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公开(公告)号：US09077795B2
公开(公告)日：2015-07-07
申请号：US13421487
申请日：2012-03-15
CPC分类号： H04M1/0277 , F16B21/186 , Y10T24/45262 , Y10T24/45623 , Y10T24/45984 , Y10T29/49826
摘要： Latch mechanism devices for attaching components within a device and methods of use are provided herein. In one aspect, the latch mechanism includes a pair of deflectable members between which a protruding latch member, such as a latch pin, is inserted thereby separating the deflectable members. A latch pin can have a distal insertion portion and a proximal locking portion, the locking portion having a reduced profile so as to resiliently receive the deflectable members displaced by insertion of the latch pin so as to couple the latch pin between the cords. The latch pin can have insertion faces and locking faces angled so as to control the force required to insert and retract the latch pin from the cord pair. The latch mechanism may utilize releasing mechanisms for separating or reducing tension in the deflectable members to facilitate retraction of the latch pin.
摘要翻译： 本文提供了用于附接装置内的部件的锁定机构装置和使用方法。 在一个方面，闩锁机构包括一对可偏转构件，在其间插入突出的闩锁构件，例如闩锁销，由此分离可偏转构件。 闩锁销可以具有远侧插入部分和近侧锁定部分，锁定部分具有减小的轮廓，以便弹性地接收通过插入闩锁销移动的可偏转部件，从而将闩锁销连接在电线之间。 闩锁销可以具有成角度的插入面和锁定面，以便控制将插销从线对插入和缩回所需的力。 闩锁机构可以利用用于分离或减小可偏转构件中的张力的释放机构，以便于闩锁销的缩回。
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公开(公告)号：US20130239372A1
公开(公告)日：2013-09-19
申请号：US13421487
申请日：2012-03-15
CPC分类号： H04M1/0277 , F16B21/186 , Y10T24/45262 , Y10T24/45623 , Y10T24/45984 , Y10T29/49826
摘要： Latch mechanism devices for attaching components within a device and methods of use are provided herein. In one aspect, the latch mechanism includes a pair of deflectable members between which a protruding latch member, such as a latch pin, is inserted thereby separating the deflectable members. A latch pin can have a distal insertion portion and a proximal locking portion, the locking portion having a reduced profile so as to resiliently receive the deflectable members displaced by insertion of the latch pin so as to couple the latch pin between the cords. The latch pin can have insertion faces and locking faces angled so as to control the force required to insert and retract the latch pin from the cord pair. The latch mechanism may utilize releasing mechanisms for separating or reducing tension in the deflectable members to facilitate retraction of the latch pin.
摘要翻译： 本文提供了用于附接装置内的部件的锁定机构装置和使用方法。 在一个方面，闩锁机构包括一对可偏转构件，在其间插入突出的闩锁构件，例如闩锁销，由此分离可偏转构件。 闩锁销可以具有远侧插入部分和近侧锁定部分，锁定部分具有减小的轮廓，以便弹性地接收通过插入闩锁销移动的可偏转部件，从而将闩锁销连接在电线之间。 闩锁销可以具有成角度的插入面和锁定面，以便控制将插销从线对插入和缩回所需的力。 闩锁机构可以利用用于分离或减小可偏转构件中的张力的释放机构，以便于闩锁销的缩回。
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公开(公告)号：US20140055961A1
公开(公告)日：2014-02-27
申请号：US13593352
申请日：2012-08-23
CPC分类号： H05K3/1216 , H05K1/183 , H05K3/1225 , H05K3/3436 , H05K3/3484 , H05K2201/09036 , Y10T29/49144 , Y10T29/49155
摘要： Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations.
摘要翻译： 印刷电路板设有凹槽安装部件。 组件可以安装在印刷电路板基板的大于该部件的表面中的凹部内。 可以使用焊接模板将组件安装在凹槽中。 焊料模板可以在平坦部分和凹陷部分之间具有弯曲部分。 凹部的横向宽度和部件的横向宽度的差异可以被配置为允许平面部分和凹陷部分抵靠印刷电路板的表面放置，而不会在焊接应用过程中损坏凹部的边缘。 可以通过在板形成操作期间将具有大于凹入安装部件的尺寸和形状的尺寸和形状放置在印刷电路板的一部分上的方式来形成凹部。
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公开(公告)号：US20130343015A1
公开(公告)日：2013-12-26
申请号：US13530038
申请日：2012-06-21
CPC分类号： H05K7/1417 , G06F1/183 , H05K1/0201 , H05K1/0204 , H05K1/0215 , H05K1/09 , H05K1/11 , H05K3/42 , H05K5/0043 , H05K5/0047 , H05K5/0052 , H05K5/0073 , H05K2201/0314
摘要： An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes.
摘要翻译： 电子设备可以设置有具有填充通孔的印刷电路板。 填充的通孔可以由印刷电路板基板中的开口和开口中的弹性体构件形成。 弹性体构件可以是导电弹性构件，例如导电或导热的弹性构件。 印刷电路板可以使用延伸穿过填充通孔的接合构件固定在电子设备的壳体内。 接合构件可以与壳体接合或者与附接到壳体的附加接合构件接合。 电子设备可以包括形成在印刷电路板的表面上的电子部件上的整流罩结构。 整流罩结构可以使用与填充通孔中的接合构件接合的附接构件固定到印刷电路板。
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公开(公告)号：US09648744B2
公开(公告)日：2017-05-09
申请号：US13610701
申请日：2012-09-11
CPC分类号： H05K1/18 , G06F1/1658 , G06K13/0825 , H04M2250/14 , H05K1/117 , H05K1/183 , H05K3/00 , H05K3/30 , H05K7/02 , H05K2201/09036 , H05K2201/09063 , H05K2201/09163 , Y10T29/49124 , Y10T29/4913
摘要： Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
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公开(公告)号：US08988890B2
公开(公告)日：2015-03-24
申请号：US13598308
申请日：2012-08-29
IPC分类号： H05K7/00
CPC分类号： H05K3/341 , H05K3/0052 , H05K2201/0394 , H05K2201/09063 , H05K2201/1031 , H05K2201/1034 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.
摘要翻译： 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。
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公开(公告)号：US20140063769A1
公开(公告)日：2014-03-06
申请号：US13598308
申请日：2012-08-29
CPC分类号： H05K3/341 , H05K3/0052 , H05K2201/0394 , H05K2201/09063 , H05K2201/1031 , H05K2201/1034 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.
摘要翻译： 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。
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公开(公告)号：US20140029206A1
公开(公告)日：2014-01-30
申请号：US13610701
申请日：2012-09-11
CPC分类号： H05K1/18 , G06F1/1658 , G06K13/0825 , H04M2250/14 , H05K1/117 , H05K1/183 , H05K3/00 , H05K3/30 , H05K7/02 , H05K2201/09036 , H05K2201/09063 , H05K2201/09163 , Y10T29/49124 , Y10T29/4913
摘要： Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
摘要翻译： 电子设备设置有可喷射部件组件。 每个可弹出的部件组件可以包括托盘，该托盘可以装载有一个或多个类型的可拆卸模块，例如mini-SIM卡和微型SIM卡，并插入到该装置中。 每个组件还可以包括联接到电路板的盖。 托盘可以插入电子设备中的开口并进入盖和电路板之间的空间。 空间的一部分被包含在口袋内。 当托盘插入设备中时，托盘的一部分可以容纳在口袋内，用于将模块保持在设备内的功能插入位置。
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公开(公告)号：US20130242150A1
公开(公告)日：2013-09-19
申请号：US13420244
申请日：2012-03-14
CPC分类号： G03B9/08 , G03B2205/0076 , H04N5/2254
摘要： An electronic device may be provided with shape memory structures. The shape memory structures may be used to form actuators for a camera shutter, an actuator for moving an optical filter, or other actuators in an electronic device. A camera shutter may have an opaque shutter member that is movable between a first position in which the shutter is closed and blocks light from a digital image sensor and a second position in which the shutter is open and allows light to reach the digital image sensor. The camera shutter may have an associated color filter structure. Shape memory wire may be configured to form a loop that heats upon application of a signal or may be configured to form a twisting or linear actuator. The camera shutter may be provided with a controllable aperture.
摘要翻译： 电子设备可以设置有形状记忆结构。 形状记忆结构可用于形成用于照相机快门的致动器，用于移动光学过滤器的致动器或电子设备中的其它致动器。 相机快门可以具有不透明的快门部件，其可以在其中关闭快门的第一位置和来自数字图像传感器的第一位置和快门打开的第二位置之间移动，并允许光到达数字图像传感器。 相机快门可以具有相关联的滤色器结构。 形状记忆线可以被配置成形成在施加信号时加热的环，或者可以被配置成形成扭转或线性的致动器。 相机快门可以设置有可控的孔。
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公开(公告)号：US08927881B2
公开(公告)日：2015-01-06
申请号：US13607440
申请日：2012-09-07
申请人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
发明人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
IPC分类号： H05K7/14
CPC分类号： H01Q1/243
摘要： Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
摘要翻译： 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。
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