公开(公告)号：US07134196B2

公开(公告)日：2006-11-14

申请号：US10812017

申请日：2004-03-30

申请人： Bunji Moriya ,  Seiichi Tajima ,  Fumikachi Kurosawa ,  Shinichiro Hayashi

发明人： Bunji Moriya ,  Seiichi Tajima ,  Fumikachi Kurosawa ,  Shinichiro Hayashi

IPC分类号： H05K3/30

CPC分类号： H01L23/3121 ,  C25D5/10 ,  C25D17/28 ,  H01L21/56 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K3/284 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/48 ,  H01L2224/05644

摘要： In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

公开(公告)号：US06320604B1

公开(公告)日：2001-11-20

申请号：US09604000

申请日：2000-06-26

申请人： Bunji Moriya ,  Shinichiro Hayashi ,  Kazuhito Uchida

发明人： Bunji Moriya ,  Shinichiro Hayashi ,  Kazuhito Uchida

IPC分类号： B41J235

CPC分类号： B41J2/35

摘要： A multi power type thermal head which has a heating element for producing heat with different energies, an added resistor being connected to the heating element, first switch element for controlling the heating element in an operation state or a nonoperational state, and second switch element for controlling the heating element and the added resistor in an operation state or a nonoperational state. To control the thermal head in a first energy state, heating the heating element is controlled by the first switching element. To control the thermal head in a second energy state, the heating element and the added resistor are controlled by the second switching element with the heating element and the added resistor connected in series.

摘要翻译： 一种多功率型热敏头，其具有用于以不同能量产生热量的加热元件，连接到加热元件的附加电阻器，用于控制加热元件处于操作状态或非工作状态的第一开关元件，以及用于 控制加热元件和加法电阻器处于工作状态或非工作状态。 为了在第一能量状态下控制热头，加热元件由第一开关元件控制。 为了在第二能量状态下控制热敏头，加热元件和附加的电阻由第二开关元件控制，加热元件和加法电阻串联连接。

公开(公告)号：US20090117898A1

公开(公告)日：2009-05-07

申请号：US12108047

申请日：2008-04-23

申请人： Atsuhiko Sato ,  Sadayoshi Kiyo ,  Shinichiro Hayashi

发明人： Atsuhiko Sato ,  Sadayoshi Kiyo ,  Shinichiro Hayashi

IPC分类号： H04W4/00

CPC分类号： H04W72/005 ,  H04W4/12 ,  H04W68/00

摘要： Problems can be solved by a base station to which a location of a mobile station is registered and which performs a radio communication with the MS, and when receiving distribution information, divides the distribution information into N pieces, and incorporates the divided distribution information in N pieces of reception channels to successively transmit them to the MS. It can be achieved by a MS which is in a waiting state of a BS and which performs a radio communication with the BS, and when receiving distribution information which is incorporated in reception channels and divided, stores the distribution information, and when determining completion of the distribution of the distribution information, constructs the N pieces of divided information and displays it.

摘要翻译： 可以通过登记有移动站的位置并与MS进行无线通信的基站来解决问题，并且当接收到分发信息时，将分发信息划分为N个部分，并将划分的分发信息合并在N中 接收信道，连续发送给MS。 可以通过处于BS的等待状态并与BS进行无线通信的MS来实现，并且当接收到并入接收信道中的分配信息并被分割，存储分发信息时，以及当确定完成时 分发信息的分发，构建N条分割信息并显示。

公开(公告)号：US20070158715A1

公开(公告)日：2007-07-12

申请号：US11540761

申请日：2006-10-02

申请人： Shinichiro Hayashi

发明人： Shinichiro Hayashi

IPC分类号： H01L29/94

CPC分类号： H01L28/75 ,  H01L27/11507 ,  H01L28/56 ,  H01L28/65

摘要： In a ferroelectric capacitor comprising: a lower electrode; a ferroelectric film formed on the lower electrode; and an upper electrode formed on the ferroelectric film, variations in composition profile of elements constituting the ferroelectric film are 50% or lower in the thickness direction of the ferroelectric film, and the polarization switching time of the ferroelectric film is 1 μs or less.

摘要翻译： 在铁电电容器中，包括：下电极; 形成在下电极上的铁电膜; 并且形成在强电介质膜上的上电极，构成铁电体膜的元件的组成轮廓的变化在铁电体膜的厚度方向上为50％以下，强电介质膜的极化切换时间为1μ以下。

公开(公告)号：US20070065654A1

公开(公告)日：2007-03-22

申请号：US11603794

申请日：2006-11-22

申请人： Shinichiro Hayashi ,  Ryuzo Yamamoto

发明人： Shinichiro Hayashi ,  Ryuzo Yamamoto

IPC分类号： B32B3/06

CPC分类号： B43L19/0025 ,  Y10T428/249953 ,  Y10T428/249954 ,  Y10T428/249955 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/249979 ,  Y10T428/249981 ,  Y10T428/249986 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993

摘要： An eraser is constituted by an elastic material containing a rubber component or a resin component, and a skeleton structure for reinforcing the elastic material, and the skeleton structure is made from a porous structural material such as from an organic polymer that is broken when rubbed. Void portions in the porous structural material of the skeleton structure contain the elastic material of the eraser composition. Here, the skeleton portions of the skeleton structure may have an average thickness of 1 to 100 μm, and the void portions may have an average pore size of 10 μm to 3 mm. The eraser may have a surface hardness of 50 to 80, and also a sticking strength of 1.5 to 20 (kgf).

摘要翻译： 橡皮擦由包含橡胶组分或树脂组分的弹性材料和用于增强弹性材料的骨架结构构成，并且骨架结构由诸如由摩擦破裂的有机聚合物的多孔结构材料制成。 骨架结构的多孔结构材料中的空隙部分含有橡皮擦组合物的弹性材料。 这里，骨架结构的骨架部的平均厚度可以为1〜100μm，空隙部的平均孔径可以为10μm〜3mm。 橡皮擦的表面硬度可以为50〜80，粘着强度为1.5〜20（kgf）。

公开(公告)号：US20050006684A1

公开(公告)日：2005-01-13

申请号：US10916482

申请日：2004-08-12

申请人： Yoshihisa Nagano ,  Shinichiro Hayashi

发明人： Yoshihisa Nagano ,  Shinichiro Hayashi

IPC分类号： H01L21/02 ,  H01L21/8242 ,  H01L29/76

CPC分类号： H01L28/55 ,  H01L27/10852 ,  H01L28/65 ,  H01L28/90

摘要： A capacitive element includes a lower electrode having a three-dimensional shape, an upper electrode formed so as to be opposed to the lower electrode, and a capacitor insulating film formed between the lower and upper electrodes and made of a crystallized ferroelectric material. The thickness of the capacitor insulating film is set at 12.5 through 100 nm both inclusive.

摘要翻译： 电容元件包括具有三维形状的下电极，形成为与下电极相对的上电极，以及形成在下电极和上电极之间并由结晶铁电材料制成的电容器绝缘膜。 电容绝缘膜的厚度设定为12.5〜100nm。

公开(公告)号：USRE38565E1

公开(公告)日：2004-08-17

申请号：US10359997

申请日：2003-02-06

申请人： Shinichiro Hayashi ,  Tatsuo Otsuki

发明人： Shinichiro Hayashi ,  Tatsuo Otsuki

IPC分类号： H01L2100

CPC分类号： H01L28/60 ,  H01L28/55

摘要： A ferroelectric thin film capacitor has smooth electrodes permitting comparatively stronger polarization, less fatigue, and less imprint, as the ferroelectric capacitor ages. The smooth electrode surfaces are produced by carefully controlled drying, soft baking, and annealing conditions.

公开(公告)号：US06541375B1

公开(公告)日：2003-04-01

申请号：US09128249

申请日：1998-08-03

申请人： Shinichiro Hayashi ,  Koji Arita

发明人： Shinichiro Hayashi ,  Koji Arita

IPC分类号： H01L2144

CPC分类号： H01L28/75 ,  C23C14/08 ,  H01L21/2855 ,  H01L28/55 ,  H01L28/60

摘要： A ferroelectric thin film capacitor has smooth electrodes permitting comparatively stronger polarization, less fatigue, and less imprint, as the ferroelectric capacitor ages. The smooth electrode surfaces are produced by DC reactive sputtering.

摘要翻译： 铁电薄膜电容器具有平滑的电极，允许相对较强的极化，较少的疲劳和较少的压印，因为铁电电容器老化。 光滑的电极表面由直流反应溅射制成。

公开(公告)号：US06448598B2

公开(公告)日：2002-09-10

申请号：US09338542

申请日：1999-06-23

申请人： Yoshihisa Nagano ,  Shinichiro Hayashi ,  Yasuhiro Uemoto

发明人： Yoshihisa Nagano ,  Shinichiro Hayashi ,  Yasuhiro Uemoto

IPC分类号： H01L27108

CPC分类号： H01L27/10852 ,  H01L28/55

摘要： A semiconductor memory includes plural lower electrodes formed on a semiconductor substrate; a capacitor dielectric film of an insulating metal oxide continuously formed over the plural lower electrodes; plural upper electrodes formed on the capacitor dielectric film in positions respectively corresponding to the plural lower electrodes; and plural transistors formed on the semiconductor substrate. The plural lower electrodes are respectively connected with source regions of the plural transistors.

摘要翻译： 半导体存储器包括形成在半导体衬底上的多个下电极; 连续地形成在所述多个下电极上的绝缘金属氧化物的电容器电介质膜; 在分别对应于多个下电极的位置上形成在电容器电介质膜上的多个上电极; 以及形成在半导体基板上的多个晶体管。 多个下电极分别与多个晶体管的源极区域连接。

公开(公告)号：US06383555B1

公开(公告)日：2002-05-07

申请号：US09615373

申请日：2000-07-13

申请人： Shinichiro Hayashi ,  Larry D. McMillan ,  Carlos A. Paz de Araujo

发明人： Shinichiro Hayashi ,  Larry D. McMillan ,  Carlos A. Paz de Araujo

IPC分类号： B05D512

CPC分类号： H01L21/31691 ,  B05D1/00 ,  B05D1/60 ,  B05D3/0493 ,  B05D3/062 ,  B05D3/065 ,  C23C8/10 ,  C23C16/4412 ,  C23C16/4486 ,  C23C16/45561 ,  C23C16/4558 ,  C23C16/46 ,  C23C16/482 ,  C23C16/52 ,  C23C18/12 ,  C23C18/1216 ,  C23C18/1287 ,  C23C18/1291 ,  C23C18/14 ,  C23C26/02 ,  C30B7/00 ,  C30B7/005 ,  C30B29/68 ,  H01L21/02197 ,  H01L21/02282 ,  H01L21/02348 ,  H01L27/11502 ,  H01L28/55 ,  H01L28/56 ,  H01L28/60 ,  H01L41/314 ,  H05K3/105 ,  Y10S427/101

摘要： A substrate is located within a deposition chamber, the substrate defining a substrate plane. A liquid precursor is misted by ultrasonic or venturi apparatus, to produce a colloidal mist. The mist is generated, allowed to settle in a buffer chamber, filtered through a system up to 0.01 micron, and flowed into the deposition chamber between the substrate and barrier plate to deposit a liquid layer on the substrate. The liquid is dried to form a thin film of solid material on the substrate, which is then incorporated into an electrical component of an integrated circuit.

摘要翻译： 衬底位于沉积室内，衬底限定衬底平面。 液体前体被超声波或文氏管装置迷雾，产生胶体雾。 产生雾，允许沉淀在缓冲室中，通过高达0.01微米的系统过滤，并流入基板和阻挡板之间的沉积室，以在基板上沉积液体层。 将液体干燥以在基板上形成固体材料的薄膜，然后将其并入集成电路的电气部件中。