摘要:
A charge coupled device imager, which can operate in time delay and integration mode, can be adapted to include variable columns having one or more blocking gates or other barriers that can be independently controlled and used to divide a used portion from an unused portion. The blocking gates may require less power to electrically insulate used from the unused sections. In this regard, an imager's charge handling capacity and dynamic range can be improved, while lowering CCD operating power requirements. Blooming drains can also be included to enhance the functionality of the imager and enable bidirectional imaging capability.
摘要:
A charge coupled device imager, which can operate in time delay and integration mode, can be adapted to include variable columns having one or more blocking gates or other barriers that can be independently controlled and used to divide a used portion from an unused portion. The blocking gates may require less power to electrically insulate used from the unused sections. In this regard, an imager's charge handling capacity and dynamic range can be improved, while lowering CCD operating power requirements. Blooming drains can also be included to enhance the functionality of the imager and enable bidirectional imaging capability.
摘要:
An Indium Tin Oxide (ITO) gate charge coupled device (CCD) is provided. The CCD device comprises a CCD structure having a substrate layer, an oxide layer over the substrate layer, a nitride layer over the oxide layer and a plurality of parallel ITO gates extending over the nitride layer. The CCD device further comprises a plurality of substantially similarly sized channel stop regions in the substrate layer that extend transversely relative to the ITO gates, such that a given pair of channel stop regions defining a pixel column of the CCD structure. The CCD device also comprises a plurality of vent openings that extend through the nitride layer along the plurality of substantially similarly sized channel stop regions to allow for penetration of hydrogen to at least one of the oxide layer and the substrate layer.
摘要:
A scanning focal plane sensor and method are described for image capturing of object space (or scenes). In one example, a focal plane sensor for a scanning imaging system is provided. The focal plane sensor for a scanning imaging system includes M×N Time Delay Integration (TDI) imaging Charge Coupled Device (CCD), where M is a number of TDI columns and N is a number of TDI stages per each column. A detector is connected to each TDI stage. The focal plane sensor includes an imaging controller configured to mechanize sampling the brightness value of each sensor pixel's initial footprint in object space and select a number of charge integrating TDI stages for substantially equalizing the inter sensor pixels' signal to noise ratios.
摘要:
An Indium Tin Oxide (ITO) gate charge coupled device (CCD) is provided. The CCD device comprises a CCD structure having a substrate layer, an oxide layer over the substrate layer, a nitride layer over the oxide layer and a plurality of parallel ITO gates extending over the nitride layer. The CCD device further comprises a plurality of substantially similarly sized channel stop regions in the substrate layer that extend transversely relative to the ITO gates, such that a given pair of channel stop regions defining a pixel column of the CCD structure. The CCD device also comprises a plurality of vent openings that extend through the nitride layer along the plurality of substantially similarly sized channel stop regions to allow for penetration of hydrogen to at least one of the oxide layer and the substrate layer.
摘要:
A high sensitivity, high speed, and low noise, semiconductor non-destructive read-out (NDRO) device (700) for the conversion of a generated signal charge (110) into an output voltage having provisions for charge integration, charge transfer, and nondestructive charge read-out without kTC reset noise. The read-out device (700) includes charge sensing potential wells (520), a MOSFET having a gate (705), a source (145), and a drain (720), a feedback amplifier (305), a current generator (310), a reset gate (650), a reset drain (530), a multiplexer gate (820), and a pair of adjacent CCD transfer gates (750 and 760). CMOS detector pixels with this NDRO form a compact structure for integrating generated charge, and high sensitivity readout, without kTC reset noise. The NDRO in CCD devices provides a fast sensitive charge to voltage transducer without kTC reset noise. Connecting several NDRO stages in series (1000) provides multiple readout of a pixel to further improve sensitivity and performance of charge to voltage transduction.
摘要:
A method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements. Such a system may embody a bolometer, which is well suited for detecting electromagnetic radiation between 90 GHz and 30 THz while operating at room temperature. The method also discloses a generalized process for manufacturing circuitry incorporating active and passive micro-electrical-mechanical systems in a silicon wafer.
摘要:
Electro-thermal feedback is utilized for zeroing the thermal conductance between a bolometer type detector element of a pixel in a thermal radiation sensor assembly and the environments through its mechanical support structure and electrical interconnects, thereby limiting the thermal conductance primarily through photon radiation. Zeroing of the thermal conductance associated with the mechanical support and electrical readout interconnect structures is achieved by electro-thermal feedback that adjust the temperature of an intermediate stage by the heating effect of a bipolar transistor amplifier circuit so that the temperature across the mechanical support and electrical interconnects structures are zeroed thereby greatly improving the thermal isolation, the responsivity and sensitivity of the electromagnetic radiation sensor.
摘要:
Electro-thermal feedback is utilized for removing thermal conductance between a bolometer's absorber element of a pixel in a thermal radiation sensor assembly and the environments through its mechanical support structure and electrical interconnects, thereby limiting the thermal conductance primarily through photon radiation. Zeroing the thermal conductance associated with the mechanical support structure and electrical interconnects is achieved by electro-thermal feedback that adjust the temperature of an intermediate stage of the mechanical support structure and electrical interconnects to equal the bolometer's absorber element temperature.
摘要:
This is superconducting infrared sensor for producing output through a superconducting transformer. An increase in infrared light level causes a drop in current through a high temperature oxide superconductor film and its series primary winding and thereby causing an increase in current through a reference resistor and its series primary winding, and as the two primary windings are in bucking relationship, the change in current in the secondary is the sum of the absolute values of the changes in current through the high temperature oxide superconductor film and the reference resistor, and thus the current in the secondary of the transformer is a function of the infrared light level on the granular high temperature oxide superconductor film. A constant bias current source is connected in a manner so that the first series combination and the second series combination are in parallel with respect to the current source. The current source provides a bias current through the high temperature oxide superconductor film which is at least equal to the critical current of the high temperature oxide superconductor film when the infrared light level on the high temperature oxide superconductor film is essentially zero. Preferably, the reference resistor and the high temperature oxide superconductor film have resistances which are essentially equal when the infrared light level on the high temperature oxide superconductor film is essentially zero. The sensor is very sensitive to infrared, but relatively insensitive to noise in the bias current.