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10 条记录 (耗时 0.024 秒)

    High density flexible circuit
    1.
    发明授权
    High density flexible circuit 失效
    高密度柔性电路

    公开(公告)号：US4798918A

    公开(公告)日：1989-01-17

    申请号：US99259

    申请日：1987-09-21

    申请人： Ashok N. Kabadi ,  Leonard O. Turner ,  Michael T. White

    发明人： Ashok N. Kabadi ,  Leonard O. Turner ,  Michael T. White

    IPC分类号： H01B7/08 ,  H05K1/00 ,  H05K1/02 ,  H05K3/28

    CPC分类号： H01B7/0838 ,  H05K1/0219 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09672 ,  H05K3/281

    摘要： A high density flexible circuit for coupling electrical devices. The flexible circuit has signal and ground traces on both sides of the flexible circuit. Each signal trace is surrounded by ground traces. There is a ground trace on either side of each signal trace and two ground traces located below each signal trace. This system of placing ground traces surrounding each signal trace reduces electrical noise between the signal traces and reduces the electrical capacitance of the circuit.

    摘要翻译： 用于耦合电气设备的高密度柔性电路。 柔性电路在柔性电路的两侧都有信号和接地迹线。 每个信号迹线都被接地迹线包围。 在每个信号迹线的两侧都有一个接地迹线，位于每个信号迹线下方的两个接地迹线。 围绕每个信号迹线放置接地迹线的系统降低了信号迹线之间的电噪声并降低了电路的电容。

    High density connector system
    2.
    发明授权
    High density connector system 失效
    高密度连接器系统

    公开(公告)号：US5057023A

    公开(公告)日：1991-10-15

    申请号：US532015

    申请日：1990-06-01

    申请人： Ashok N. Kabadi ,  Leonard O. Turner ,  Ronald C. Flamm

    发明人： Ashok N. Kabadi ,  Leonard O. Turner ,  Ronald C. Flamm

    IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K3/32

    CPC分类号： H01R12/62 ,  H05K3/326 ,  H05K1/141 ,  H05K1/189 ,  H05K2201/10393 ,  H05K2201/10689 ,  Y10S439/912

    摘要： A connection system for use in connecting a high density flexible circuit directly to a surface mounted integrated circuit component mounted on a printed circuit board. The connection system utilizes an upper and lower stiffener plate to route the contacts of the high density flexible circuit to the pins of the integrated circuit component. The connection system utilizes silicone rubber pressure rods to create a force on the contacts of the higher density flexible circuit to ensure reliable connection to the leads of the surface mounted components. The connection system utilizes comb spacers which define slots to align the contacts of the high density circuit to the pins of the integrated circuit component and a top clamp to retain the assembly onto the integrated circuit component.

    摘要翻译： 一种用于将高密度柔性电路直接连接到安装在印刷电路板上的表面安装集成电路部件的连接系统。 连接系统利用上下加强板将高密度柔性电路的触头引导到集成电路部件的引脚。 连接系统利用硅橡胶压力杆在较高密度柔性电路的触点上产生力，以确保与表面安装部件的引线的可靠连接。 连接系统使用梳形间隔件，其限定狭槽以将高密度电路的触点与集成电路部件的引脚对准，以及顶部钳位件，以将组件保持在集成电路部件上。

    Board-stacking connector
    3.
    发明授权
    Board-stacking connector 失效
    板堆叠连接器

    公开(公告)号：US06565369B1

    公开(公告)日：2003-05-20

    申请号：US09040479

    申请日：1998-03-17

    申请人： Hugo K. Schulz ,  Leonard O. Turner

    发明人： Hugo K. Schulz ,  Leonard O. Turner

    IPC分类号： H01R466

    CPC分类号： H01R12/714

    摘要： An improved stacking connector. The connector includes a plug portion and a receptacle portion. The plug portion includes a plug signal pin and a plug impedance control pin located adjacent to the plug signal pin. The receptacle portion includes a receptacle signal pin for engaging the plug signal pin when the plug portion and the receptacle portion are in a mated position. The connector also includes an impedance control shield which is located adjacent to the plug signal pin or receptacle signal pin.

    摘要翻译： 一个改进的堆叠连接器。 连接器包括插头部分和插座部分。 插头部分包括插头信号引脚和位于插头信号引脚附近的插头阻抗控制引脚。 插座部分包括插座信号针，用于当插头部分和插座部分处于配合位置时接合插头信号针。 该连接器还包括阻抗控制屏蔽件，其位于插头信号引脚或插座信号引脚附近。

    High speed bus contact system
    4.
    发明授权
    High speed bus contact system 失效
    高速总线接触系统

    公开(公告)号：US06322370B1

    公开(公告)日：2001-11-27

    申请号：US09061807

    申请日：1998-04-16

    申请人： Frank P. Hart ,  Raviprakash Nagaraj ,  Leonard O. Turner ,  Arthur L. Spurrell

    发明人： Frank P. Hart ,  Raviprakash Nagaraj ,  Leonard O. Turner ,  Arthur L. Spurrell

    IPC分类号： H01R13648

    CPC分类号： H01R12/83 ,  H01R13/658

    摘要： The present invention is a memory bus connector for accommodating a memory module that is parallel to a motherboard. The memory bus connector of the present invention has a plurality of individual contacts that act as data signal contacts and/or ground members that connect to the lower portion the parallel memory module. The memory bus connector of the present invention also has a sheet grounding member that connects to the upper portion of the memory module.

    摘要翻译： 本发明是用于容纳与主板平行的存储模块的存储总线连接器。 本发明的存储器总线连接器具有多个单独的触点，其作为数据信号触点和/或接地部件，其连接到并行存储器模块的下部。 本发明的存储器总线连接器还具有连接到存储器模块的上部的片状接地部件。

    Enclosure assembly with two identical covers having modifiable supports for asymmetrically housing a printed circuit board or the like
    7.
    发明授权
    Enclosure assembly with two identical covers having modifiable supports for asymmetrically housing a printed circuit board or the like 失效
    具有两个相同盖的外壳组件具有用于不对称地容纳印刷电路板等的可修改的支撑

    公开(公告)号：US5111362A

    公开(公告)日：1992-05-05

    申请号：US584190

    申请日：1990-09-18

    申请人： Ronald C. Flamm ,  Leonard O. Turner ,  James D. Plunkett

    发明人： Ronald C. Flamm ,  Leonard O. Turner ,  James D. Plunkett

    IPC分类号： H05K5/00 ,  H05K7/14

    CPC分类号： H05K5/0008 ,  H05K7/142

    摘要： A rigid enclosure for printed circuit boards that utilizes identical top and bottom covers and provides for offsetting the distance the printed circuit board sits from the bottom cover. The enclosure utilizes features formed into the covers to provide for alignment and fastening. Removable vents provide for air flow to cool the printed circuit board and when removed, allow access for interface to the printed circuit board. Threaded inserts and standoffs provide flexibility for fastening identical parts together.

    摘要翻译： 用于印刷电路板的刚性外壳，其利用相同的顶盖和底盖，并且用于抵消印刷电路板与底盖的距离。 外壳利用形成在盖中的特征来提供对准和紧固。 可拆卸的通风口提供空气流冷却印刷电路板，并且在被移除时，允许访问印刷电路板的接口。 螺纹刀片和支座提供了将相同零件固定在一起的灵活性。

    Method and apparatus for transferring signals through a high density, low profile, array type stacking connector
    10.
    发明授权
    Method and apparatus for transferring signals through a high density, low profile, array type stacking connector 有权
    用于通过高密度，低轮廓的阵列型堆叠连接器传送信号的方法和装置

    公开(公告)号：US06183266B2

    公开(公告)日：2001-02-06

    申请号：US09151394

    申请日：1998-09-10

    申请人： Leonard O. Turner

    发明人： Leonard O. Turner

    IPC分类号： H01R1200

    CPC分类号： H01R24/50 ,  H01R12/57 ,  H01R12/718 ,  H01R2103/00

    摘要： An improved method and apparatus for transferring signals through a stacking connector. A disclosed apparatus includes a first engaging contact member mounted on a first circuit board and a second engaging contact member which removably engages the first engaging contact member mounted on a second circuit board. The first engaging contact member is electrically coupled to a first signal line on the first circuit board and the second engaging contact member is electrically coupled to a second signal line on the second circuit board. A conductive barrier partially surrounds the second engaging contact member. The barrier has at least one connector connecting the barrier to a bias voltage line.

    摘要翻译： 一种用于通过堆叠连接器传送信号的改进的方法和装置。 所公开的装置包括安装在第一电路板上的第一接合接触构件和可拆卸地接合安装在第二电路板上的第一接合接触构件的第二接合接触构件。 第一接合接触构件电耦合到第一电路板上的第一信号线，而第二接合接触构件电耦合到第二电路板上的第二信号线。 导电阻挡部分地围绕第二接合接触构件。 屏障具有至少一个将屏障连接到偏置电压线的连接器。