MULTI-WAVELENGTH LASER-SCRIBING TOOL
    1.
    发明申请
    MULTI-WAVELENGTH LASER-SCRIBING TOOL 审中-公开
    多波长激光切割工具

    公开(公告)号:US20110139755A1

    公开(公告)日:2011-06-16

    申请号:US12939137

    申请日:2010-11-03

    IPC分类号: B23K26/00

    摘要: Multi-wavelength laser-scribing systems are disclosed. A system for scribing a workpiece includes a frame, a translation stage coupled with the frame to support the workpiece and translate the supported workpiece relative to the frame in a longitudinal direction, at least one laser operable to generate a first output having a first wavelength and generate a second output having a second wavelength, and at least one scanning device coupled with the frame and operable to control a position of the first and second outputs. Each of the first and second outputs are able to remove material from at least a portion of the workpiece. Laser assemblies that each include a laser and at least one scanning device can be arranged in rows to enhance the rate at which latitudinal scribe lines are formed.

    摘要翻译: 公开了多波长激光划线系统。 用于对工件进行划线的系统包括框架,与框架联接以支撑工件并沿着纵向方向平移所支撑的工件相对于框架的平移台,可操作以产生具有第一波长的第一输出的至少一个激光器,以及 产生具有第二波长的第二输出,以及至少一个与所述帧耦合的扫描装置,并可操作以控制所述第一和第二输出的位置。 第一和第二输出中的每一个能够从工件的至少一部分移除材料。 每个包括激光器和至少一个扫描装置的激光组件可以排列成行以增加形成纬线划线的速率。

    IN-LINE METROLOGY METHODS AND SYSTEMS FOR SOLAR CELL FABRICATION
    2.
    发明申请
    IN-LINE METROLOGY METHODS AND SYSTEMS FOR SOLAR CELL FABRICATION 审中-公开
    用于太阳能电池制造的在线计量方法和系统

    公开(公告)号:US20110198322A1

    公开(公告)日:2011-08-18

    申请号:US12851471

    申请日:2010-08-05

    IPC分类号: B23K26/00 G01J1/42 H04N7/18

    摘要: In-line metrology methods and systems for use with laser-scribing systems used in solar-cell fabrication are disclosed. Such methods and systems can involve a variety of components, for example, a device for measuring the amount of power input to a laser, a power meter for measuring laser output power, a beam viewer for measuring aspects of a laser beam, a height sensor for measuring a workpiece height, a microscope for measuring workpiece features formed by the laser-scribing system, and a system for monitoring a laser-scribing system and annunciating a warning(s) and/or an error message(s) when operational limits are exceeded. In-line metrology methods can also include the processing of output beam reflections so as to track beam drift over time and/or provide for focusing of an imaging device.

    摘要翻译: 公开了用于太阳能电池制造中使用的激光划线系统的在线测量方法和系统。 这样的方法和系统可以涉及各种部件,例如,用于测量激光输入功率的装置,用于测量激光输出功率的功率计,用于测量激光束的方面的光束观察器,高度传感器 用于测量工件高度的显微镜,用于测量由激光划线系统形成的工件特征的显微镜,以及用于监视激光划线系统的系统,并且当操作限度为...时,发出警告和/或错误消息 超过了 在线测量方法还可以包括输出光束反射的处理,以便随时间跟踪光束漂移和/或提供成像装置的聚焦。

    LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING
    3.
    发明申请
    LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING 审中-公开
    激光模块和薄膜太阳能电池板激光扫描的工艺

    公开(公告)号:US20110132884A1

    公开(公告)日:2011-06-09

    申请号:US12851442

    申请日:2010-08-05

    IPC分类号: B23K26/00

    摘要: Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.

    摘要翻译: 提供激光划线的激光系统。 该系统包括通过电缆耦合到激光模块的远程模块。 远程模块包括控制器和冷却器。 激光模块至少具有激光源和冷却板。 激光模块可操作以从工件的至少一部分去除材料。 该系统还包括通过多根光纤耦合到激光模块的多个端接模块。 每个终端模块包括机械接口。 机械接口耦合到相应的光纤。 该系统还包括可操作以控制来自激光器的输出位置的多个扫描装置。 每个扫描装置耦合到相应的机械接口。

    LASER PROCESSING SYSTEM WITH VARIABLE BEAM SPOT SIZE
    5.
    发明申请
    LASER PROCESSING SYSTEM WITH VARIABLE BEAM SPOT SIZE 审中-公开
    具有可变光束尺寸的激光加工系统

    公开(公告)号:US20110253685A1

    公开(公告)日:2011-10-20

    申请号:US13076422

    申请日:2011-03-30

    IPC分类号: B23K26/00

    摘要: Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece, a beam expander positioned along a path of the laser output and having a motorized mechanism operable to vary a beam expansion ratio applied to the laser output, and at least one scanning device coupled with the frame and operable to control a position of the laser output, after expansion, on the workpiece. The motorized beam expander can be used to selectively vary the width of a laser beam supplied to a scanning device so as to selectively vary the size of the laser beam incident on the workpiece. Alternatively, a variable aperture can be used instead of a beam expander.

    摘要翻译: 用于对工件进行划线的系统包括电动束扩张器以改变入射在工件上的激光束斑点尺寸。 一种系统包括框架,激光器与框架耦合并且产生输出以从工件的至少一部分移除材料;沿着激光输出路径定位的光束扩展器,并具有可操作以改变光束膨胀的电动机构 以及至少一个与框架耦合的扫描装置,并可操作以控制激光输出在膨胀之后在工件上的位置。 电动光束扩展器可以用于选择性地改变提供给扫描装置的激光束的宽度,以便选择性地改变入射在工件上的激光束的尺寸。 或者,可以使用可变光圈来代替光束扩展器。

    LASER-SCRIBING TOOL ARCHITECTURE
    6.
    发明申请
    LASER-SCRIBING TOOL ARCHITECTURE 审中-公开
    激光切割工具架构

    公开(公告)号:US20100252543A1

    公开(公告)日:2010-10-07

    申请号:US12621316

    申请日:2009-11-18

    IPC分类号: B23K26/00

    CPC分类号: B23K26/082 B23K26/702

    摘要: The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture coupled with the frame, a second fixture coupled with the frame, a laser operable to generate output able to remove material from at least a portion of the workpiece, and a scanning device coupled with the laser and the frame. The first fixture is configured for engagement with a first portion of the workpiece. The second fixture is configured for engagement with a second portion of the workpiece. When the workpiece is engaged by the first and second fixtures the workpiece is substantially vertically oriented. The scanning device is operable to control a position of the output from the laser relative to the workpiece.

    摘要翻译: 本公开涉及用于激光划线垂直取向的工件的装置和系统。 在许多实施例中,激光划线设备包括框架,与框架连接的第一固定件,与框架连接的第二固定件,可操作以产生能够从工件的至少一部分移除材料的激光器,以及 与激光和框架耦合的扫描装置。 第一夹具构造成与工件的第一部分接合。 第二夹具被构造成与工件的第二部分接合。 当工件被第一和第二固定件接合时,工件基本上垂直定向。 扫描装置可操作以控制来自激光器的输出相对于工件的位置。

    IN-SITU MONITORING FOR LASER ABLATION
    7.
    发明申请
    IN-SITU MONITORING FOR LASER ABLATION 审中-公开
    用于激光雷射的现场监测

    公开(公告)号:US20090314752A1

    公开(公告)日:2009-12-24

    申请号:US12430345

    申请日:2009-04-27

    IPC分类号: B23K26/03 B23K26/38

    摘要: In a system where scribe lines are formed by a series of partially-overlapping ablation spots, discontinuities can be detected by capturing an intensity of light generated during each instance of ablation for a respective spot. In any instance where the intensity of light given off falls below a desired threshold, such that the ablation spot might not sufficiently overlap any adjacent spot, the position of that instance can be captured such that another attempt at ablation can be carried out at that location.

    摘要翻译: 在通过一系列部分重叠的消融点形成划痕线的系统中,可以通过捕获在相应斑点的每次消融期间产生的光的强度来检测不连续性。 在任何情况下,发出的光的强度都低于期望的阈值,使得消融点可能不会与任何相邻的斑点充分重叠,可以捕获该实例的位置,从而可以在该位置进行另一次消融尝试 。

    CMP pad thickness and profile monitoring system
    8.
    发明授权
    CMP pad thickness and profile monitoring system 有权
    CMP垫厚度和型材监控系统

    公开(公告)号:US08043870B2

    公开(公告)日:2011-10-25

    申请号:US12437897

    申请日:2009-05-08

    IPC分类号: H01L21/00

    摘要: In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

    摘要翻译: 在一个实施例中,提供了一种用于维持基板处理表面的方法。 该方法通常包括在衬底处理表面上执行一组测量,其中使用耦合到处理表面调节臂的位移传感器获取测量集合,基于该组测量确定处理表面轮廓,将处理表面 简档到最小配置文件阈值,并传达配置文件比较的结果。

    CMP PAD THICKNESS AND PROFILE MONITORING SYSTEM
    9.
    发明申请
    CMP PAD THICKNESS AND PROFILE MONITORING SYSTEM 有权
    CMP PAD厚度和型材监控系统

    公开(公告)号:US20090280580A1

    公开(公告)日:2009-11-12

    申请号:US12437897

    申请日:2009-05-08

    IPC分类号: H01L21/66 B24B49/02 B24B49/10

    摘要: In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

    摘要翻译: 在一个实施例中,提供了一种用于维持基板处理表面的方法。 该方法通常包括在衬底处理表面上执行一组测量,其中使用耦合到处理表面调节臂的位移传感器获取测量集合,基于该组测量确定处理表面轮廓,将处理表面 简档到最小配置文件阈值,并传达配置文件比较的结果。