公开(公告)号：US07134196B2

公开(公告)日：2006-11-14

申请号：US10812017

申请日：2004-03-30

申请人： Bunji Moriya ,  Seiichi Tajima ,  Fumikachi Kurosawa ,  Shinichiro Hayashi

发明人： Bunji Moriya ,  Seiichi Tajima ,  Fumikachi Kurosawa ,  Shinichiro Hayashi

IPC分类号： H05K3/30

CPC分类号： H01L23/3121 ,  C25D5/10 ,  C25D17/28 ,  H01L21/56 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K3/284 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/48 ,  H01L2224/05644

摘要： In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

公开(公告)号：US06320604B1

公开(公告)日：2001-11-20

申请号：US09604000

申请日：2000-06-26

申请人： Bunji Moriya ,  Shinichiro Hayashi ,  Kazuhito Uchida

发明人： Bunji Moriya ,  Shinichiro Hayashi ,  Kazuhito Uchida

IPC分类号： B41J235

CPC分类号： B41J2/35

摘要： A multi power type thermal head which has a heating element for producing heat with different energies, an added resistor being connected to the heating element, first switch element for controlling the heating element in an operation state or a nonoperational state, and second switch element for controlling the heating element and the added resistor in an operation state or a nonoperational state. To control the thermal head in a first energy state, heating the heating element is controlled by the first switching element. To control the thermal head in a second energy state, the heating element and the added resistor are controlled by the second switching element with the heating element and the added resistor connected in series.

摘要翻译： 一种多功率型热敏头，其具有用于以不同能量产生热量的加热元件，连接到加热元件的附加电阻器，用于控制加热元件处于操作状态或非工作状态的第一开关元件，以及用于 控制加热元件和加法电阻器处于工作状态或非工作状态。 为了在第一能量状态下控制热头，加热元件由第一开关元件控制。 为了在第二能量状态下控制热敏头，加热元件和附加的电阻由第二开关元件控制，加热元件和加法电阻串联连接。

公开(公告)号：US06342911B1

公开(公告)日：2002-01-29

申请号：US09538283

申请日：2000-03-30

申请人： Bunji Moriya

发明人： Bunji Moriya

IPC分类号： B41J2355

CPC分类号： B41J2/355 ,  B41J2/35

摘要： The object of the invention is to enable the input of the data of a high energy part and the data of a low energy part to one memory in a thermal head having heating means for heating by different energy. To achieve the object, in a thermal head provided with a shift register to which first energy print data the printing by first energy of which is controlled by heating control means is written and to which second energy print data the printing by second energy of which is controlled by the heating control means is written, the shift register is provided with first shift register elements to which first energy print data is written and second shift register elements to which second energy print data is written, and the first shift register elements and the second shift register elements are connected in series.

摘要翻译： 本发明的目的是能够在具有用于通过不同能量加热的加热装置的热敏头中输入高能量部分的数据和低能量部分的数据到一个存储器。 为了实现该目的，在设置有移位寄存器的热敏头中，第一能量打印数据由第一能量由加热控制装置控制的打印被写入，并且第二能量打印数据通过第二能量打印数据 写入由加热控制装置控制的移位寄存器，其中写入有第一能量打印数据的第一移位寄存器元件和写入第二能量打印数据的第二移位寄存器元件，第一移位寄存器元件和第二移位寄存器元件 移位寄存器元件串联连接。