-
公开(公告)号：US20180053731A1
公开(公告)日：2018-02-22
申请号：US15241665
申请日：2016-08-19
申请人： Apple Inc.
IPC分类号： H01L23/552 , H01L21/56 , H01L23/29
CPC分类号： H01L23/552 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L25/0655 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K9/0024 , H05K9/0045
摘要： A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
-
公开(公告)号：US11792516B1
公开(公告)日：2023-10-17
申请号：US17675666
申请日：2022-02-18
申请人： Apple Inc.
发明人： Himesh Patel , Kai Min , Phillip R. Sommer
IPC分类号： H04N23/68 , H02K11/02 , H02K41/035 , H04N23/54 , H04N23/55
CPC分类号： H04N23/687 , H02K11/02 , H02K41/0356 , H04N23/54 , H04N23/55
摘要： Various embodiments include flex circuit arrangements for a camera with sensor shift actuation. Some embodiments include a flexure-circuit hybrid structure. Some embodiments include an actuation-module flex circuit hybrid structure. In some embodiments, the hybrid structures may include different portions that share multiple layers of a plurality of stacked layers. In some embodiments, one portion of a hybrid structure may include one or more layers that are different from the layers in another portion of the hybrid structure.
-
公开(公告)号：US11582389B2
公开(公告)日：2023-02-14
申请号：US17398956
申请日：2021-08-10
申请人： Apple Inc.
发明人： Phillip R. Sommer
摘要： A camera may include at least one suspension assembly as part of optical image stabilization and/or autofocus systems of the camera. The suspension assembly may include an inner frame, an outer frame, and one or more flexure arms. Electrical traces may be deposited at both sides of the suspension assembly. A connection may be created, for electrical traces at the different sides of the suspension assembly, through the suspension assembly by removing (e.g., using an etching process) one or more parts in the body of the suspension assembly to create one or more cavities. A remaining part of the suspension assembly surrounded (and thus isolated) by the cavities may thus form at least a part of the connection for the electrical traces. The connection may further include one or more filled trenches connecting the electrical traces to the remaining part of the suspension assembly.
-
公开(公告)号：US10037948B2
公开(公告)日：2018-07-31
申请号：US15241665
申请日：2016-08-19
申请人： Apple Inc.
IPC分类号： H01L21/56 , H01L23/552 , H01L23/29
CPC分类号： H01L23/552 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L25/0655 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K9/0024 , H05K9/0045
摘要： A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
-
公开(公告)号：US20210218896A1
公开(公告)日：2021-07-15
申请号：US17202252
申请日：2021-03-15
申请人： Apple Inc.
发明人： Nicholas D. Smyth , Jian Ouyang , Scott W. Miller , Samuel M. Hyatt , Martin Auclair , Phillip R. Sommer
摘要： Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.
-
公开(公告)号：US11595582B2
公开(公告)日：2023-02-28
申请号：US17202252
申请日：2021-03-15
申请人： Apple Inc.
发明人： Nicholas D. Smyth , Jian Ouyang , Scott W. Miller , Samuel M. Hyatt , Martin Auclair , Phillip R. Sommer
摘要： Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.
-
公开(公告)号：US11483461B2
公开(公告)日：2022-10-25
申请号：US17399917
申请日：2021-08-11
申请人： Apple Inc.
发明人： Phillip R. Sommer , Moran Koren , Adar Magen
IPC分类号： H04N5/225
摘要： A suspension assembly of a camera, with electrical traces, may be formed using one or more electroforming processes. The suspension assembly may include one or more flexure arms connecting an inner frame to an outer frame of the camera. The inner frame may be moveable relative to the outer frame to implement autofocus and/or optical image stabilization functions for the camera. The electrical traces may be formed at a first side of a substrate, using one or more electroforming processes. Next, one or more cavities in various shapes may be created in one or more dry film photoresist (DFR) layers at a second side of the substrate by exposing the DFR layers to ultraviolet light. One or more electroforming processes may be used to deposit one or more materials in to the cavities to form one or more components, e.g., a flexure arm, of the suspension assembly.
-
公开(公告)号：US20170263569A1
公开(公告)日：2017-09-14
申请号：US15403046
申请日：2017-01-10
申请人： Apple Inc.
IPC分类号： H01L23/552 , H01L25/065 , H01L23/498 , H01L21/56 , H01L23/00 , H01L21/3205 , H01L21/285 , H01L21/268 , H01L25/00 , H01L23/31 , H01L21/288
CPC分类号： H01L23/552 , H01L21/268 , H01L21/2855 , H01L21/2885 , H01L21/32051 , H01L21/561 , H01L23/3121 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/131 , H01L2224/16227 , H01L2224/7565 , H01L2224/81801 , H01L2224/97 , H01L2225/06517 , H01L2225/06572 , H01L2924/01013 , H01L2924/01026 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0104 , H01L2924/01073 , H01L2924/0132 , H01L2924/0133 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/1815 , H01L2924/3025 , H01L2224/81 , H01L2924/014 , H01L2924/00014
摘要： Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.
-
公开(公告)号：US11962881B1
公开(公告)日：2024-04-16
申请号：US17718210
申请日：2022-04-11
申请人： Apple Inc.
发明人： Himesh Patel , Kai Min , Phillip R. Sommer , Pavle Stojanovic , Qiang Yang
CPC分类号： H04N23/54 , H04N23/665
摘要： Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising a conductive layer and an electrical grounding. The conductive layer may include a signal pad region and a signal trace region. A distance between at least one section of the signal pad region and the electrical grounding may be greater than a distance between at least a section of the signal trace region and the electrical grounding.
-
公开(公告)号：US20230188853A1
公开(公告)日：2023-06-15
申请号：US18167788
申请日：2023-02-10
申请人： Apple Inc.
发明人： Nicholas D. Smyth , Jian Ouyang , Scott W. Miller , Samuel M. Hyatt , Martin Auclair , Phillip R. Sommer
CPC分类号： H04N23/687 , H04N23/54 , H04N23/67
摘要： Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.017 秒)
