公开(公告)号：US20160240312A1

公开(公告)日：2016-08-18

申请号：US14970228

申请日：2015-12-15

Applicant: Applied Materials, Inc.

Inventor： Dapeng WANG ,  Yixuan WU ,  Gaku FURUTA ,  Tae Kyung WON ,  Beom Soo PARK

IPC: H01G4/06 ,  H05K1/18 ,  H05K5/00 ,  H01G4/30 ,  H01G4/012

CPC classification number: H01G4/06 ,  H01G4/012 ,  H01G4/085 ,  H01G4/30 ,  H05K1/162 ,  H05K2201/0195

Abstract: The present disclosure generally relates to capacitors having a multilayer dielectric material between two electrodes. The multilayer dielectric material can have a small thickness with little to no breakdown strength reduction. By utilizing a multilayer dielectric structure in a capacitor, not only can the breakdown strength remain at an acceptable level, but the collective thickness of the capacitor may be reduced to accommodate the higher density pixels for display devices or any device that utilizes a capacitor.

Abstract translation: 本发明一般涉及在两个电极之间具有多层电介质材料的电容器。 多层电介质材料可以具有很小的厚度，几乎没有甚至没有击穿强度的降低。 通过在电容器中利用多层电介质结构，不仅可以将击穿强度保持在可接受的水平，而且还可以减小电容器的总体厚度以适应显示装置或使用电容器的任何器件的较高密度像素。

公开(公告)号：US20170335459A1

公开(公告)日：2017-11-23

申请号：US15157076

申请日：2016-05-17

Applicant: Applied Materials, Inc.

Inventor： Young-jin CHOI ,  Beom Soo PARK ,  Dongsuh LEE ,  William Norman STERLING ,  Robin L. TINER ,  Shinichi KURITA ,  Suhail ANWAR ,  Soo Young CHOI ,  Yi CUI ,  Lia ZHAO ,  Dapeng WANG

IPC: C23C16/50 ,  C23C16/40 ,  C23C16/458 ,  H01L21/687 ,  H01L21/285 ,  H01L21/02

CPC classification number: C23C16/50 ,  C23C16/402 ,  C23C16/4581 ,  C23C16/4583 ,  H01L21/02274 ,  H01L21/0262 ,  H01L21/28556 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68757 ,  H01L21/68785

Abstract: Embodiments described herein generally relate to a substrate support assembly. The substrate support assembly includes a support plate and a ceramic layer. The support plate has a top surface. The top surface includes a substrate receiving area configured to support a large area substrate and an outer area located outward of the substrate receiving area.