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    DESIGN SUPPORTING METHOD, SYSTEM, AND PROGRAM OF MAGNETRON SPUTTERING APPARATUS
    1.
    发明申请
    DESIGN SUPPORTING METHOD, SYSTEM, AND PROGRAM OF MAGNETRON SPUTTERING APPARATUS 审中-公开
    MAGNETRON飞溅设备的设计支持方法，系统和程序

    公开(公告)号：US20080185285A1

    公开(公告)日：2008-08-07

    申请号：US11960905

    申请日：2007-12-20

    申请人： Atsushi Furuya ,  Akihiko Fujisaki ,  Tetsuyuki Kubota

    发明人： Atsushi Furuya ,  Akihiko Fujisaki ,  Tetsuyuki Kubota

    IPC分类号： C23C14/00

    CPC分类号： C23C14/35 ,  G06F17/50 ,  H01J37/3408 ,  H01J37/3452 ,  H01J37/3455

    摘要： A static magnetic field structure data is read, a cross section which is parallel with the target surface and in which plasma is generated is specified at an arbitrary position, and an erosion center line segment having an endless shape which goes through the center of a region in which the magnetic field vertical to the plane of the specified cross section is zero is calculated. The static erosion rate distribution in the specified cross section of the magnetic field structure data is calculated based on the erosion rate of the erosion center line segment, the rotational erosion rate distribution caused along with rotation of the magnet is calculated, and the film formation rate distribution on the objective material is calculated by using the rotational erosion rate distribution.

    摘要翻译： 读取静态磁场结构数据，在任意位置指定与目标表面平行并且产生等离子体的横截面，并且具有贯穿区域中心的环形形状的侵蚀中心线段 计算垂直于指定截面的平面的磁场为零的磁场。 根据侵蚀中心线段的侵蚀速率计算磁场结构数据的规定截面中的静态侵蚀速率分布，计算随着磁体旋转引起的旋转侵蚀速率分布，成膜速度 通过使用旋转侵蚀速率分布计算目标物质的分布。

    MAGNET UNIT FOR MAGNETRON SPUTTERING SYSTEM
    4.
    发明申请
    MAGNET UNIT FOR MAGNETRON SPUTTERING SYSTEM 审中-公开
    磁控溅射系统MAGNET单元

    公开(公告)号：US20090219123A1

    公开(公告)日：2009-09-03

    申请号：US12367222

    申请日：2009-02-06

    申请人： Akihiko Fujisaki ,  Atsushi Furuya ,  Nobuyoshi Yamaoka

    发明人： Akihiko Fujisaki ,  Atsushi Furuya ,  Nobuyoshi Yamaoka

    IPC分类号： H01F7/02

    CPC分类号： H01F7/0284 ,  H01F7/0221 ,  H01J37/3405

    摘要： According to an aspect of an embodiment, a magnet unit for a magnetron sputtering system includes a base board, an inner magnet fixed to the base board and an outer magnet fixed to the base board. The outer magnet is fixed surround the inner magnet. At least one of a portion of the inner magnet or a portion of the outer magnet is displaceable on the base board.

    摘要翻译： 根据实施例的一个方面，磁控溅射系统的磁体单元包括基板，固定到基板的内磁体和固定到基板的外磁体。 外磁体固定在内磁体周围。 内磁体的一部分或外磁体的一部分中的至少一个可在基板上移位。

    Cooling system for electronic device
    5.
    发明授权
    Cooling system for electronic device 失效
    电子设备冷却系统

    公开(公告)号：US5535818A

    公开(公告)日：1996-07-16

    申请号：US134947

    申请日：1993-10-12

    申请人： Akihiko Fujisaki ,  Hideo Katsumi

    发明人： Akihiko Fujisaki ,  Hideo Katsumi

    IPC分类号： F28D15/02 ,  F28B1/06 ,  F28F27/00 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/20281 ,  F28B1/06 ,  F28F27/00

    摘要： A cooling system for an electronic device includes a circulatory system having a pump with an inlet and an outlet for circulating a coolant in the circulatory system, a heat exchanger for cooling the coolant, a cooling module for cooling the electronic device by the coolant and a tank for reserving the coolant which is connected to the circulatory system via inflow and outflow bypass channels. The inflow bypass channel is connected to the circulatory system at a first connection node between the pump outlet and the cooling module. The outflow bypass channel is connected to the circulatory system at a second connection node between the cooling module and the pump inlet.

    摘要翻译： 一种用于电子设备的冷却系统包括具有泵的循环系统，该泵具有用于使循环系统中的冷却剂循环的入口和出口，用于冷却冷却剂的热交换器，用于通过冷却剂冷却电子设备的冷却模块和 用于通过流入和流出旁路通道保持连接到循环系统的冷却剂。 流入旁路通道在泵出口和冷却模块之间的第一连接节点处连接到循环系统。 流出旁路通道在冷却模块和泵入口之间的第二连接节点连接到循环系统。

    Cooling system
    6.
    发明授权
    Cooling system 失效
    冷却系统

    公开(公告)号：US5136856A

    公开(公告)日：1992-08-11

    申请号：US659658

    申请日：1991-02-25

    申请人： Haruhiko Yamamoto ,  Akihiko Fujisaki

    发明人： Haruhiko Yamamoto ,  Akihiko Fujisaki

    IPC分类号： H05K7/20 ,  G06F1/20

    CPC分类号： G06F1/206 ,  G06F2200/201

    摘要： A cooling system comprising an airtight box which accommodates a cooling module and an electronic device which is cooled by the cooling module and has a door which is opened when attending to maintenance of parts within the airtight box, a dew condensation preventing unit for absorbing humidity within the airtight box and/or replacing air or gas within said airtight box when operated, a coolant supply unit for recirculating a coolant between the coolant supply unit and the cooling module, and a controller for operating the coolant supply unit and the dew condensation preventing unit in response to a first instruction signal which instructs a cooling operation, and for heating the electronic device in response to a second instruction signal which instructs the maintenance of the parts within the airtight box, where only one of the first and second instruction signals exists at one time. The controller includes a circuit part responsive to the second instruction signal for supplying an operating signal to the electronic device to operate the electronic device for a predetermined time, so that the electronic device rises to a predetermined temperature due to heat generated by the electronic device itself.

    MESH NUMBER PREDICTION METHOD, ANALYZING APPARATUS AND COMPUTER-READABLE STORAGE MEDIUM
    7.
    发明申请
    MESH NUMBER PREDICTION METHOD, ANALYZING APPARATUS AND COMPUTER-READABLE STORAGE MEDIUM 有权
    MESH数字预测方法，分析装置和计算机可读存储介质

    公开(公告)号：US20120239359A1

    公开(公告)日：2012-09-20

    申请号：US13421085

    申请日：2012-03-15

    申请人： Sachiko Furuya ,  Makoto Sakairi ,  Akihiko Fujisaki

    发明人： Sachiko Furuya ,  Makoto Sakairi ,  Akihiko Fujisaki

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5018

    摘要： A mesh number prediction method obtains a mesh length for a case in which a mesh having an arbitrary shape is created by approximating an entire analyzing target by a three-dimensional (3D) mesh model based on data of a 3D surface model of the analyzing target, obtains a mesh number of each part forming the analyzing target for a case in which a mesh having an arbitrary shape is created by approximating each part by a 3D mesh model based on the mesh length, and obtains a predicted total mesh number of the entire analyzing target from a ratio of volumes of the entire analyzing target and each part based on the mesh number.

    摘要翻译： 网格数预测方法通过基于分析对象的3D表面模型的数据，通过利用三维（3D）网格模型逼近整个分析对象来获得具有任意形状的网格的情况的网格长度 通过基于网格长度的3D网格模型近似每个部分，获得形成具有任意形状的网格的情况下的每个部分的网格数，并且获得整个网格的预测总网格数 根据整个分析目标和每个部分的体积比，根据网格数目分析目标。

    Mesh number prediction method, analyzing apparatus and computer-readable storage medium
    9.
    发明授权
    Mesh number prediction method, analyzing apparatus and computer-readable storage medium 有权
    网格数预测方法，分析装置和计算机可读存储介质

    公开(公告)号：US09075943B2

    公开(公告)日：2015-07-07

    申请号：US13421085

    申请日：2012-03-15

    申请人： Sachiko Furuya ,  Makoto Sakairi ,  Akihiko Fujisaki

    发明人： Sachiko Furuya ,  Makoto Sakairi ,  Akihiko Fujisaki

    IPC分类号： G06F7/60 ,  G06F17/10 ,  G06F17/50

    CPC分类号： G06F17/5018

    摘要： A mesh number prediction method obtains a mesh length for a case in which a mesh having an arbitrary shape is created by approximating an entire analyzing target by a three-dimensional (3D) mesh model based on data of a 3D surface model of the analyzing target, obtains a mesh number of each part forming the analyzing target for a case in which a mesh having an arbitrary shape is created by approximating each part by a 3D mesh model based on the mesh length, and obtains a predicted total mesh number of the entire analyzing target from a ratio of volumes of the entire analyzing target and each part based on the mesh number.

    摘要翻译： 网格数预测方法通过基于分析对象的3D表面模型的数据，通过三维（3D）网格模型逼近整个分析对象来获得具有任意形状的网格的情况的网格长度 通过基于网格长度的3D网格模型近似每个部分，获得形成具有任意形状的网格的情况下的每个部分的网格数，并且获得整个网格的预测总网格数 根据整个分析目标和每个部分的体积比，根据网格数目分析目标。

    Semiconductor device cooling apparatus
    10.
    发明授权
    Semiconductor device cooling apparatus 失效
    半导体装置冷却装置

    公开(公告)号：US07278466B2

    公开(公告)日：2007-10-09

    申请号：US11000897

    申请日：2004-12-02

    申请人： Akihiko Fujisaki

    发明人： Akihiko Fujisaki

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.

    摘要翻译： 在以简单的结构冷却半导体器件的半导体器件冷却装置中，将冷却剂从供给口供给到与其紧密接触地设置有半导体器件的传热板的中心，径向向着 通过由间隙形成板形成的间隙形状的板状的传热板的周缘部，所述间隙形成板由作为间隔板的间隙板的两个薄板构件和设置在间隙板上的间隙顶板构成， 具有小的高度，由周缘部周围形成的收集槽收集，从排出口排出。