Backplane and glass-based circuit board

    公开(公告)号:US12002916B2

    公开(公告)日:2024-06-04

    申请号:US17930514

    申请日:2022-09-08

    摘要: A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

    Light emitting plate, wiring plate and display device

    公开(公告)号:US11869921B2

    公开(公告)日:2024-01-09

    申请号:US17281443

    申请日:2020-01-21

    IPC分类号: H01L27/15 H01L33/38 H01L33/62

    摘要: A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes a base substrate; and light emitting units on the base substrate. Each of the light emitting units includes a light emitting sub-unit, the light emitting sub-unit includes a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes at least two electrical contact pairs, and each of the at least two electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one of the at least two electrical contact pairs in each connection line unit is connected with the light emitting diode chip.