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    Semiconductor light emitting device
    7.
    发明授权
    Semiconductor light emitting device 有权
    半导体发光器件

    公开(公告)号：US07732802B2

    公开(公告)日：2010-06-08

    申请号：US12103553

    申请日：2008-04-15

    申请人： Bum Chul Cho ,  Seung Hyun Yang

    发明人： Bum Chul Cho ,  Seung Hyun Yang

    IPC分类号： H01L31/00

    CPC分类号： H01L33/10 ,  H01L33/007 ,  H01L33/20

    摘要： Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a substrate comprising a reflective pattern with a valley, a first nitride semiconductor layer on the substrate, an air gap formed between the reflective pattern and the first nitride semiconductor layer, an active layer on the first nitride semiconductor layer, and a second nitride semiconductor layer on the active layer.

    摘要翻译： 公开了一种半导体发光器件。 半导体发光器件包括：基板，包括具有谷的反射图案，基板上的第一氮化物半导体层，形成在反射图案和第一氮化物半导体层之间的气隙，第一氮化物半导体层上的有源层， 和有源层上的第二氮化物半导体层。

    Light emitting device
    8.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08395181B2

    公开(公告)日：2013-03-12

    申请号：US13238976

    申请日：2011-09-21

    申请人： Bum Chul Cho

    发明人： Bum Chul Cho

    IPC分类号： H01L33/48 ,  H01L33/62

    CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.

    摘要翻译： 发光器件包括封装体，发光二极管，透明树脂材料和导线。 包装体包括底部和侧部。 底部包括分别电连接底部的上表面和底表面的第一电极和第二电极。 侧部包括上表面，其包括沟槽和底面与底部的上表面接触，其中底部的上表面低于侧部的上表面，使得包装体包括 由侧面包围的空腔，底部的底面包括分割第一电极和第二电极的第二开口部分，并且其中透明树脂材料的一部分设置在沟槽内部。

    LIGHT EMITTING DEVICE
    9.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20120068203A1

    公开(公告)日：2012-03-22

    申请号：US13238976

    申请日：2011-09-21

    申请人： Bum Chul Cho

    发明人： Bum Chul Cho

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.

    摘要翻译： 发光器件包括封装体，发光二极管，透明树脂材料和导线。 包装体包括底部和侧部。 底部包括分别电连接底部的上表面和底表面的第一电极和第二电极。 侧部包括上表面，其包括沟槽和底面与底部的上表面接触，其中底部的上表面低于侧部的上表面，使得包装体包括 由侧面包围的空腔，底部的底面包括分割第一电极和第二电极的第二开口部分，并且其中透明树脂材料的一部分设置在沟槽内部。

    Light emitting apparatus, and method for manufacturing the same, and lighting system
    10.
    发明授权
    Light emitting apparatus, and method for manufacturing the same, and lighting system 有权
    发光装置及其制造方法以及照明系统

    公开(公告)号：US08039865B2

    公开(公告)日：2011-10-18

    申请号：US12720228

    申请日：2010-03-09

    申请人： Bum Chul Cho

    发明人： Bum Chul Cho

    IPC分类号： H01L33/00

    CPC分类号： H01L33/642 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01L2924/00014

    摘要： A light emitting apparatus includes: a substrate including a first conductive type impurity; a first heatsink and a second heatsink on a first region and a second region of the substrate; second conductive type impurity regions on the substrate and electrically connected to the first heatsink and the second heatsink, respectively; a first electrode electrically connected to the first heatsink on the substrate; a second electrode electrically connected to the second heatsink on the substrate; and a light emitting device electrically connected to the first electrode and the second electrode on the substrate.

    摘要翻译： 发光装置包括：包括第一导电类型杂质的衬底; 在衬底的第一区域和第二区域上的第一散热器和第二散热器; 第二导电型杂质区，分别与第一散热器和第二散热器电连接; 电连接到所述基板上的所述第一散热器的第一电极; 与基板上的第二散热器电连接的第二电极; 以及电连接到基板上的第一电极和第二电极的发光器件。