公开(公告)号：US20130264970A1

公开(公告)日：2013-10-10

申请号：US13441025

申请日：2012-04-06

申请人： Yew Cheong Kuan ,  Craige William Hardin ,  Man Ngok Chu ,  Thye Linn Mok ,  Yung-Ching Hu ,  Hsien-Ming Wang ,  Heng-Yen Lee

发明人： Yew Cheong Kuan ,  Craige William Hardin ,  Man Ngok Chu ,  Thye Linn Mok ,  Yung-Ching Hu ,  Hsien-Ming Wang ,  Heng-Yen Lee

IPC分类号： H05B33/02 ,  H05B33/10

CPC分类号： H01L33/60 ,  F21K9/232 ,  F21S8/00 ,  F21V3/02 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Light emitter components with improved light extraction and related methods are disclosed. In one embodiment, the light emitter component can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over a portion of the light emitting chip. The lens can include an optical element. The optical element can be configured to affect light output from the at least one light emitting chip.

摘要翻译： 公开了具有改进的光提取和相关方法的发光体部件。 在一个实施例中，光发射器部件可以包括底座，设置在基座上的至少一个发光芯片和设置在发光芯片的一部分上的透镜。 透镜可以包括光学元件。 光学元件可被配置为影响来自至少一个发光芯片的光输出。

公开(公告)号：US20060261455A1

公开(公告)日：2006-11-23

申请号：US11488852

申请日：2006-07-19

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC分类号： H01L23/02

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

摘要翻译： 描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。 金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。 绝缘体内的第一和第二触点彼此电隔离。 第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

公开(公告)号：US20060214273A1

公开(公告)日：2006-09-28

申请号：US11085100

申请日：2005-03-22

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC分类号： H01L23/02

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

公开(公告)号：USD506187S1

公开(公告)日：2005-06-14

申请号：US29214779

申请日：2004-10-12

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

设计人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

公开(公告)号：US07140753B2

公开(公告)日：2006-11-28

申请号：US10915539

申请日：2004-08-11

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

公开(公告)号：US20060034085A1

公开(公告)日：2006-02-16

申请号：US10915539

申请日：2004-08-11

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

摘要翻译： 一种用于照明模块的水冷散热装置，其包括模块化的多个LED，并且包括散热板，在散热板内凹入的至少一个弯曲槽，形成在所述散热板的一侧上的至少一个入口 选择性地形成散热片，以及至少一个出口选择性地形成在散热片的一侧上。 作为散热板的一部分产生的弯曲的管道横向延伸并且包括布置在其上的至少一个弯曲部分。 入口和出口分别与弯曲部分和弯曲管道的自由端分别连通。 照明模块直接接触散热装置的顶部。

公开(公告)号：US07211882B2

公开(公告)日：2007-05-01

申请号：US11085100

申请日：2005-03-22

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC分类号： H01L23/02

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

摘要翻译： 描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。 金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。 绝缘体内的第一和第二触点彼此电隔离。 第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

公开(公告)号：US07049639B2

公开(公告)日：2006-05-23

申请号：US10855417

申请日：2004-05-28

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

摘要： An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

摘要翻译： LED封装结构具有形成有两个孔的基板。 两个导电元件中的一个延伸穿过两个孔，以电连接到衬底的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过孔连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

公开(公告)号：US20050274957A1

公开(公告)日：2005-12-15

申请号：US10855417

申请日：2004-05-28

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

摘要： An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

摘要翻译： LED封装结构具有形成有两个钻头的基板。 两个导电元件中的一个延伸穿过两个钻头，以电连接到基板的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过钻头以连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。