公开(公告)号：US20220216074A1

公开(公告)日：2022-07-07

申请号：US17141622

申请日：2021-01-05

Applicant: Applied Materials, Inc.

Inventor： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/12 ,  H01L21/306

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B49/10 ,  B24B37/34

CPC classification number: B24B49/10 ,  B24B37/345 ,  H01L21/68

Abstract: A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20230335418A1

公开(公告)日：2023-10-19

申请号：US18213717

申请日：2023-06-23

Applicant: Applied Materials, Inc.

Inventor： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC: H01L21/67 ,  B08B3/02 ,  H01L21/306 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02 ,  B08B5/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  H01L21/30625 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02057 ,  B08B5/02 ,  B08B2230/01 ,  B08B2203/007 ,  H01L21/67109 ,  H01L21/02074

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.