Board for printed wiring, printed wiring board, and method for manufacturing them
    1.
    发明申请
    Board for printed wiring, printed wiring board, and method for manufacturing them 有权
    印刷电路板,印刷线路板及其制造方法

    公开(公告)号:US20080063792A1

    公开(公告)日:2008-03-13

    申请号:US11976490

    申请日:2007-10-25

    IPC分类号: H05K3/00

    摘要: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

    摘要翻译: 一种用于印刷布线的新型印刷电路板,包括具有透明且有利的边界线的精细导体布线,并通过诸如丝网印刷的顺序印刷法,使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于,对板的表面进行表面处理之一:(a)粗糙化,(2)等离子体处理,(3)粗糙化,然后进行等离子体处理, 和(4)通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于,使用含有平均粒径为4μm以下,最大粒径为15μm的金属粒子的导电糊进行印刷,制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于,使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻,在表面上形成镀覆层。

    Oxide superconductive wire, method of manufacturing the same and the
products using the same
    2.
    发明授权
    Oxide superconductive wire, method of manufacturing the same and the products using the same 失效
    氧化物超导线,其制造方法和使用其的产品

    公开(公告)号:US5372991A

    公开(公告)日:1994-12-13

    申请号:US196615

    申请日:1994-02-15

    摘要: An oxide superconductive wire is provided by, for example, forming an oxide superconductive layer on a tape-type flexible base. A preliminary compressive strain is applied to the oxide superconductive layer in the longitudinal direction. The remaining strain can be provided by using a base having thermal expansion coefficient larger than that of the oxide superconductive layer and by cooling the same after heat treatment, due to contraction of the base. Since the preliminary compressive strain is applied to the oxide superconductive layer, degradation of superconductivity of the oxide superconductive layer can be suppressed even if the oxide superconductive wire is bent in any direction, compared with the wire without such strain. Therefore, the oxide superconductive wire can be coiled, for example, without much degrading the superconductivity.

    摘要翻译: 氧化物超导线通过例如在带状柔性基底上形成氧化物超导层而提供。 在纵向上对氧化物超导层施加预压缩应变。 可以通过使用具有大于氧化物超导层的热膨胀系数的碱的基底,并且由于基底的收缩而在热处理后对其进行冷却来提供剩余的应变。 由于将预压缩应变施加到氧化物超导层上,与没有这种应变的线相比,即使氧化物超导线在任何方向上弯曲,也可以抑制氧化物超导层的超导性的劣化。 因此,氧化物超导线例如可以卷绕,而不会使超导性降低。

    Method for producing printed wiring board
    8.
    发明授权
    Method for producing printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号:US08231766B2

    公开(公告)日:2012-07-31

    申请号:US11976490

    申请日:2007-10-25

    IPC分类号: C23C14/00 B05D5/12

    摘要: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

    摘要翻译: 一种用于印刷布线的新型印刷电路板,包括具有透明且有利的边界线的精细导体布线,并通过诸如丝网印刷的顺序印刷法,使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于,对板的表面进行表面处理之一:(a)粗糙化,(2)等离子体处理,(3)粗糙化,然后进行等离子体处理, 和(4)通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于,通过使用含有平均粒径为4μm以下且最大粒径为15μm的金属粒子的导电糊进行印刷来制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于,使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻,在表面上形成镀覆层。

    BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING
    9.
    发明申请
    BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING 审中-公开
    用于印刷的嵌段共聚物聚酰胺油墨组合物

    公开(公告)号:US20110127077A1

    公开(公告)日:2011-06-02

    申请号:US13025581

    申请日:2011-02-11

    摘要: The object is to provide a polyimide ink composition having good printing properties and good continuous priming properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.

    摘要翻译: 本发明的目的是提供具有良好的印刷性能和良好的连续起始性能的聚酰亚胺油墨组合物,该组合物可以在不高于220℃的低温下干燥,并且该组合物在干燥后得到涂膜,具有 优异的尺寸稳定性,耐热性,低弹性模量,柔软性,抗翘曲性,耐化学性,与基材的粘合性和耐电镀性。 该目的通过用于印刷的聚酰亚胺油墨组合物实现,其包含含有苯甲酸酯溶剂和甘醇二甲醚溶剂的混合溶剂和可溶于混合溶剂的聚酰亚胺; 其中所述聚酰亚胺是通过将聚酰亚胺低聚物与其分子骨架中不含硅氧烷键的四羧酸二酐组分和/或二胺组分缩聚得到的,所述聚酰亚胺低聚物是通过使四羧酸二酐组分缩聚而制备的, 和在其基础催化剂存在下的分子骨架中具有硅氧烷键的二胺组分或包含内酯和/或酸性化合物和碱的混合催化剂, ; 基于总二胺成分的具有硅氧烷键的二胺成分的含量为15〜85重量%。

    Arc discharge suppressive terminal pair
    10.
    发明授权
    Arc discharge suppressive terminal pair 失效
    电弧放电抑制端子对

    公开(公告)号:US06860746B2

    公开(公告)日:2005-03-01

    申请号:US10372128

    申请日:2003-02-25

    IPC分类号: H01R13/03 H01R13/53

    CPC分类号: H01R13/03

    摘要: Provided is a pair of arc discharge suppressive terminals electrically communicable with each other by engagement of the terminal pair. At least one of the terminal pair has a final contact site which is in contact with the counterpart terminal at a final stage of disengagement of the terminal pair. At least the final contact site is covered with an arc discharge suppressive layer containing a first metal having a melting point of 1,550° C. or higher. It is preferable that the terminal pair contact with each other at a portion corresponding to a main contact site other than the arc discharge suppressive layer in a completely engaged state where the one of the terminal pair and the counterpart terminal are tightly engaged with each other. Preferably, the main contact site has a surface made of a material having a higher conductivity than the arc discharge suppressive layer. This arrangement effectively suppresses occurrence of arc discharge at a time of disengagement of the terminal pair.

    摘要翻译: 提供一对电弧放电抑制端子,其通过端子对的接合而彼此电连接。 终端对中的至少一个具有在终端对的分离的最后阶段与对方终端接触的最终接触部位。 至少最终的接触部位用含有熔点为1550℃以上的第一金属的电弧放电抑制层覆盖。 优选地,端子对在与电弧放电抑制层以外的主接触部位相对应的部分处于完全接合状态,其中端子对和对应端子之一彼此紧密接合。 优选地,主接触部位具有由比电弧放电抑制层更高的导电性的材料制成的表面。 这种布置有效地抑制了端子对脱离时电弧放电的发生。