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    LED packaging structure
    1.
    发明授权
    LED packaging structure 有权
    LED封装结构

    公开(公告)号：US07049639B2

    公开(公告)日：2006-05-23

    申请号：US10855417

    申请日：2004-05-28

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

    摘要： An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

    摘要翻译： LED封装结构具有形成有两个孔的基板。 两个导电元件中的一个延伸穿过两个孔，以电连接到衬底的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过孔连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

    LED packaging structure
    2.
    发明申请
    LED packaging structure 有权
    LED封装结构

    公开(公告)号：US20050274957A1

    公开(公告)日：2005-12-15

    申请号：US10855417

    申请日：2004-05-28

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

    摘要： An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

    摘要翻译： LED封装结构具有形成有两个钻头的基板。 两个导电元件中的一个延伸穿过两个钻头，以电连接到基板的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过钻头以连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

    Water-cooling heat dissipation device adopted for modulized LEDs
    7.
    发明授权
    Water-cooling heat dissipation device adopted for modulized LEDs 有权

    公开(公告)号：US07140753B2

    公开(公告)日：2006-11-28

    申请号：US10915539

    申请日：2004-08-11

    申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

    发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

    IPC分类号： F21V29/00

    CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

    Water-cooling heat dissipation device adopted for modulized LEDs
    8.
    发明申请
    Water-cooling heat dissipation device adopted for modulized LEDs 有权
    模块化LED采用水冷散热装置

    公开(公告)号：US20060034085A1

    公开(公告)日：2006-02-16

    申请号：US10915539

    申请日：2004-08-11

    申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

    发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

    IPC分类号： F21V29/00

    CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

    摘要翻译： 一种用于照明模块的水冷散热装置，其包括模块化的多个LED，并且包括散热板，在散热板内凹入的至少一个弯曲槽，形成在所述散热板的一侧上的至少一个入口 选择性地形成散热片，以及至少一个出口选择性地形成在散热片的一侧上。 作为散热板的一部分产生的弯曲的管道横向延伸并且包括布置在其上的至少一个弯曲部分。 入口和出口分别与弯曲部分和弯曲管道的自由端分别连通。 照明模块直接接触散热装置的顶部。