公开(公告)号：US07134196B2

公开(公告)日：2006-11-14

申请号：US10812017

申请日：2004-03-30

申请人： Bunji Moriya ,  Seiichi Tajima ,  Fumikachi Kurosawa ,  Shinichiro Hayashi

发明人： Bunji Moriya ,  Seiichi Tajima ,  Fumikachi Kurosawa ,  Shinichiro Hayashi

IPC分类号： H05K3/30

CPC分类号： H01L23/3121 ,  C25D5/10 ,  C25D17/28 ,  H01L21/56 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K3/284 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/48 ,  H01L2224/05644

摘要： In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

公开(公告)号：US08929089B2

公开(公告)日：2015-01-06

申请号：US13044871

申请日：2011-03-10

申请人： Shigeru Asami ,  Seiichi Tajima ,  Hiroki Hara ,  Shuichi Takizawa ,  Masumi Kameda ,  Kenichi Kawabata

发明人： Shigeru Asami ,  Seiichi Tajima ,  Hiroki Hara ,  Shuichi Takizawa ,  Masumi Kameda ,  Kenichi Kawabata

IPC分类号： H05K7/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/552 ,  H01L25/16

CPC分类号： H01L23/3135 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/552 ,  H01L23/564 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49117 ,  Y10T428/249981 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

摘要翻译： 电子电路模块组件包括电子部件，基板，第一树脂，第二树脂，金属层和开口。 电子部件安装在基板上。 第一树脂具有孔并与电子部件的至少一部分接触。 第二树脂覆盖第一树脂的表面，并且具有低于第一树脂的孔隙率。 金属层覆盖第一树脂和第二树脂，并且电连接到基板的接地。 开口设置在金属层中，并且允许第一树脂的一部分至少暴露于金属层的外部。

公开(公告)号：US06475823B1

公开(公告)日：2002-11-05

申请号：US09585354

申请日：2000-06-02

申请人： Shigeru Sakano ,  Akira Suzuki ,  Takahito Kiriyama ,  Seiichi Tajima ,  Ikuo Katoh

发明人： Shigeru Sakano ,  Akira Suzuki ,  Takahito Kiriyama ,  Seiichi Tajima ,  Ikuo Katoh

IPC分类号： H01L2100

CPC分类号： H03H9/177 ,  H03H3/02 ,  H03H9/1035 ,  H03H9/132 ,  H03H9/56 ,  Y10T29/42

摘要： The invention is directed to piezoelectric device having a vibration space that achieves a high degree of airtightness which is not readily reduced, and a manufacturing method thereof. First and second hollow layers are formed at first and second surfaces of a piezoelectric substrate to form first and second cavities around first and second electrodes respectively. The first and second cavities each have a uniform width and extend between a first surface and an opposing second surface of the first and second hollow layers respectively, around vibration portions of the piezoelectric element. First and second sealing layers are each formed on the second surface of the first and second hollow layers to seal the first and second cavities.

摘要翻译： 本发明涉及一种压电装置及其制造方法，所述压电装置具有能够实现难以降低的高气密性的振动空间。 第一和第二中空层形成在压电基板的第一和第二表面处，分别围绕第一和第二电极形成第一和第二空腔。 第一和第二空腔各自具有均匀的宽度，并分别围绕压电元件的振动部分在第一和第二中空层的第一表面和相对的第二表面之间延伸。 第一和第二密封层各自形成在第一和第二中空层的第二表面上，以密封第一和第二空腔。

公开(公告)号：US06604266B1

公开(公告)日：2003-08-12

申请号：US09604262

申请日：2000-06-27

申请人： Seiichi Tajima ,  Takahito Kiriyama

发明人： Seiichi Tajima ,  Takahito Kiriyama

IPC分类号： H04R1700

CPC分类号： H03H9/17 ,  H03H3/04 ,  H03H9/0542 ,  H03H9/56 ,  H03H2003/0414 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49004

摘要： A method for manufacturing a piezoelectric component in which a resonating portion on a piezoelectric substrate is provided with a deposit that is sensitive to radiation in a range of wavelengths from 350 to 2000 nm so as to have portions thereof trimmed away to form indentations therein without burning the deposit to avoid generating heat that is injurious to the piezoelectric component and substrate. A laser beam in the frequency range of 350 to 2000 nm is then caused to impinge on the deposit to cause the formation of trimmed indentations without substrate damaging heat in a controlled manner to adjust the resonance frequency of the piezoelectric component.

摘要翻译： 一种压电元件的制造方法，其中压电基板上的谐振部分设置有对350nm至2000nm的波长范围内的辐射敏感的沉积物，以使其部分被修剪而在其中形成凹陷而不燃烧 沉积物以避免产生对压电元件和基板有害的热量。 然后使激光束在350至2000nm的频率范围内撞击到沉积物上，以形成修整的压痕，而不会以受控的方式损伤热量，从而调节压电元件的谐振频率。

公开(公告)号：US6114795A

公开(公告)日：2000-09-05

申请号：US103554

申请日：1998-06-24

申请人： Seiichi Tajima ,  Takahito Kiriyama

发明人： Seiichi Tajima ,  Takahito Kiriyama

IPC分类号： H03H3/04 ,  H03H9/05 ,  H03H9/17 ,  H03H9/56 ,  H01L41/08

CPC分类号： H03H9/17 ,  H03H3/04 ,  H03H9/0542 ,  H03H9/56 ,  H03H2003/0414 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49004

摘要： A piezoelectric component having resonance characteristics adjusted to a high degree of accuracy is provided. A piezoelectric substrate is provided with a resonating part. A deposit is added onto a surface of the resonating part and is provided with a plurality of indented portions at its surface enclosed by outer edges. The deposit is constituted of a resin which may contain a carbon filler. The indented portions are formed through laser machining.

摘要翻译： 提供了具有高精度调整的谐振特性的压电元件。 压电基板设有谐振部。 在谐振部分的表面上添加沉积物，并且在其外边缘包围的表面上设置有多个凹入部分。 沉积物由可以含有碳填料的树脂构成。 凹凸部通过激光加工形成。