Magnetic tunnel junction device and method for manufacturing the same
    2.
    发明申请
    Magnetic tunnel junction device and method for manufacturing the same 有权
    磁隧道结装置及其制造方法

    公开(公告)号:US20110045320A1

    公开(公告)日:2011-02-24

    申请号:US12658853

    申请日:2010-02-16

    IPC分类号: G11B5/706 H01F1/01

    摘要: The present invention relates to a magnetic tunnel junction device and a manufacturing method thereof. The magnetic tunnel junction device includes: i) a first magnetic layer including a compound having a chemical formula of (A100-xBx)100-yCy; ii) an insulating layer deposited on the first magnetic layer; and iii) a second magnetic layer deposited on the insulating layer and including a compound having a chemical formula of (A100-xBx)100-yCy. The first and second magnetic layers have perpendicular magnetic anisotropy, A and B are respectively metal elements, and C is at least one amorphizing element selected from a group consisting of boron (B), carbon (C), tantalum (Ta), and hafnium (Hf).

    摘要翻译: 磁隧道结装置及其制造方法技术领域本发明涉及磁隧道结装置及其制造方法。 磁性隧道结装置包括:i)包含化学式为(A100-xBx)100-yCy的化合物的第一磁性层; ii)沉积在第一磁性层上的绝缘层; 和iii)沉积在绝缘层上并包含化学式为(A100-xBx)100-yCy的化合物的第二磁性层。 第一和第二磁性层具有垂直的磁各向异性,A和B分别为金属元素,C为选自硼(B),碳(C),钽(Ta)和铪中的至少一种非晶化元素 (Hf)。

    Magnetic tunnel junction structure having free layer with oblique magnetization
    4.
    发明授权
    Magnetic tunnel junction structure having free layer with oblique magnetization 有权
    磁隧道结结构具有倾斜磁化的自由层

    公开(公告)号:US08338004B2

    公开(公告)日:2012-12-25

    申请号:US12608103

    申请日:2009-10-29

    IPC分类号: G11B5/39 H01F10/32 G11C11/02

    摘要: The present invention provides a magnetic tunnel junction structure, including a first magnetic layer having a fixed magnetization direction and a second magnetic layer having a reversible magnetization direction. A non-magnetic layer is formed between the first magnetic layer and the second magnetic layer and a third magnetic layer allows the magnetization direction of the second magnetic layer to be inclined with respect to a plane of the second magnetic layer by a magnetic coupling to the second magnetic layer with a vertical magnetic anisotropic energy thereof larger than a horizontal magnetic anisotropic energy thereof. A crystal-structure separation layer is formed between the second magnetic layer and the third magnetic layer for separating a crystal orientation between the second and the third magnetic layers.

    摘要翻译: 本发明提供一种磁性隧道结结构,其包括具有固定磁化方向的第一磁性层和具有可逆磁化方向的第二磁性层。 在第一磁性层和第二磁性层之间形成非磁性层,第三磁性层允许第二磁性层的磁化方向相对于第二磁性层的平面通过磁耦合 第二磁性层,其垂直磁性各向异性能量大于其水平磁各向异性能。 在第二磁性层和第三磁性层之间形成晶体结构分离层,用于分离第二和第三磁性层之间的晶体取向。

    Light-emitting diode package and manufacturing method thereof
    6.
    发明授权
    Light-emitting diode package and manufacturing method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号:US07745844B2

    公开(公告)日:2010-06-29

    申请号:US11910174

    申请日:2007-02-28

    申请人: Kyung Ho Shin

    发明人: Kyung Ho Shin

    IPC分类号: H01L31/12

    摘要: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.

    摘要翻译: 提供LED封装。 LED封装包括金属板,电路图案和LED。 金属板包括凹槽。 绝缘层形成在金属板上。 电路图案形成在绝缘层上。 LED与绝缘层上的电路图形电连接。

    Light-Emitting Diode Package and Manufacturing Method Thereof
    7.
    发明申请
    Light-Emitting Diode Package and Manufacturing Method Thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号:US20080179612A1

    公开(公告)日:2008-07-31

    申请号:US11910174

    申请日:2007-02-28

    申请人: Kyung Ho Shin

    发明人: Kyung Ho Shin

    IPC分类号: H01L33/00 H01L21/02

    摘要: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.

    摘要翻译: 提供LED封装。 LED封装包括金属板,电路图案和LED。 金属板包括凹槽。 绝缘层形成在金属板上。 电路图案形成在绝缘层上。 LED与绝缘层上的电路图形电连接。

    Light emitting module and display device having the same
    8.
    发明授权
    Light emitting module and display device having the same 有权
    发光模块和具有该发光模块的显示装置

    公开(公告)号:US08944667B2

    公开(公告)日:2015-02-03

    申请号:US12700021

    申请日:2010-02-04

    申请人: Kyung Ho Shin

    发明人: Kyung Ho Shin

    IPC分类号: F21V15/01 F21V8/00

    CPC分类号: G02B6/0091

    摘要: A light emitting module and a display device including the light emitting module are provided. The light emitting module may include a metal plate, a board, and a plurality of light emitting diodes. The board may be attached to a side surface of the metal plate, and light emitting diodes may be arranged on the board.

    摘要翻译: 提供了一种发光模块和包括发光模块的显示装置。 发光模块可以包括金属板,板和多个发光二极管。 板可以附接到金属板的侧表面,并且发光二极管可以布置在板上。

    Light-emitting diode package and manufacturing method thereof
    10.
    发明授权
    Light-emitting diode package and manufacturing method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号:US08212274B2

    公开(公告)日:2012-07-03

    申请号:US12788090

    申请日:2010-05-26

    申请人: Kyung Ho Shin

    发明人: Kyung Ho Shin

    IPC分类号: H01L33/00

    摘要: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.

    摘要翻译: 提供LED封装。 LED封装包括金属板,电路图案和LED。 金属板包括凹槽。 绝缘层形成在金属板上。 电路图案形成在绝缘层上。 LED与绝缘层上的电路图形电连接。