公开(公告)号：US06573803B1

公开(公告)日：2003-06-03

申请号：US09689295

申请日：2000-10-12

申请人： Bernhard Alphonso Ziegner ,  Robert John Sletten ,  Stephen R. Brown ,  May Kyi Cho ,  Noyan Kinayman

发明人： Bernhard Alphonso Ziegner ,  Robert John Sletten ,  Stephen R. Brown ,  May Kyi Cho ,  Noyan Kinayman

IPC分类号： H01P5107

CPC分类号： H01P5/107

摘要： A surface-mountable mm-wave signal source is provided. The surface-mountable mm-wave signal source comprises: a conductive metal base; a mm-wave signal source disposed over an upper portion of the metal base; a first radio frequency transmission line carrying a quasi-TEM signal from the mm-wave signal source, which is disposed over an upper portion of the metal base and proximate the signal source; a first mode transformer at least partially integrated into the upper portion of the metal base to convert the quasi-TEM signal carried by the planar transmission line into a rectangular waveguide mode signal; a waveguide well having upper and lower ends disposed within the base for carrying the rectangular waveguide mode signal from an upper portion of the base to a lower portion of the base; and a second mode transformer at least partially integrated into the lower portion of the base to convert the rectangular waveguide mode signal to a quasi-TEM signal within a second radio frequency transmission line. The mm-wave signal source preferably operates in a frequency range of from 35 to 94 GHz, more preferably a frequency range of 70 to 80 GHz.

摘要翻译： 提供了可表面安装的mm波信号源。 表面安装的mm波信号源包括：导电金属基底; 设置在所述金属基底的上部的mm波信号源; 携带来自mm波信号源的准TEM信号的第一射频传输线，其设置在金属基底的上部并且靠近信号源; 至少部分地集成到所述金属基座的上部的第一模式变压器，以将由所述平面传输线承载的准TEM信号转换为矩形波导模式信号; 波导阱，其具有设置在基座内的上端和下端，用于将矩形波导模式信号从基座的上部传送到基座的下部; 以及至少部分地集成到所述基座的下部中的第二模式变压器，以将所述矩形波导模式信号转换为第二射频传输线内的准TEM信号。 mm波信号源优选地在35至94GHz的频率范围内操作，更优选地在70至80GHz的频率范围内操作。

公开(公告)号：US6064286A

公开(公告)日：2000-05-16

申请号：US126616

申请日：1998-07-31

申请人： Bernhard Alphonso Ziegner ,  Robert John Sletten ,  Nitin Jain ,  Steve Robert Brown

发明人： Bernhard Alphonso Ziegner ,  Robert John Sletten ,  Nitin Jain ,  Steve Robert Brown

IPC分类号： H01L23/40 ,  H01L23/02 ,  H01L23/66 ,  H01L25/04 ,  H01L25/18 ,  H01P5/00

CPC分类号： H01L23/66 ,  H01L2924/0002

摘要： A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

摘要翻译： 一种封装集成电路（20,20a，20b），其包括至少一个波导端口（44,44a，44b）和至少一个互连（26,26a，26b），所述互连电连接到集成电路（30,30a， 30b）。

公开(公告)号：US06903541B2

公开(公告)日：2005-06-07

申请号：US09864123

申请日：2001-05-25

申请人： Bernhard Alphonso Ziegner ,  Robert John Sletten

发明人： Bernhard Alphonso Ziegner ,  Robert John Sletten

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K3/42 ,  G01R23/04

CPC分类号： H05K1/0237 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/4069 ,  H05K3/426 ,  H05K2201/0715 ,  H05K2201/09309

摘要： Flexible multilayer microwave or mm-wave circuits and sensors are provided having at least (a) a first metallization layer, at least a portion of the first metallization layer being adapted for operation at a frequency ranging from 20 GHz to 100 GHz; (b) a second metallization layer, at least a portion of the second metallization layer being adapted for operation as a ground plane; (c) a dielectric substrate layer, the dielectric substrate layer being disposed between the first and second metallization layers; and (d) a plurality of conductive vias extending through the dielectric substrate layer and electrically connecting portions of the first and second metallization layers.

摘要翻译： 提供柔性多层微波或毫米波电路和传感器，其具有至少（a）第一金属化层，第一金属化层的至少一部分适于在20GHz至100GHz的频率范围内操作; （b）第二金属化层，所述第二金属化层的至少一部分适于作为接地面工作; （c）电介质基底层，介电基片层设置在第一和第二金属化层之间; 和（d）延伸穿过电介质基底层并电连接第一和第二金属化层的部分的多个导电通路。

公开(公告)号：US5783857A

公开(公告)日：1998-07-21

申请号：US690418

申请日：1996-07-25

申请人： Bernhard Alphonso Ziegner ,  Robert John Sletten

发明人： Bernhard Alphonso Ziegner ,  Robert John Sletten

IPC分类号： H01L23/36 ,  H01L23/495 ,  H01L23/66 ,  H01L29/40

CPC分类号： H01L23/66 ,  H01L23/36 ,  H01L23/49555 ,  H01L23/49558 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

摘要： An IC package appropriate for microwave devices, integrated circuits, multichip modules, and hybrid circuit assemblies and power devices comprises an outer interconnect (2) and an inner interconnect (3). Lead lines (8) on an outer interconnect (2) are in electric engagement with respective access lines (13) on an inner interconnect (3). Contacts (21) of an IC are electrically interconnected with the access lines (13) on the inner interconnect (3). A package according to the teachings of the present invention provides for efficient heat dissipation from the package interior and an efficient electrical transition from the interior of a package.

摘要翻译： 适用于微波器件，集成电路，多芯片模块和混合电路组件和功率器件的IC封装包括外部互连（2）和内部互连（3）。 外部互连（2）上的引线（8）与内部互连（3）上的各个接入线（13）电接合。 IC的触点（21）与内部互连（3）上的接入线（13）电互连。 根据本发明的教导的包装提供了来自包装内部的有效散热和来自包装内部的有效的电过渡。