摘要:
A memory decoder system is disclosed. In an exemplary embodiment of the invention, the system includes a matrix of memory cells, arranged into rows and columns, with a plurality of wordline drivers corresponding to each row in the matrix. A group of wordline driver-decoder blocks each contains a subset of the plurality of wordline drivers therein, with each of the wordline driver-decoder blocks being separated by a row control block. The row control block includes control circuitry for the wordline drivers. For any given wordline driver-decoder block, a first group of wordline drivers contained therein is controlled by a row control block located on one side of the given wordline driver-decoder block, while a second group of wordline drivers contained therein is controlled by a row control block located on an opposite side of the given wordline driver-decoder block.
摘要:
Integrated circuits having combined memory and logic functions are provided. In one aspect, an integrated circuit is provided. The integrated circuit comprises: a substrate comprising a silicon layer over a BOX layer, wherein a select region of the silicon layer has a thickness of between about three nanometers and about 20 nanometers; at least one eDRAM cell comprising: at least one pass transistor having a pass transistor source region, a pass transistor drain region and a pass transistor channel region formed in the select region of the silicon layer; and a capacitor electrically connected to the pass transistor.
摘要:
A converter circuit and methods for operating the same. The converter circuit includes a supply voltage, a capacitor, an inductor, and four stacked switching elements. Each switching element is adjustable from a low resistance state to a high resistance state by a control signal. The inductor outputs current to a circuit load. The circuit may be operated in a first mode such that the output is adjustable between the supply voltage and half the supply voltage. Alternatively, in a second mode of operation, the output is adjustable from half the supply voltage to a ground voltage.
摘要:
A three-dimensional (3D) chip stack structure and method of fabricating the structure thereof are provided. The 3D chip stack structure includes a plurality of vertically stacked chips which are interconnected and bonded together, wherein each of the vertically stacked chips include one or more IC device strata. The 3D chip stack structure further includes an air channel interconnect network embedded within the chip stack structure, and wherein the air channel interconnect network is formed in between at least two wafers bonded to each other of the vertically stacked wafers and in between at least two bonded wafers of the vertically stacked wafers at a bonding interface thereof. In addition, the 3D chip stack structure further includes one or more openings in a peripheral region of the chip stack structure that lead into and out of the air channel interconnect network, so that air can flow into and out of the air channel interconnect network through the one or more openings to remove heat from the chip stack structure.
摘要:
Integrated circuits having combined memory and logic functions are provided. In one aspect, an integrated circuit is provided. The integrated circuit comprises: a substrate comprising a silicon layer over a BOX layer, wherein a select region of the silicon layer has a thickness of between about three nanometers and about 20 nanometers; at least one eDRAM cell comprising: at least one pass transistor having a pass transistor source region, a pass transistor drain region and a pass transistor channel region formed in the select region of the silicon layer; and a capacitor electrically connected to the pass transistor.
摘要:
A method of forming a field effect transistor (FET) capacitor includes forming a channel region; forming a gate stack over the channel region; forming a first extension region on a first side of the gate stack, the first extension region being formed by implanting a first doping material at a first angle such that a shadow region exists on a second side of the gate stack; and forming a second extension region on the second side of the gate stack, the second extension region being formed by implanting a second doping material at a second angle such that a shadow region exists on the first side of the gate stack.
摘要:
A CMOS device includes a silicon substrate and an electrical insulator formed over the silicon substrate. The device also includes an access pFET formed over the electrical insulator and a first gate stack and a storage pFET formed over the electrical insulator, the storage pFET including a second source region that is co-formed with the first drain region, a second channel region, and a second drain region. The device also includes a second gate stack including a second dielectric layer formed above the second channel region and a floating gate electrode formed above the second gate dielectric layer.
摘要:
Content addressable memory device utilizing phase change devices. An aspect of the content addressable memory device is the use of a comparatively lower power search-line access element and a comparatively higher power word-line access element. The word-line access element is only utilized during write operations and the search-line access element is only utilized during search operations. The word-line access element being electrically coupled to a second end of a phase change memory element and a word-line. The search-line access element also being electrically coupled to the second end of the phase change memory element and a search-line. The search-line being electrically coupled to a match-line. A bit-line is electrically coupled to a first end of the phase change memory element. Additionally, a complementary set of access elements, a complementary phase change memory element, a complementary search-line, and a complementary bit-line are also included in the content addressable memory device.
摘要:
A dynamic random access memory circuit has at least one write bit line, at least one read bit line, a capacitive storage device, a write access device operatively coupled to the capacitive storage device and the at least one write bit line, a sense amplifier operatively coupled to the at least one read bit line and configured to generate an output signal, and a refresh bypass device operatively associated with the sense amplifier and the at least one write bit line so as to selectively pass the output signal to the at least one write bit line.
摘要:
A plasma etching system having a wafer chuck with a magnet that applies a magnetic field over a wafer to shield the wafer from charged particles. The magnetic field is parallel with the wafer, and is strongest near the wafer surface. The magnetic field may be straight, or circular. In operation, electrons are deflected from the wafer by the Lorentz force, the wafer acquires a positive charge, and ions are deflected by electrostatic repulsion. Neutral species are allowed through the magnetic field, and they collide with the wafer. Neutral species generally provide more isotropic and material-selective etching than charged particles, so the present magnetic field tends to increase etch isotropy and material selectivity. Also, the magnetic field can protect the wafer from seasoning processes designed to clean unwanted films from the chamber surface as seasoning processes typically rely on etching by charged particles.