公开(公告)号：US20240047238A1

公开(公告)日：2024-02-08

申请号：US18381261

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Jimin ZHANG ,  Jianshe TANG ,  Brian J. BROWN

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02087 ,  H01L21/68721 ,  H01L21/67248

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20220148892A1

公开(公告)日：2022-05-12

申请号：US17091105

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B49/10 ,  B24B37/34

CPC classification number: B24B49/10 ,  B24B37/345 ,  H01L21/68

Abstract: A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20230335418A1

公开(公告)日：2023-10-19

申请号：US18213717

申请日：2023-06-23

Applicant: Applied Materials, Inc.

Inventor： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC: H01L21/67 ,  B08B3/02 ,  H01L21/306 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02 ,  B08B5/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  H01L21/30625 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02057 ,  B08B5/02 ,  B08B2230/01 ,  B08B2203/007 ,  H01L21/67109 ,  H01L21/02074

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20220216074A1

公开(公告)日：2022-07-07

申请号：US17141622

申请日：2021-01-05

Applicant: Applied Materials, Inc.

Inventor： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/12 ,  H01L21/306

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.