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公开(公告)号:US20160093837A1
公开(公告)日:2016-03-31
申请号:US14870996
申请日:2015-09-30
Applicant: Apple Inc.
Inventor: Tyler S. Bushnell , Charles W. Werley , John Chan , Loren L. Roy , Richard M. Mank , Xiaoyun Hu
IPC: H01M2/02 , H01M10/0525 , H01M10/04
CPC classification number: H01M2/0202 , H01M2/0287 , H01M10/049 , H01M10/0525 , H01M2220/30
Abstract: The present disclosure discloses a battery pouch that includes a cavity. The battery pouch also includes a first transition between a first side of the battery pouch and a second side of the battery pouch. The first side of the battery pouch includes a first sealed portion having a minimum threshold distance between the cavity and the edge of the battery pouch. More specifically, the first sealed portion is located between a first outer edge of the cavity and a first outer edge of the battery pouch. The battery pouch also includes a second side having a second sealed portion with minimum threshold distance. Other embodiments are also described and claimed.
Abstract translation: 本公开公开了一种包括空腔的电池袋。 电池袋还包括在电池袋的第一侧和电池袋的第二侧之间的第一过渡。 电池袋的第一侧包括第一密封部分,其具有腔和电池袋的边缘之间的最小阈值距离。 更具体地,第一密封部分位于空腔的第一外边缘和电池袋的第一外边缘之间。 电池袋还包括具有最小阈值距离的第二密封部分的第二侧。 还描述和要求保护其他实施例。
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2.
公开(公告)号:US20150243937A1
公开(公告)日:2015-08-27
申请号:US14712024
申请日:2015-05-14
Applicant: Apple Inc.
Inventor: Richard Hung Minh Dinh , Richard P. Howarth , Peggy J. Jensen , John Chan , Patrick Kwok-Yeung Ng
CPC classification number: H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
Abstract translation: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 散热片和其他导热结构可用于去除多余的部件热量。 也可以在电子设备中提供结构以检测湿气。 集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。
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