公开(公告)号：US20250153303A1

公开(公告)日：2025-05-15

申请号：US18510157

申请日：2023-11-15

Applicant: Applied Materials, Inc.

Inventor： Priscilla LAROSA ,  Shih-Haur SHEN ,  Jimin ZHANG ,  Haosheng WU ,  Jianshe TANG ,  Jonathan RAMOS

IPC: B24B37/015 ,  B24B37/013

Abstract: A method of processing a substrate, includes placing a front surface of a substrate disposed in a carrier head on a polishing surface of a pad. The method further includes delivering a first fluid onto the polishing surface using a first fluid delivery arm. The method further includes determining a location of a hot spot on the front surface. The method further includes determining a rotational orientation of the substrate relative to the carrier head. The method further includes treating the hot spot while polishing the front surface on the polishing surface using a second fluid delivery arm to deliver a second fluid to the polishing surface at a location that will intersect with the hot spot during polishing of the front surface of the substrate.

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B49/10 ,  B24B37/34

CPC classification number: B24B49/10 ,  B24B37/345 ,  H01L21/68

Abstract: A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.

公开(公告)号：US20240371646A1

公开(公告)日：2024-11-07

申请号：US18611430

申请日：2024-03-20

Applicant: Applied Materials, Inc.

Inventor： Jimin ZHANG ,  Harry Q. LEE ,  Jianshe TANG ,  Brian J. BROWN

IPC: H01L21/304 ,  B24B37/013 ,  B24B37/04 ,  B24B49/10 ,  H01L21/66

Abstract: In one embodiment, a method of processing a substrate in a chemical mechanical polishing (CMP) system, comprises determining an orientation of a substrate relative to a first carrier head. The method further includes initiating a polishing process of a surface of the substrate engaged with a polishing pad. The method further includes scanning, during the polishing process, a first portion of the surface of the substrate repeatedly using at least one endpoint sensor coupled to the polishing pad to generate orientation dependent scan data of a property of the first portion of the surface. The method further includes comparing the orientation dependent scan data to a library of orientation dependent scan data to determine when the endpoint of the polishing process has been reached.

公开(公告)号：US20240047238A1

公开(公告)日：2024-02-08

申请号：US18381261

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Jimin ZHANG ,  Jianshe TANG ,  Brian J. BROWN

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02087 ,  H01L21/68721 ,  H01L21/67248

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20220379428A1

公开(公告)日：2022-12-01

申请号：US17335868

申请日：2021-06-01

Applicant: Applied Materials, Inc.

Inventor： Jimin ZHANG ,  Brian J. BROWN ,  Eric LAU ,  Ekaterina MIKHAYLICHENKO ,  Jeonghoon OH ,  Gerald J. ALONZO

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.