电路板具有多个第一接触焊盘，探头具有多个第二接触焊盘。 插入器设置在印刷电路板和探针头之间，其中插入器包括基板和多个弹簧销。 基板具有从第一表面到第二表面的第一表面，第二表面和多个通孔。 弹簧销固定在基板的通孔中。 每个弹簧销具有第一接触点，第二接触点和它们之间的弹簧，由此第一接触点从第一表面弹性挤出以接触第一接触垫，并且第二接触点从 第二表面接触第二接触焊盘，以便克服印刷电路板和探针头之间通过插入器的不良电连接，因为印刷电路板的第一接触焊盘的共面性差。

    Modularized probe card for high frequency probing
    3.
    发明授权
    Modularized probe card for high frequency probing 有权
    用于高频探测的模块化探头卡

    公开(公告)号：US07088118B2

    公开(公告)日：2006-08-08

    申请号：US11011200

    申请日：2004-12-15

    申请人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

    发明人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2889 ,  G01R1/07378 ,  G01R31/2822

    摘要： A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.

    摘要翻译： 提供了一种用于高频探测的模块化探头。 探头主要包括探头，安装板和探头与安装板之间的插入件。 探头在其后表面上具有多个空腔。 多个去耦组件安装在空腔内，并通过旁通电路电耦合到探头的接地/电源电路。 插入器具有对应于探针头的后表面的底面，并且在底面上包括多个接触端。 一些接触端与去耦组件电接触并电耦合到安装板的接地平面。

    Modularized probe head
    4.
    发明申请
    Modularized probe head 有权
    模块化探头

    公开(公告)号：US20060125501A1

    公开(公告)日：2006-06-15

    申请号：US11011104

    申请日：2004-12-15

    申请人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

    发明人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2889 ,  G01R1/07314 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09481 ,  H05K2201/10378

    摘要： A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.

    摘要翻译： 模块化探头头组件主要包括探针头，插入器和带引导针的探针头托架。 探头具有多个第一通孔。 插入器具有与位于第一通孔对应的多个第二通孔。 探针头托架被配置为固定探针卡的PCB并将探头与插入器连接。 通孔形成在插入件上的垫下方。 在该垫上形成多个柱状凸块。 在组装探针卡之后，引导销通过第一通孔和第二通孔，柱形凸块与探针头的互连焊盘电接触。

    PROBE CARD ASSEMBLY
    5.
    发明申请
    PROBE CARD ASSEMBLY 有权
    探索卡大会

    公开(公告)号：US20050012513A1

    公开(公告)日：2005-01-20

    申请号：US10620448

    申请日：2003-07-17

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： G01R1/073 ,  G01R1/18 ,  G01R31/28 ,  G01R31/02

    CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/18 ,  G01R31/2889

    摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

    摘要翻译： 公开了一种探针卡组件。 探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。 多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。 下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。 在探针头托架的中心处形成一个凹陷。 然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

    Modular probe card assembly
    6.
    发明授权
    Modular probe card assembly 失效
    模块化探头卡组合

    公开(公告)号：US06621710B1

    公开(公告)日：2003-09-16

    申请号：US10198118

    申请日：2002-07-19

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： H01R900

    CPC分类号： H01R13/22 ,  H01R2201/20

    摘要： A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.

    摘要翻译： 模块化探针卡组件包括具有模块地组装在主板上的探针的硅衬底。 至少一个插座安装在硅衬底周围，并通过柔性印刷布线膜电连接到探针上。 多个可拆卸的同轴线将插座与主板电连接以实现制造期间的连接路径的变化。 因此，探针卡组件具有可调节的修正效果，适用于高速测试。

    Modular probe card
    7.
    发明申请
    Modular probe card 有权
    模块式探针卡

    公开(公告)号：US20070152689A1

    公开(公告)日：2007-07-05

    申请号：US11322408

    申请日：2006-01-03

    申请人： Yi-Chang Lee ,  An-Hong Liu ,  Hsiang-Ming Huang ,  Yao-Jung Lee ,  Yeong-Her Wang

    发明人： Yi-Chang Lee ,  An-Hong Liu ,  Hsiang-Ming Huang ,  Yao-Jung Lee ,  Yeong-Her Wang

    IPC分类号： G01R31/02

    CPC分类号： G01R1/07378

    摘要： A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.

    摘要翻译： 模块化探针卡包括印刷电路板，插入件和探针头，其中印刷电路板具有多个第一接触焊盘，探头具有多个第二接触焊盘。 插入器设置在印刷电路板和探针头之间，其中插入器包括基板和多个弹簧销。 基板具有从第一表面到第二表面的第一表面，第二表面和多个通孔。 弹簧销固定在基板的通孔中。 每个弹簧销具有第一接触点，第二接触点和它们之间的弹簧，由此第一接触点从第一表面弹性挤出以接触第一接触垫，并且第二接触点从 第二表面接触第二接触焊盘，以便克服印刷电路板和探针头之间通过插入器的不良电连接，因为印刷电路板的第一接触焊盘的共面性差。

    Probe card interposer
    8.
    发明申请
    Probe card interposer 审中-公开
    探头卡插件

    公开(公告)号：US20060091510A1

    公开(公告)日：2006-05-04

    申请号：US11076935

    申请日：2005-03-11

    申请人： An-Hong Liu ,  Yeong-Her Wang ,  Yao-Jung Lee

    发明人： An-Hong Liu ,  Yeong-Her Wang ,  Yao-Jung Lee

    IPC分类号： H01L23/02

    CPC分类号： G01R31/2889 ,  G01R1/0416 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09909 ,  H05K2201/10378

    摘要： A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of conductive leads. The suspended ends of the conductive wires extend toward the centers of the corresponding dielectric cores and are elastically supported by the corresponding dielectric cores. Therefore, the interposer can be installed between a probe head and a multi-layer PCB to make good electrical contacts to the probe head through the conductive bumps. In the embodiment, a plurality of symmetric conductive bumps are disposed on second surface of the substrate and are electrically connected to the conductive bumps on first surface of the substrate through vias or conductive posts. The conductive bumps can electrically contact the multi-layer PCB.

    摘要翻译： 探针卡插入件包括具有设置在基板的第一表面上的多个导电凸块的基板。 每个导电凸块包括介质芯和多个导电引线。 导线的悬挂端部朝向相应介质芯的中心延伸，并被相应的介质芯片弹性地支撑。 因此，插入器可以安装在探针头和多层PCB之间，以通过导电凸块与探头头形成良好的电接触。 在本实施例中，多个对称导电凸块设置在基板的第二表面上，并且通过通孔或导电柱与基板的第一表面上的导电凸块电连接。 导电凸块可以电接触多层PCB。

    Probe card assembly
    9.
    发明授权
    Probe card assembly 有权
    探头卡组合

    公开(公告)号：US06853205B1

    公开(公告)日：2005-02-08

    申请号：US10620448

    申请日：2003-07-17

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： G01R1/073 ,  G01R1/18 ,  G01R31/28 ,  G01R31/02

    CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/18 ,  G01R31/2889

    摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

    摘要翻译： 公开了一种探针卡组件。 探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。 多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。 下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。 在探针头托架的中心处形成一个凹陷。 然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。