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1.发明授权Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof 有权具有路由电路引线阵列的集成电路封装系统及其制造方法公开(公告)号：US09299644B1
公开(公告)日：2016-03-29
申请号：US14285601
申请日：2014-05-22
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L21/4832 , H01L23/3107 , H01L23/4952 , H01L23/49524 , H01L23/49534 , H01L23/49548 , H01L23/49582 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/131 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48245 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有凹部的具有顶部的端子; 在所述凹陷中施加电介质材料，所述电介质材料在其中形成间隙并暴露所述顶部的一部分; 在所述间隙内形成迹线并与所述顶部直接接触，所述迹线在所述电介质材料的上表面上横向延伸; 并通过轨迹将集成电路连接到终端。
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公开(公告)号：US08629537B2
公开(公告)日：2014-01-14
申请号：US11339176
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
摘要翻译： 提供了一种集成电路封装系统，其从具有管芯支撑件的无衬垫引线框架形成管芯支撑系统，每个管芯支架各自与另一个基本上等间隔开，并且在管芯支撑件上附接具有周边区域的集成电路管芯。
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公开(公告)号：US20090079096A1
公开(公告)日：2009-03-26
申请号：US11858588
申请日：2007-09-20
IPC分类号： H01L23/12
CPC分类号： H01L23/49575 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01027 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnect; and encapsulating the integrated circuit die, the first device unit, and the second device unit with both the first external interconnect and the second external interconnect partially exposed.
摘要翻译： 一种集成电路封装系统，包括以阵列配置形成具有第一外部互连的第一器件单元和具有第二外部互连的第二器件单元; 在第一设备单元上安装集成电路管芯; 连接集成电路管芯和第一外部互连件; 并且将所述第一外部互连和第二外部互连部分地暴露在一起，封装所述集成电路管芯，所述第一器件单元和所述第二器件单元。
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公开(公告)号：US20080251901A1
公开(公告)日：2008-10-16
申请号：US12111183
申请日：2008-04-28
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/565 , H01L23/49575 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects with the lead frame directly on a bottom mold and clamped by a top mold, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
摘要翻译： 提供一种堆叠集成电路封装系统，其提供具有管芯焊盘的引线框架，将引线框架的管芯焊盘上的第一集成电路连接到第一集成电路和引线框架之间，将第一集成电路封装在第一集成电路 并且与引线框架的第一电互连直接在底模上并由顶模夹紧，将第二集成电路连接到第一集成电路的管芯焊盘上，连接第二集成电路和引线框架之间的第二电互连， 并封装第二集成电路和第二电互连。
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公开(公告)号：US20080230881A1
公开(公告)日：2008-09-25
申请号：US11689229
申请日：2007-03-21
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/48247 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a paddle having an integrated circuit die thereover, an outer lead, and an inner lead between the paddle and the outer lead. The integrated circuit package system is also provided including placing a lead support over the inner lead without traversing to an inner body bottom side of the inner lead, connecting the integrated circuit die and the inner lead, and encapsulating the inner lead having the lead support thereover and the inner lead exposed.
摘要翻译： 提供一种集成电路封装系统，包括形成具有集成电路管芯的桨叶，外部引线和在桨叶和外部引线之间的内部引线。 还提供集成电路封装系统，包括将引线支撑件放置在内引线上，而不穿过内引线的内体底侧，连接集成电路管芯和内引线，并将具有引线支撑件的内引线封装在其上 并且内引线暴露。
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公开(公告)号：US08258609B2
公开(公告)日：2012-09-04
申请号：US11689229
申请日：2007-03-21
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/48247 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a paddle having an integrated circuit die thereover, an outer lead, and an inner lead between the paddle and the outer lead. The integrated circuit package system is also provided including placing a lead support over the inner lead without traversing to an inner body bottom side of the inner lead, connecting the integrated circuit die and the inner lead, and encapsulating the inner lead having the lead support thereover and the inner lead exposed.
摘要翻译： 提供一种集成电路封装系统，包括形成具有集成电路管芯的桨叶，外部引线和在桨叶和外部引线之间的内部引线。 还提供集成电路封装系统，包括将引线支撑件放置在内引线上，而不穿过内引线的内体底侧，连接集成电路管芯和内引线，并将具有引线支撑件的内引线封装在其上 并且内引线暴露。
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公开(公告)号：US08138586B2
公开(公告)日：2012-03-20
申请号：US11381684
申请日：2006-05-04
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L24/32 , H01L24/48 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle.
摘要翻译： 集成电路封装系统包括具有隆起边缘和多平面桨叶的隆起边缘上的附接集成电路的多平面桨叶。
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公开(公告)号：US07750451B2
公开(公告)日：2010-07-06
申请号：US11672164
申请日：2007-02-07
IPC分类号： H01L23/02
CPC分类号： H01L21/561 , H01L21/568 , H01L25/03 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package system is provided including providing a first carrier having a first integrated circuit die thereover, providing a second carrier, placing the first carrier coplanar with the second carrier, and molding a package encapsulation around and exposing the first carrier.
摘要翻译： 提供了一种多芯片封装系统，包括提供第一载体，其上具有第一集成电路管芯，提供第二载体，将第一载体与第二载体共面，并将封装封装模制在第一载体周围并暴露第一载体。
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公开(公告)号：US20090072363A1
公开(公告)日：2009-03-19
申请号：US11854934
申请日：2007-09-13
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49551 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。
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公开(公告)号：US20070170559A1
公开(公告)日：2007-07-26
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
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