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    Methods for making large dimension, flexible piezoelectric ceramic tapes
    5.
    发明授权
    Methods for making large dimension, flexible piezoelectric ceramic tapes 有权
    制造大尺寸柔性压电陶瓷带的方法

    公开(公告)号：US07118990B1

    公开(公告)日：2006-10-10

    申请号：US11017470

    申请日：2004-12-20

    申请人： Baomin Xu ,  Steven A. Buhler ,  William S. Wong ,  Michael C. Weisberg ,  Scott E. Solberg ,  Karl A. Littau ,  Scott A. Elrod

    发明人： Baomin Xu ,  Steven A. Buhler ,  William S. Wong ,  Michael C. Weisberg ,  Scott E. Solberg ,  Karl A. Littau ,  Scott A. Elrod

    IPC分类号： H01L21/30 ,  H01L21/46

    CPC分类号： G01N29/245 ,  B06B1/0622 ,  G01L1/16 ,  G01N29/2475 ,  G01N2291/02827 ,  G01N2291/2694 ,  H01L27/20 ,  H01L41/313 ,  H01L41/314 ,  H01L41/47

    摘要： A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.

    摘要翻译： 一种用于制造检测/测试带的方法包括将材料沉积在至少一个第一基底的表面上以形成多个元件结构。 电极沉积在多个元件结构中的每一个的表面上，并且元件结构被结合到第二衬底，其中第二衬底是导电的或具有导电层，并且第二衬底承载在载体板上。 从元件结构中去除至少一个第一衬底，并且将第二侧电极沉积在多个元件结构中的每一个的第二表面上。 绝缘材料插入在元件结构周围以电隔离用于结合元件结构的两个基板。 然后将元件结构的第二面接合到另一个衬底，其中另一个衬底是导电的或具有导电层。 此后，移除携带第二基板的承载板。

    Methods to make piezoelectric ceramic thick film array and single elements and devices
    7.
    发明申请
    Methods to make piezoelectric ceramic thick film array and single elements and devices 失效
    制造压电陶瓷厚膜阵列和单元件和器件的方法

    公开(公告)号：US20090113685A1

    公开(公告)日：2009-05-07

    申请号：US11363849

    申请日：2006-02-28

    申请人： Baomin Xu ,  Steven A. Buhler ,  Michael C. Welsberg ,  William S. Wong ,  Scott E. Solberg ,  Karl A. Littau ,  John S. Fitch ,  Scott A. Elrod

    发明人： Baomin Xu ,  Steven A. Buhler ,  Michael C. Welsberg ,  William S. Wong ,  Scott E. Solberg ,  Karl A. Littau ,  John S. Fitch ,  Scott A. Elrod

    IPC分类号： H04R17/00

    CPC分类号： B41J2/161 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1637 ,  B41J2/1646 ,  H01L41/313 ,  H01L41/314 ,  H01L41/331 ,  H01L2221/68368 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/4981

    摘要： A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.In another embodiment, a material for a thick film element is deposited onto a surface of a first substrate to form a thick film element structure having a thickness of between greater than 10 μm to 100 μm. The at least one thick film element structure is bonded to a second substrate. Thereafter, the first substrate is removed from the at least one thick film element structure using a liftoff process which includes emitting, from a radiation source (such as a laser or other appropriate device), a beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the surface of the first substrate. The first substrate is substantially transparent at the wavelength of the beam, and the beam generates sufficient energy at the interface to break the attachment.

    摘要翻译： 制造至少一个压电元件的方法包括将压电陶瓷材料沉积到第一基板的表面上以形成至少一个压电元件结构。 然后在至少一个压电元件结构的表面上沉积电极。 接下来，将至少一个压电元件结构接合到第二基板，第二基板是导电的或具有导电层。 然后从至少一个压电元件结构去除第一衬底，并且第二侧电极沉积在至少一个压电元件结构的第二表面上。 执行极化操作以向至少一个压电元件结构提供压电特性。 在另一个实施例中，用于厚膜元件的材料沉积到第一基底的表面上以形成厚度大于10um至100μm的厚膜元件结构。 所述至少一个厚膜元件结构被结合到第二基板。 此后，使用包括从辐射源（例如激光或其它合适的装置）发射通过第一基板的光束到形成的附接接口的剥离过程，从至少一个厚膜元件结构中去除第一基板， 在第一基板和第一基板的表面处的至少一个厚膜元件结构之间。 第一衬底在光束的波长处基本上是透明的，并且光束在界面处产生足够的能量以破坏附件。

    Solar cell metallization using inline electroless plating
    8.
    发明授权
    Solar cell metallization using inline electroless plating 有权
    使用在线化学镀的太阳能电池金属化

    公开(公告)号：US09150966B2

    公开(公告)日：2015-10-06

    申请号：US12271408

    申请日：2008-11-14

    申请人： Baomin Xu ,  Karl A. Littau ,  Scott A. Elrod

    发明人： Baomin Xu ,  Karl A. Littau ,  Scott A. Elrod

    IPC分类号： B05D5/12 ,  C25D5/34 ,  H01B13/00 ,  C23C18/16 ,  C23C18/31 ,  H01L31/0224

    CPC分类号： C23C18/161 ,  C23C18/1632 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/31 ,  H01L31/022425 ,  Y02E10/50

    摘要： Inline methods for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell includes a semiconductor substrate having a passivation layer thereon, includes providing a plurality of contact openings through the passivation layer to the semiconductor substrate, selectively plating a contact metal into the plurality of contact openings by printing electroless plating solution into the plurality of contact openings to deposit the contact metal, depositing a metal containing material on the deposited contact metal, and firing the deposited contact metal and the deposited metal containing material. The metal containing material may include a paste containing a silver or silver alloy along with a glass frit and is substantially free to completely free of lead. The methods may also use light activation of the passivation layer or use seed layers to assist in the plating.

    摘要翻译： 用于形成光伏电池电极结构的在线方法，其中所述光伏电池包括其上具有钝化层的半导体衬底，包括提供通过所述钝化层到所述半导体衬底的多个接触开口，选择性地将接触金属电镀到所述多个接触中 通过将化学镀溶液印刷到多个接触开口中以沉积接触金属，在沉积的接触金属上沉积含金属的材料，以及烧结沉积的接触金属和沉积的含金属材料的开口。 含金属的材料可以包括含有银或银合金以及玻璃料的糊状物，并且基本上没有完全不含铅。 所述方法还可以使用钝化层的光激活或使用种子层来辅助镀覆。