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1.发明授权Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher 失效控制线性抛光机的基板表面的化学机械抛光速率
公开(公告)号：US5916012A
公开(公告)日：1999-06-29
申请号：US882658
申请日：1997-06-25
摘要： A technique for controlling a polishing rate across a substrate surface when performing CMP, in order to obtain uniform polishing of the substrate surface. A support housing which underlies a polishing pad includes a plurality of openings for dispensing a pressurized fluid. The openings are arranged into a pre-configured pattern for dispensing the fluid to the underside of the pad opposite the substrate surface being polished. The openings are configured into a number of groupings, in which a separate channel is used for each grouping so that fluid pressure for each group of openings can be separately and independently controlled.
摘要翻译： 一种用于在进行CMP时控制衬底表面的抛光速率的技术，以便获得衬底表面的均匀抛光。 在抛光垫下面的支撑壳体包括用于分配加压流体的多个开口。 开口被布置成预先配置的图案，用于将流体分配到衬垫的与待抛光的衬底表面相对的底面。 开口被配置成多个分组，其中每个分组使用单独的通道，使得每组开口的流体压力可以单独和独立地控制。
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2.发明授权Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing 失效用于对准和张紧用于化学机械抛光的线性平面化中的垫/带的方法和装置
公开(公告)号：US5871390A
公开(公告)日：1999-02-16
申请号：US795880
申请日：1997-02-06
摘要： The present invention describes an apparatus and method for aligning a pad/belt on a roller for use in chemical mechanical polishing using linear planarization. The present invention comprises an alignment sensor that senses the alignment of the pad/belt. The present invention additionally comprises a tensioner that tensions the pad/belt on the roller. And, a controller that controls the alignment of the pad/belt on the roller by controlling the tensioner.
摘要翻译： 本发明描述了一种用于使用线性平面化在化学机械抛光中使用的辊上的衬垫/带对准的装置和方法。 本发明包括一种检测垫/皮带对准的对准传感器。 本发明另外包括一张紧器，该张紧器使滚筒上的垫/皮带张紧。 而且，控制器通过控制张紧器来控制滚筒上的垫/皮带对准。
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公开(公告)号：US5762536A
公开(公告)日：1998-06-09
申请号：US797470
申请日：1997-02-06
摘要： A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information from the sensors are processed in order to provide feedback for compensating the fluid dispensing when fluid platens are used and/or the downforce exerted by the wafer carrier.
摘要翻译： 当使用线性抛光机抛光晶片时，利用传感器来监测半导体晶片的抛光的技术。 传感器沿着表面分布或耦合到沿着表面的开口以监测正在进行的抛光过程。 对来自传感器的感测信息进行处理，以便在使用流体压板和/或由晶片载体施加的下压力时提供用于补偿流体分配的反馈。
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4.发明授权
公开(公告)号：US5635083A
公开(公告)日：1997-06-03
申请号：US467546
申请日：1995-06-06
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/306 , H01L21/3105 , H01L21/321
CPC分类号： H01L21/3212 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/31053
摘要： A novel method and apparatus for uniformly polishing thin films formed on a semiconductor substrate. A substrate is placed face down on a moving polishing pad so that the thin film to be polished is placed in direct contact with the moving polishing pad. The substrate is forcibly pressed against the polishing pad with pneumatic or hydraulic pressure applied to the backside of the substrate during polishing. Additionally, a wear ring is placed on the polishing pad around and adjacent to the substrate and forcibly pressed onto the polishing pad with a downward pressure from a second source so that the wear ring is coplanar with the substrate in order to eliminate edge rounding effects.
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公开(公告)号：US5216843A
公开(公告)日：1993-06-08
申请号：US950812
申请日：1992-09-24
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , H01L21/304
CPC分类号： B24B53/017 , B24B37/26
摘要： An improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad.
摘要翻译： 用于抛光形成在半导体衬底上的薄膜的改进的设备包括被抛光垫覆盖的可旋转工作台。 然后，桌子和衬垫相对于在抛光过程中被压向衬垫表面的衬底旋转。 提供了用于在衬底被抛光时在衬垫中产生多个凹槽的装置。 连续形成的凹槽有助于通过在衬底和衬垫之间引导浆料来促进抛光过程。
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公开(公告)号：US6083089A
公开(公告)日：2000-07-04
申请号：US909348
申请日：1997-08-11
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/306 , H01L21/3105 , H01L21/321 , B24B5/00
CPC分类号： H01L21/3212 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/31053
摘要： A novel method and apparatus for uniformly polishing thin films formed on a semiconductor substrate. A substrate is placed face down on a moving polishing pad so that the thin film to be polished is placed in direct contact with the moving polishing pad. The substrate is forcibly pressed against the polishing pad with pneumatic or hydraulic pressure applied to the backside of the substrate during polishing. Additionally, a wear ring is placed on the polishing pad around and adjacent to the substrate and forcibly pressed onto the polishing pad with a downward pressure from a second source so that the wear ring is coplanar with the substrate in order to eliminate edge rounding effects.
摘要翻译： 一种用于均匀研磨形成在半导体衬底上的薄膜的新方法和装置。 将基板面朝下放置在移动的抛光垫上，使得待抛光的薄膜与移动的抛光垫直接接触。 在抛光期间，基板被强制地压在抛光垫上，气压或液压施加到基板的背面。 此外，磨损环被放置在抛光垫周围并且与基底相邻并且以来自第二源的向下的压力被强制地压在抛光垫上，使得磨损环与基底共面以消除边缘圆化效应。
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公开(公告)号：US5212910A
公开(公告)日：1993-05-25
申请号：US727829
申请日：1991-07-09
IPC分类号： B24B37/22 , B24B37/26 , H01L21/304
摘要： An improved composite polishing pad includes a first layer of elastic material, a second, stiff layer and a third layer optimized for slurry transport. This third layer is the layer against which the wafer makes contact during the polishing process. The second layer is segmented into individual sections physically isolated from one another in the lateral dimension. Each segmented section is resilient across its width yet cushioned by the first layer in the vertical direction. The physical isolation of each section combined with the cushioning of the first layer of material create a sort of "bedspring" effect which enables the pad to conform to longitudinal gradations across the wafer.
摘要翻译： 改进的复合抛光垫包括第一层弹性材料，第二刚性层和为泥浆输送而优化的第三层。 该第三层是在抛光过程中晶片接触的层。 第二层被分割为在横向尺寸上彼此物理隔离的单个部分。 每个分段部分在其宽度上是弹性的，并且在垂直方向上被第一层缓冲。 每个部分的物理隔离结合第一层材料的缓冲产生一种“床弹簧”效应，使得垫片能够顺应晶片上的纵向灰度。
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公开(公告)号：US6095904A
公开(公告)日：2000-08-01
申请号：US595182
申请日：1996-02-01
申请人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
发明人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
CPC分类号： B24B37/105 , B24B37/26 , B24B57/02
摘要： A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
摘要翻译： 一种用于抛光形成在半导体衬底上的薄膜的方法和设备。 用抛光垫覆盖的工作台围绕一个轴线旋转。 浆料通过穿过抛光垫形成的多个间隔开的孔进料，以在抛光期间均匀地分布浆料穿过垫表面。 衬底被向下压靠在轨道垫的表面上并且被旋转以促进与浆料一起对形成在衬底上的薄膜的抛光。
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9.发明授权Orbital motion chemical-mechanical polishing apparatus and method of fabrication 失效轨道运动化学机械抛光装置及其制造方法
公开(公告)号：US5554064A
公开(公告)日：1996-09-10
申请号：US103412
申请日：1993-08-06
申请人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
发明人： Joseph R. Breivogel , Samuel F. Louke , Michael R. Oliver , Leopoldo D. Yau , Christopher E. Barns
CPC分类号： B24B37/105 , B24B37/26 , B24B57/02
摘要： A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
摘要翻译： 一种用于抛光形成在半导体衬底上的薄膜的方法和设备。 用抛光垫覆盖的工作台围绕一个轴线旋转。 浆料通过穿过抛光垫形成的多个间隔开的孔进料，以在抛光期间均匀地分布浆料穿过垫表面。 衬底被向下压靠在轨道垫的表面上并且被旋转以促进与浆料一起对形成在衬底上的薄膜的抛光。
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公开(公告)号：US5547417A
公开(公告)日：1996-08-20
申请号：US210957
申请日：1994-03-21
IPC分类号： B24B53/007 , B24B53/017 , B24B53/00
CPC分类号： B24B53/017
摘要： A method of polishing a thin film formed on a semiconductor substrate. In a method of the present invention a polishing pad is rotated. A substrate is pressed against the rotating polishing pad so that the thin film to be polished is placed in direct contact with the polishing pad. During polishing, the polishing pad is continually conditioned by forming a plurality of grooves into the polishing pad. The grooves are formed by a conditioning block having a substantially planar bottom surface with a plurality of groove generating points extending from the substantially planar surface of the conditioning block. The grooves are generated by sweeping and rotating the conditioning block between an outer radius and an inner radius of the polishing pad.
摘要翻译： 一种抛光形成在半导体衬底上的薄膜的方法。 在本发明的方法中，抛光垫旋转。 将衬底压靠在旋转的抛光垫上，使待抛光的薄膜与抛光垫直接接触。 在抛光期间，通过在抛光垫中形成多个凹槽来不断地调节抛光垫。 凹槽由具有基本平坦的底表面的调节块形成，多个凹槽产生点从调节块的基本平坦的表面延伸。 通过在抛光垫的外半径和内半径之间扫掠并旋转调节块来产生凹槽。
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