公开(公告)号：US09240364B2

公开(公告)日：2016-01-19

申请号：US14202006

申请日：2014-03-10

申请人： Baek Soung Park ,  Jae Won Choi ,  In Hwan Kim ,  Gyu Seok Song ,  Su Mi Lim

发明人： Baek Soung Park ,  Jae Won Choi ,  In Hwan Kim ,  Gyu Seok Song ,  Su Mi Lim

IPC分类号： H01L23/48 ,  H01L23/373 ,  H01L23/36 ,  H01L21/48 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L23/3737 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/36 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/00012

摘要： A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.

摘要翻译： 散热粘合膜，包含该半导体装置的半导体装置以及制造该半导体装置的方法，散热粘合剂膜可放置在其中包围半导体元件的保护层与保护层上的散热金属层之间 散热金属层的保护层，其中散热粘合剂膜和保护层之间的粘合强度以及散热粘合剂膜和散热金属层之间的粘合强度分别为约3kgf / 25mm 2或更大 。

公开(公告)号：US09957425B2

公开(公告)日：2018-05-01

申请号：US14204128

申请日：2014-03-11

申请人： Jun Woo Lee ,  Sung Min Kim ,  In Hwan Kim ,  Baek Soung Park ,  Su Mi Lim ,  Jae Won Choi

发明人： Jun Woo Lee ,  Sung Min Kim ,  In Hwan Kim ,  Baek Soung Park ,  Su Mi Lim ,  Jae Won Choi

IPC分类号： C09J163/00 ,  H01L23/00 ,  C09J7/00 ,  C08L63/00 ,  C08K5/00 ,  C08K5/3445

CPC分类号： C09J163/00 ,  C08K5/0025 ,  C08K5/3445 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/05442 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

公开(公告)号：US09287217B2

公开(公告)日：2016-03-15

申请号：US14315495

申请日：2014-06-26

申请人： Baek Soung Park ,  Jae Won Choi ,  Sung Min Kim ,  In Hwan Kim ,  Jun Woo Lee ,  Su Ml Im

发明人： Baek Soung Park ,  Jae Won Choi ,  Sung Min Kim ,  In Hwan Kim ,  Jun Woo Lee ,  Su Ml Im

IPC分类号： H01L23/544 ,  H01L21/70 ,  C09J7/02 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L23/544 ,  C09J7/20 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L21/70 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2224/83191

摘要： A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.

摘要翻译： 一种切割芯片接合薄膜和一种在切割芯片接合薄膜中形成凹槽的方法，该薄膜包括一个基膜; 叠层在基膜上的压敏粘合剂层; 以及层叠在所述粘合剂层上的接合层，其中，所述压敏粘合剂层包括与所述接合层重叠的第一区域和与所述接合层不重叠的第二区域，所述第二区域包括与所述接合层相邻的第三区域 所述第一区域和与所述第三区域相邻并且在其中形成有凹槽的第四区域。

公开(公告)号：US09169425B2

公开(公告)日：2015-10-27

申请号：US13713679

申请日：2012-12-13

申请人： Hye Jin Kim ,  Jae Won Choi ,  Ji Ho Kim ,  Jin Man Kim ,  Gyu Seok Song

发明人： Hye Jin Kim ,  Jae Won Choi ,  Ji Ho Kim ,  Jin Man Kim ,  Gyu Seok Song

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  C09J163/00 ,  H01L23/00 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62

CPC分类号： C09J163/00 ,  C08G59/504 ,  C08G59/56 ,  C08G59/621 ,  H01L24/29 ,  H01L24/32 ,  H01L24/50 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00

摘要： An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.

摘要翻译： 粘合剂膜包括胺固化剂和酚类固化剂，并且在固化后在170℃下在80℃以上固化后的储能模量与在40℃下的储能模量之比在约1.5的范围内 至约3.0。

公开(公告)号：US20110159294A1

公开(公告)日：2011-06-30

申请号：US12981110

申请日：2010-12-29

申请人： Gyu Seok Song ,  Jong Pil Ho ,  Jae Won Choi ,  Su Mi Im ,  Ki Tae Song

发明人： Gyu Seok Song ,  Jong Pil Ho ,  Jae Won Choi ,  Su Mi Im ,  Ki Tae Song

IPC分类号： C08L63/02 ,  C08K3/36 ,  B32B27/38

CPC分类号： C09J163/00 ,  C08L33/04 ,  C08L61/06 ,  C08L2205/03 ,  Y10T428/31515

摘要： An attach film composition for semiconductor assembly includes a polymer binder, an epoxy resin, a phenolic epoxy curing agent, a curing accelerator, a silane coupling agent, and an inorganic filler. The attach film composition may have an exothermic peak start temperature of about 300° C. or more in curing, and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 150° C. for 1 hour and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 175° C. for 2 hours.

摘要翻译： 用于半导体组件的附着膜组合物包括聚合物粘合剂，环氧树脂，酚醛环氧固化剂，固化促进剂，硅烷偶联剂和无机填料。 附着膜组合物在固化时可以具有约300℃以上的放热峰开始温度，并且在150℃下固化后在175℃下的熔体粘度为约1.0×10 5至约5.0×10 6泊。对于 1小时，熔体粘度为约1.0×10 5至约5.0×10 6泊，175℃固化2小时。

公开(公告)号：US07419520B2

公开(公告)日：2008-09-02

申请号：US11213781

申请日：2005-08-30

申请人： Chang Ook Lee ,  Jae Won Choi

发明人： Chang Ook Lee ,  Jae Won Choi

IPC分类号： A47L9/20 ,  B08B5/04

CPC分类号： A47L9/0081 ,  A47L9/20 ,  Y10S55/02 ,  Y10S55/03

摘要： A dust collection unit for a vacuum cleaner includes a dust collection container for collecting foreign objects contained in air introduced therein, covers defining a top and bottom of the dust collection container, and a filter-cleaning unit having a plurality of brushes rotating around the porous filter unit to remove the foreign objects clogging the outer surface of the porous filter unit.

摘要翻译： 一种用于真空吸尘器的集尘装置，包括一个集尘容器，用于收集在其中引入的空气中所含的异物，限定集尘容器顶部和底部的盖子，以及一个过滤器清洁装置， 过滤器单元去除堵塞多孔过滤器单元外表面的异物。

公开(公告)号：US08598744B2

公开(公告)日：2013-12-03

申请号：US12870670

申请日：2010-08-27

申请人： Jae Won Choi ,  Chul Hun Seo ,  Eung Ju Kim ,  Jeong Hoon Kim ,  Kwang Du Lee ,  Sang Hoon Hwang ,  Jung Ho Yoon ,  Chul Gyun Park

发明人： Jae Won Choi ,  Chul Hun Seo ,  Eung Ju Kim ,  Jeong Hoon Kim ,  Kwang Du Lee ,  Sang Hoon Hwang ,  Jung Ho Yoon ,  Chul Gyun Park

IPC分类号： H01F27/42 ,  H01F37/00 ,  H01F38/00

CPC分类号： H01Q7/00 ,  H01Q15/0086 ,  H01Q19/062

摘要： Disclosed herein is there is provided an apparatus for transmitting and receiving wireless energy using meta-material structures having a negative refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. The wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially, using a magnetic resonance method while concentrating the wireless energy at a single point. The wireless energy reception unit wirelessly receives the wireless energy using the magnetic resonance method while concentrating the wireless energy at a single point.

摘要翻译： 本文公开了提供一种使用具有负折射率的超材料结构发送和接收无线能量的装置。 该装置包括无线能量传输单元和无线能量接收单元。 无线能量传输单元产生要无线传输的无线能量，然后通过磁共振方法无线传输通常在径向上传播的无线能量，同时将无线能量集中在单个点。 无线能量接收单元使用磁共振方法无线地接收无线能量，同时将无线能量集中在单个点。

公开(公告)号：US08319473B2

公开(公告)日：2012-11-27

申请号：US12833662

申请日：2010-07-09

申请人： Jae Won Choi ,  Eung Ju Kim ,  Kwang Du Lee ,  Chul Gyun Park ,  Jeong Hoon Kim ,  Jung Ho Yoon ,  Sang Hoon Hwang ,  Chul Hun Seo

发明人： Jae Won Choi ,  Eung Ju Kim ,  Kwang Du Lee ,  Chul Gyun Park ,  Jeong Hoon Kim ,  Jung Ho Yoon ,  Sang Hoon Hwang ,  Chul Hun Seo

IPC分类号： H01M10/46

CPC分类号： H02J50/12 ,  H02J5/005 ,  H02J50/40

摘要： Disclosed herein is a wireless energy transmission structure, which includes a printed circuit board, a disk section, and a wire section. The printed circuit board is formed in a ring type, the disk section is constituted by a first conductive plate and a second conductive plate formed on portions of the printed circuit board corresponding to each other to be spaced by a predetermined gap and a dielectric material inserted between the first conductive plate and the second conductive plate, and the wire section is constituted by a plurality of meta cells having a meta material structure, which are repetitively formed to surround the exterior and interior of the printed circuit board and a transmission line connected to each of the first conductive plate and the second conductive plate and surround the plurality of meta cells.

摘要翻译： 这里公开了一种无线能量传输结构，其包括印刷电路板，磁盘部分和电线部分。 印刷电路板形成为环形，盘部由第一导电板和第二导电板构成，第一导电板和第二导电板形成在印刷电路板的彼此对应的部分上，以间隔开预定的间隙，并且介电材料插入 在所述第一导电板和所述第二导电板之间，并且所述导线部分由多个元件结构构成，所述元件具有重复形成以围绕所述印刷电路板的外部和内部;以及传输线， 每个第一导电板和第二导电板，并且围绕多个元电池。

公开(公告)号：US20110204625A1

公开(公告)日：2011-08-25

申请号：US13028661

申请日：2011-02-16

申请人： Ha Young Cho ,  Jae Won Choi ,  Jin Seok Kim

发明人： Ha Young Cho ,  Jae Won Choi ,  Jin Seok Kim

IPC分类号： F16L23/00 ,  B29C45/14

CPC分类号： F02M37/106 ,  F02M37/103 ,  F02M2037/228

摘要： Disclosed is a flange for a fuel pump module, which includes an adhesion enhancing member so that there is no gap between a power supply terminal and a resin material for forming a flange, thus further increasing injection efficiency and sealing performance. A method of manufacturing such a flange is also provided.

摘要翻译： 公开了一种用于燃料泵组件的凸缘，其包括粘合增强构件，使得在供电端子和用于形成凸缘的树脂材料之间不存在间隙，因此进一步提高了喷射效率和密封性能。 还提供了制造这种凸缘的方法。

公开(公告)号：US07119229B2

公开(公告)日：2006-10-10

申请号：US10479057

申请日：2002-05-27

申请人： Wan Joo Kim ,  Kyoung Soo Kim ,  Myung Hwa Kim ,  Jong Yek Park ,  Jung Min Jang ,  Jae Won Choi ,  Dong Hoo Kim

发明人： Wan Joo Kim ,  Kyoung Soo Kim ,  Myung Hwa Kim ,  Jong Yek Park ,  Jung Min Jang ,  Jae Won Choi ,  Dong Hoo Kim

IPC分类号： C07C233/05 ,  A61K31/165

CPC分类号： C07C69/78 ,  C07C49/755 ,  C07C203/10 ,  C07C233/32 ,  C07C233/41 ,  C07C233/76 ,  C07C235/14 ,  C07C235/42 ,  C07C271/24 ,  C07C323/41 ,  C07C323/42 ,  C07C2603/34 ,  C07D307/93

摘要： Colchicine derivatives represented by the formula (I) with a halogen or nitric ester group, or pharmaceutically acceptable salts thereof, are described. Pharmaceutical compositions containing the same as effective components are also described. The colchicine derivatives were found to have anticancer, anti-proliferous and immunosuppressive function. Methods for preparing the colchicines derivatives are also provided.

摘要翻译： 描述了由式（I）表示的秋水仙碱衍生物与卤素或硝酸酯基或其药学上可接受的盐。 还描述了含有与有效成分相同的药物组合物。 发现秋水仙素衍生物具有抗癌，抗增殖和免疫抑制功能。 还提供了制备秋水仙碱衍生物的方法。