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    Method of constructing a multilayer electric apparatus
    1.
    发明授权
    Method of constructing a multilayer electric apparatus 有权
    构造多层电气设备的方法

    公开(公告)号：US06591490B1

    公开(公告)日：2003-07-15

    申请号：US09743753

    申请日：2001-01-11

    申请人： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole ,  Edward J. Swenson

    发明人： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole ,  Edward J. Swenson

    IPC分类号： H05K336

    CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09918 ,  H05K2203/107 ,  Y10S707/99936 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49213 ,  Y10T29/5313

    摘要： A method of constructing a multilayer electric apparatus. The method includes forming a set of conductive features and a plurality of fiducial markings on a first dielectric layer in mutual reference to each other so that their relative positions are known to a first tolerance. Also, a pattern of information corresponding to a desired photoresist exposure pattern for a second layer of the multilayer electric apparatus is stored in a computer readable format. The locations of the fiducial markings on the first layer are measured and the pattern of information for the second layer is altered in correspondence to the measured locations of the fiducial markings. The updated pattern of information is used to control a laser to selectively expose the photoresist on the second layer. Finally, the first and second layers are joined to each other.

    摘要翻译： 一种构造多层电气设备的方法。 该方法包括在第一介电层上相互引用形成一组导电特征和多个基准标记，使得它们的相对位置已知为第一公差。 此外，以计算机可读格式存储对应于多层电气设备的第二层的期望的光致抗蚀剂曝光图案的信息图案。 测量第一层上的基准标记的位置，并且第二层的信息图案对应于基准标记的测量位置而改变。 更新的信息模式用于控制激光器以选择性地暴露第二层上的光致抗蚀剂。 最后，第一和第二层彼此连接。

    Method of creating an electrical interconnect device bearing an array of electrical contact pads
    3.
    发明授权
    Method of creating an electrical interconnect device bearing an array of electrical contact pads 有权
    制造具有电接触焊盘阵列的电互连装置的方法

    公开(公告)号：US06354000B1

    公开(公告)日：2002-03-12

    申请号：US09310873

    申请日：1999-05-12

    申请人： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole

    发明人： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole

    IPC分类号： H01K310

    CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0269 ,  H05K1/112 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09227 ,  H05K2201/09918 ,  H05K2201/10734 ,  H05K2203/107 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49213 ,  Y10T29/5313 ,  H01L2924/00

    摘要： A method of constructing a planar array of electrical contact pads is disclosed, comprising the following steps. First, providing a set of dielectric layers each having two major surfaces and forming a set of first conductive paths on a first major surface, the paths terminating at or before an interior perimeter, to leave an interior area within the interior perimeter free of conductive paths and an exterior area outside of the interior perimeter having the first conductive paths. Second, forming a set of second conductive paths on a second major surface, the second conductive paths terminating generally inside the interior perimeter. Third, joining the sets of dielectric layers to form a depthwise stack of layers, the stack of layers having a top surface and the first major surface being interposed depthwise between the top surface and the second major surface. Forth, forming an array of first and second electrical contact pads on the top surface, each first electrical contact pad overlaying a portion of the exterior area and each second electrical contact pad overlaying a portion of the interior area. Fifth and finally, forming a set of plated vias to connect each first electrical contact pad to a first conductive path and each second electrical contact pad to a second conductive path.

    摘要翻译： 公开了一种构成电接触焊盘的平面阵列的方法，包括以下步骤。 首先，提供一组各自具有两个主表面并且在第一主表面上形成一组第一导电路径的电介质层，所述路径终止于内部周边之间或之前，以在内部周边内部离开导电路径 以及具有第一导电路径的内部周边外部的外部区域。 第二，在第二主表面上形成一组第二导电路径，第二导电路径通常在内部周边内部终止。 第三，连接这些电介质层以形成层的深度叠层，所述层的堆叠具有顶表面，并且第一主表面在顶表面和第二主表面之间深深地插入。 其中，在顶表面上形成第一和第二电接触焊盘的阵列，每个第一电接触焊盘覆盖外部区域的一部分和覆盖内部区域的一部分的每个第二电接触焊盘。 第五，最后，形成一组电镀通孔，以将每个第一电接触焊盘连接到第一导电路径，将每个第二电接触焊盘连接到第二导电路径。