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公开(公告)号：US09281652B1
公开(公告)日：2016-03-08
申请号：US13532681
申请日：2012-06-25
CPC分类号： H01S3/1083 , H01S3/025 , H01S3/0606 , H01S3/0615 , H01S3/0621 , H01S3/08054 , H01S3/08059 , H01S3/08081 , H01S3/082 , H01S3/11 , H01S3/113 , H01S3/1611
摘要： A laser system includes a laser resonator having a laser resonator volume and a gain block disposed therein, the gain block being configured to emit light at a predetermined laser wavelength, and an OPO unstable resonator having an OPO unstable resonator volume, the OPO unstable resonator optically coupled to the laser resonator and configured to receive light therefrom, wherein a portion of the OPO unstable resonator volume is situated with respect to the laser resonator volume so as to form an overlapping volume.
摘要翻译： 激光系统包括具有激光谐振器体积的激光谐振器和设置在其中的增益块，所述增益块被配置为以预定的激光波长发光，以及具有OPO不稳定谐振器体积的OPO不稳定谐振器，OPO不稳定谐振器 耦合到所述激光谐振器并且被配置为从其接收光，其中所述OPO不稳定谐振器体积的一部分相对于所述激光谐振器体积被定位，以便形成重叠的体积。
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公开(公告)号：US20180097333A1
公开(公告)日：2018-04-05
申请号：US15718889
申请日：2017-09-28
CPC分类号： H01S3/06704 , B65H57/003 , G02B6/2553 , G02B6/445 , H01S3/0014 , H01S3/0405 , H01S3/0407 , H01S3/042 , H01S3/094003 , H01S3/094053 , H01S3/0941 , H01S3/09415 , H01S5/02 , H01S5/02248 , H01S5/02423 , H01S5/4025
摘要： A fiber laser system comprises a main body, wherein the main body includes one or more fiber laser system components and a first wall hingedly attached to the main body along a first edge, the first wall having a first wall open position and a first wall closed position and a plurality of feed fiber management and splicing components mounted to the first wall. Additionally and/or alternatively, the laser system may comprise a cooling plate hingedly attached to the main body, the cooling plate has a cooling plate open position and a cooling plate closed position. Additionally and/or alternatively, the laser system may include a fiber management tray hingedly mounted to the cooling plate, the fiber management tray having a fiber management tray open position and a fiber management tray closed position.
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公开(公告)号：US07653109B2
公开(公告)日：2010-01-26
申请号：US11768150
申请日：2007-06-25
申请人： William K. Bischel , David K. Wagner , Harald Guenther , Simon J. Field , Markus P. Hehlen , Richard B. Tompane , Andrew T. Ryan , C. Geoffrey Fanning , Jim W. Li , Nina D. Morozova
发明人： William K. Bischel , David K. Wagner , Harald Guenther , Simon J. Field , Markus P. Hehlen , Richard B. Tompane , Andrew T. Ryan , C. Geoffrey Fanning , Jim W. Li , Nina D. Morozova
IPC分类号： H01S5/00
CPC分类号： H01S5/02252 , G02B6/30 , G02B6/305 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4201 , G02B6/4202 , G02B6/4204 , G02B6/4224 , G02B6/4225 , G02B6/423 , G02B6/4232 , G02B6/4243 , G02B6/4249 , G02B6/4265 , G02B6/4267 , G02B6/4286 , G02B6/4287 , G02B2006/12195 , H01L2224/48091 , H01S3/09415 , H01S5/02284 , H01S5/141 , H01S5/146 , H01S5/4012 , H01S5/4062 , Y10T156/1028 , Y10T156/1089 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , H01L2924/00014
摘要： An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
摘要翻译： 诸如用于EDFA的多输出二极管激光泵源的光学组件通过将光学阵列发射器芯片压靠在从基座突出的支架结构上而形成，使得发射极芯片变形以匹配支座结构的曲率。 IO芯片也与隔离结构并置，使得其光接收器可以从发射器芯片接收光能。 IO芯片可以提供各种光学功能，然后提供用于耦合到光纤阵列中的光学阵列输出。 隔离结构优选地在比发射器芯片与基座重叠的区域小得多的聚集接触区域上接触发射极芯片。 用于将发射极芯片和IO芯片连接到基座的材料设置在支座之间的凹槽中，而不是在支架结构的接触表面上。
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公开(公告)号：US07235150B2
公开(公告)日：2007-06-26
申请号：US10898537
申请日：2004-07-23
申请人： William K. Bischel , David K. Wagner , Harald Guenther , Simon J. Field , Markus P. Hehlen , Richard B. Tompane , Andrew T. Ryan , C. Geoffrey Fanning , Jim W. Li , Nina D. Morozova
发明人： William K. Bischel , David K. Wagner , Harald Guenther , Simon J. Field , Markus P. Hehlen , Richard B. Tompane , Andrew T. Ryan , C. Geoffrey Fanning , Jim W. Li , Nina D. Morozova
IPC分类号： B32B37/10
CPC分类号： H01S5/02252 , G02B6/30 , G02B6/305 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4201 , G02B6/4202 , G02B6/4204 , G02B6/4224 , G02B6/4225 , G02B6/423 , G02B6/4232 , G02B6/4243 , G02B6/4249 , G02B6/4265 , G02B6/4267 , G02B6/4286 , G02B6/4287 , G02B2006/12195 , H01L2224/48091 , H01S3/09415 , H01S5/02284 , H01S5/141 , H01S5/146 , H01S5/4012 , H01S5/4062 , Y10T156/1028 , Y10T156/1089 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , H01L2924/00014
摘要： An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
摘要翻译： 诸如用于EDFA的多输出二极管激光泵源的光学组件通过将光学阵列发射器芯片压靠在从基座突出的支架结构上而形成，使得发射极芯片变形以匹配支座结构的曲率。 IO芯片也与隔离结构并置，使得其光接收器可以从发射器芯片接收光能。 IO芯片可以提供各种光学功能，然后提供用于耦合到光纤阵列中的光学阵列输出。 隔离结构优选地在比发射器芯片与基座重叠的区域小得多的聚集接触区域上接触发射极芯片。 用于将发射极芯片和IO芯片连接到基座的材料设置在支座之间的凹槽中，而不是在支架结构的接触表面上。
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