公开(公告)号：US06465133B1

公开(公告)日：2002-10-15

申请号：US09567014

申请日：2000-05-09

申请人： Ayao Kariya ,  Noriki Hayashi ,  Shinji Inazawa ,  Masatoshi Majima

发明人： Ayao Kariya ,  Noriki Hayashi ,  Shinji Inazawa ,  Masatoshi Majima

IPC分类号： H01M480

CPC分类号： H01M4/80 ,  C25D5/56 ,  H01M4/808 ,  H01M2300/0014 ,  Y10T428/12042 ,  Y10T428/12111

摘要： A metallic porous body comprises a metallic framework having a three-dimensional network with a continuous-pore structure formed by linking sub-stantially polyhedral cells. The substantially polyhedral cells have an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. The metallic porous body can be obtained by the following method, for instance: First, a plastic porous body is provided that has an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. Second, a conductive layer is formed on a surface of the framework of the plastic porous body to produce a conductive porous body having a resistivity of about 1 k&OHgr;·cm or less. Finally, a continuous metal-plated layer is formed on a surface of the conductive layer by electroplating, with the conductive porous body serving as the cathode. The above-mentioned current collector is provided by filling an active material into the pores of the metallic porous body.

摘要翻译： 金属多孔体包括具有三维网状物的金属框架，该三维网状结构具有通过连接亚稳定多面体单元形成的连续孔结构。 基本上多边形的单元具有约200至约300μm的平均泡孔直径和约100至约200μm的平均窗口直径。 金属多孔体可以通过以下方法获得，例如：首先，提供具有约200至约300μm的平均泡孔直径和约100至约200μm的平均窗口直径的塑料多孔体。 其次，在塑料多孔体的框架的表面上形成导电层，以制造电阻率为约1kOMEGA·cm以下的导电性多孔体。 最后，通过电镀在导电层的表面上形成连续的金属镀层，导电多孔体用作阴极。 通过将活性物质填充到金属多孔体的孔中来提供上述集电体。

公开(公告)号：US5273954A

公开(公告)日：1993-12-28

申请号：US832565

申请日：1992-02-07

申请人： Satoshi Takano ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Noriyuki Yoshida ,  Shinji Inazawa ,  Noriki Hayashi

发明人： Satoshi Takano ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Noriyuki Yoshida ,  Shinji Inazawa ,  Noriki Hayashi

IPC分类号： B32B18/00 ,  C01G3/00 ,  C04B35/45 ,  C04B41/50 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01L23/532 ,  H01L39/24 ,  B05D3/06 ,  B05D5/12

CPC分类号： H01L39/248 ,  C01G3/006 ,  C04B35/45 ,  C04B35/4504 ,  C04B35/4508 ,  C04B41/5074 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01L23/53285 ,  H01L39/2425 ,  H01L39/2432 ,  H01L39/2451 ,  H01L39/2461 ,  C01P2002/34 ,  H01L2924/0002 ,  Y10S505/704 ,  Y10S505/73 ,  Y10S505/732

摘要： A method of manufacturing a superconducting ceramics elongated body by forming a longitudinally continuous superconducting layer on at least a part of the surface of a flexible ceramics elongated substrate by evaporation under the presence of oxygen ions.

摘要翻译： 一种通过在氧离子的存在下通过蒸发在柔性陶瓷细长衬底的至少一部分表面上形成纵向连续超导层来制造超导陶瓷细长体的方法。

公开(公告)号：US5112802A

公开(公告)日：1992-05-12

申请号：US234643

申请日：1988-08-22

申请人： Satoshi Takano ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Noriyuki Yoshida ,  Shinji Inazawa ,  Noriki Hayashi

发明人： Satoshi Takano ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Noriyuki Yoshida ,  Shinji Inazawa ,  Noriki Hayashi

IPC分类号： C01B13/14 ,  B28B1/00 ,  B32B18/00 ,  C01G1/00 ,  C01G3/00 ,  C04B35/45 ,  C04B35/622 ,  C04B41/50 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01B12/04 ,  H01B13/00 ,  H01L23/532 ,  H01L39/24

CPC分类号： C04B35/62222 ,  C01G3/006 ,  C04B35/45 ,  C04B35/4504 ,  C04B35/4508 ,  C04B41/009 ,  C04B41/5074 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01L23/53285 ,  H01L39/2425 ,  H01L39/2432 ,  H01L39/2438 ,  H01L39/2451 ,  H01L39/2461 ,  H01L39/248 ,  C01P2002/34 ,  C04B2111/00844 ,  C04B2111/50 ,  H01L2924/0002 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704

摘要： A superconducting ceramics elongated body comprising a flexible ceramics elongated substrate and an oxide ceramics superconducting layer formed at least on a part of the surface of the ceramics elongated substrate to longitudinally extend along the ceramics elongated substrate. The superconducting ceramics elongated body further comprises a protective layer of ceramics containing a nitride, which is provided to at least cover the surface of the superconducting layer exposed on the ceramics elongated substrate. A method of manufacturing a superconducting ceramics elongated body by forming a longitudinally continuous superconducting layer on at least a part of the surface of a flexible ceramics elongated substrate. The superconducting layer is formed on the elongated substrate by a sol-gel method, a coating/sintering method, evaporation under oxygen ions, deposition from a fluoride solution or oxidation after application of corresponding fluorides.

公开(公告)号：US5232909A

公开(公告)日：1993-08-03

申请号：US862103

申请日：1992-05-08

申请人： Satoshi Takano ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Noriyuki Yoshida ,  Shinji Inazawa ,  Noriki Hayashi

发明人： Satoshi Takano ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Noriyuki Yoshida ,  Shinji Inazawa ,  Noriki Hayashi

IPC分类号： B32B18/00 ,  C01G3/00 ,  C04B35/45 ,  C04B41/50 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01L23/532 ,  H01L39/24

CPC分类号： C04B41/52 ,  C01G3/006 ,  C04B35/45 ,  C04B35/4504 ,  C04B35/4508 ,  C04B41/5074 ,  C04B41/85 ,  C04B41/89 ,  H01L23/53285 ,  H01L39/2425 ,  H01L39/2432 ,  H01L39/2451 ,  H01L39/2461 ,  H01L39/248 ,  C01P2002/34 ,  H01L2924/0002 ,  Y10S505/704 ,  Y10S505/733 ,  Y10S505/734 ,  Y10S505/735 ,  Y10S505/737 ,  Y10S505/742

摘要： A superconducting ceramics elongated body comprising a flexible ceramics elongated substrate and an oxide ceramics superconducting layer formed at least on a part of the surface of the ceramics elongated substrate to longitudinally extend along the ceramics elongated substrate. The superconducting ceramics elongated body further comprises a protective layer of ceramics containing a nitride, which is provided to at least cover the surface of the superconducting layer exposed on the ceramics elongated substrate. A method of manufacturing a superconducting ceramics elongated body by forming a longitudinally continuous superconducting layer on at least a part of the surface of a flexible ceramics elongated substrate. The superconducting layer is formed on the elongated substrate by a sol-gel method, a coating/sintering method, evaporation under oxygen ions, deposition from a fluoride solution or oxidation after application of corresponding fluorides.

摘要翻译： 一种超导陶瓷细长体，其包括柔性陶瓷细长衬底和至少形成在所述陶瓷细长衬底的表面的一部分上的氧化物陶瓷超导层，以沿着所述陶瓷细长衬底纵向延伸。 超导陶瓷细长体还包括含有氮化物的陶瓷保护层，其被设置成至少覆盖暴露在陶瓷细长衬底上的超导层的表面。 一种通过在柔性陶瓷细长基板的表面的至少一部分上形成纵向连续的超导层来制造超导陶瓷细长体的方法。 通过溶胶 - 凝胶法，涂覆/烧结法​​，在氧离子下蒸发，在氟化物溶液中沉积或在施加相应的氟化物后进行氧化，在细长衬底上形成超导层。

公开(公告)号：US20080063792A1

公开(公告)日：2008-03-13

申请号：US11976490

申请日：2007-10-25

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： H05K3/00

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。

公开(公告)号：US5372991A

公开(公告)日：1994-12-13

申请号：US196615

申请日：1994-02-15

申请人： Noriki Hayashi ,  Satoshi Takano ,  Shigeru Okuda ,  Hajime Hitotsuyanagi

发明人： Noriki Hayashi ,  Satoshi Takano ,  Shigeru Okuda ,  Hajime Hitotsuyanagi

IPC分类号： H01B12/06 ,  H01B13/00 ,  H01F6/06 ,  H01L39/24 ,  H01F7/22 ,  H01B12/02

CPC分类号： H01F6/06 ,  H01B12/06 ,  H01L39/248 ,  Y02E40/642 ,  Y10S505/70 ,  Y10S505/704 ,  Y10S505/705

摘要： An oxide superconductive wire is provided by, for example, forming an oxide superconductive layer on a tape-type flexible base. A preliminary compressive strain is applied to the oxide superconductive layer in the longitudinal direction. The remaining strain can be provided by using a base having thermal expansion coefficient larger than that of the oxide superconductive layer and by cooling the same after heat treatment, due to contraction of the base. Since the preliminary compressive strain is applied to the oxide superconductive layer, degradation of superconductivity of the oxide superconductive layer can be suppressed even if the oxide superconductive wire is bent in any direction, compared with the wire without such strain. Therefore, the oxide superconductive wire can be coiled, for example, without much degrading the superconductivity.

摘要翻译： 氧化物超导线通过例如在带状柔性基底上形成氧化物超导层而提供。 在纵向上对氧化物超导层施加预压缩应变。 可以通过使用具有大于氧化物超导层的热膨胀系数的碱的基底，并且由于基底的收缩而在热处理后对其进行冷却来提供剩余的应变。 由于将预压缩应变施加到氧化物超导层上，与没有这种应变的线相比，即使氧化物超导线在任何方向上弯曲，也可以抑制氧化物超导层的超导性的劣化。 因此，氧化物超导线例如可以卷绕，而不会使超导性降低。

公开(公告)号：US5242898A

公开(公告)日：1993-09-07

申请号：US886113

申请日：1992-05-19

申请人： Kenichi Takahashi ,  Noriyuki Yoshida ,  Jun Shioya ,  Yoichi Yamaguchi ,  Akira Mizoguchi ,  Noriki Hayashi ,  Satoshi Takano ,  Kenji Miyazaki

发明人： Kenichi Takahashi ,  Noriyuki Yoshida ,  Jun Shioya ,  Yoichi Yamaguchi ,  Akira Mizoguchi ,  Noriki Hayashi ,  Satoshi Takano ,  Kenji Miyazaki

IPC分类号： H01L39/24

CPC分类号： H01L39/249 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10T428/24926

摘要： A method of forming a superconducting circuit comprises the steps of preparing a ceramics body which is changed from a non-superconductive phase not superconducting at the working temperature into a superconducting phase superconducting at the working temperature by heat treatment and performing the heat treatment on a part of the ceramics body by applying a laser beam to the ceramics body to change the same into the superconductive phase, thereby to form a superconducting circuit consisting of the superconductive phase and the non-superconductive phase on the ceramics body.

摘要翻译： 一种形成超导电路的方法包括以下步骤：制备陶瓷体，其从工作温度下不超导的非超导相变为通过热处理在工作温度下超导超导相，并对部件进行热处理 通过将激光束施加到陶瓷体以将其改变为超导相，从而形成由陶瓷体上的超导相和非超导相组成的超导电路。

公开(公告)号：US5151406A

公开(公告)日：1992-09-29

申请号：US160115

申请日：1988-02-25

申请人： Kazuo Sawada ,  Kengo Okura ,  Noriyuki Yoshida ,  Satoshi Takano ,  Kenji Miyazaki ,  Noriki Hayashi

发明人： Kazuo Sawada ,  Kengo Okura ,  Noriyuki Yoshida ,  Satoshi Takano ,  Kenji Miyazaki ,  Noriki Hayashi

IPC分类号： H01L39/12 ,  H01L39/14

CPC分类号： H01L39/143 ,  H01L39/12 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/704 ,  Y10S505/705 ,  Y10T428/31678

摘要： A laminated ceramic superconductor which comprises at least two layers of ceramic superconductor and a stabilizing metal layer interposed between said ceramic superconductor layers, which has improved flexibility and increased critical current density.

公开(公告)号：US5108984A

公开(公告)日：1992-04-28

申请号：US630241

申请日：1990-12-19

申请人： Jun Shioya ,  Yoichi Yamaguchi ,  Akira Mizoguchi ,  Noriyuki Yoshida ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Satoshi Takano ,  Noriki Hayashi

发明人： Jun Shioya ,  Yoichi Yamaguchi ,  Akira Mizoguchi ,  Noriyuki Yoshida ,  Kenichi Takahashi ,  Kenji Miyazaki ,  Satoshi Takano ,  Noriki Hayashi

IPC分类号： B32B18/00 ,  C04B35/45 ,  C04B41/50 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01L39/24

CPC分类号： C04B41/009 ,  C04B35/45 ,  C04B35/4504 ,  C04B41/5074 ,  C04B41/52 ,  C04B41/85 ,  C04B41/89 ,  H01L39/2425 ,  H01L39/2432 ,  H01L39/2451 ,  H01L39/248 ,  Y10S505/704 ,  Y10S505/732

摘要： A thin film of an oxide superconductor having a homogeneous composition and less oxygen defects is produced by independently vaporizing at least one material selected from the group consisting of the elements of Ia, IIa and IIIa groups of the periodic table and their compounds and at least one material selected from the group consisting of the elements of Ib, IIb and IIIb groups of the periodic table and their compounds in the presence of molecular oxygen and depositing the vaporized materials together with oxygen on a substrate to form a thin film of the oxide superconductor.

公开(公告)号：US08231766B2

公开(公告)日：2012-07-31

申请号：US11976490

申请日：2007-10-25

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： C23C14/00 ,  B05D5/12

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，通过使用含有平均粒径为4μm以下且最大粒径为15μm的金属粒子的导电糊进行印刷来制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。