利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

43 条记录 (耗时 0.028 秒)

    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE
    2.
    发明申请
    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE 有权
    使用多个小型MEMS器件来替代大型MEMS器件的方法

    公开(公告)号：US20100116632A1

    公开(公告)日：2010-05-13

    申请号：US12614929

    申请日：2009-11-09

    申请人： CHARLES GORDON SMITH ,  Richard L. Knipe ,  Vikram Joshi ,  Roberto Gaddi ,  Anartz Unamuno ,  Robertus Petrus Van Kampen

    发明人： CHARLES GORDON SMITH ,  Richard L. Knipe ,  Vikram Joshi ,  Roberto Gaddi ,  Anartz Unamuno ,  Robertus Petrus Van Kampen

    IPC分类号： H01H57/00 ,  H05K1/16 ,  H01H47/02

    CPC分类号： B81B7/04 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/135 ,  H01G5/18 ,  H01G5/40

    摘要： Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

    摘要翻译： 本文公开的实施例通常包括使用大量的小MEMS器件来代替单个更大的MEMS器件或数字可变电容器的功能。 大量较小的MEMS器件具有与较大器件相同的功能，但是由于尺寸较小，因此可以使用互补金属氧化物半导体（CMOS）兼容工艺封装在腔中。 通过大量较小器件的信号平均，允许较小器件阵列的精度等同于较大的器件。 通过考虑使用具有惯性响应的集成模数转换的基于MEMS的加速度计开关阵列来举例说明该过程。 还通过考虑使用MEMS器件结构（其中MEMS器件并行地作为数字可变电容器）来使用该过程。

    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS
    8.
    发明申请
    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS 有权
    RF MEMS隔离，串联和分流DVC以及小型MEMS

    公开(公告)号：US20140300404A1

    公开(公告)日：2014-10-09

    申请号：US14240677

    申请日：2012-08-31

    申请人： Roberto Gaddi ,  Richard L. Knipe ,  Robertus Petrus Van Kampen ,  Anartz Unamuno

    发明人： Roberto Gaddi ,  Richard L. Knipe ,  Robertus Petrus Van Kampen ,  Anartz Unamuno

    IPC分类号： H01L49/02 ,  H03K17/687 ,  H03K17/16

    CPC分类号： H01L28/60 ,  B81B3/0086 ,  B81B2201/016 ,  B81B2207/015 ,  H01G5/18 ,  H01G5/38 ,  H01G5/40 ,  H01H59/0009 ,  H03K17/162 ,  H03K17/6872 ,  H03K2217/0009 ,  H03K2217/0036 ,  H03K2217/009

    摘要： The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate.

    摘要翻译： 本发明一般涉及用于将RF MEMS器件与衬底以及驱动电路，串联和并联DVC管芯结构隔离的架构，以及用于高频通信的较小的MEMS阵列。 该半导体器件具有其中具有多个MEMS器件的一个或多个单元。 MEMS器件通过将电偏压施加到上拉电极或下拉电极来操作，以将MEMS器件的开关元件移动在与RF电极间隔开第一距离的第一位置和间隔第二位置的第二位置 距离与RF电极的第一距离不同。 上拉和/或下拉电极可以耦合到电阻器以将MEMS器件与衬底隔离。

    Routing of MEMS variable capacitors for RF applications
    9.
    发明授权
    Routing of MEMS variable capacitors for RF applications 有权
    用于RF应用的MEMS可变电容器的布线

    公开(公告)号：US09373447B2

    公开(公告)日：2016-06-21

    申请号：US14239115

    申请日：2012-08-17

    申请人： Roberto Gaddi ,  Robertus Petrus Van Kampen ,  Richard L. Knipe ,  Anartz Unamuno

    发明人： Roberto Gaddi ,  Robertus Petrus Van Kampen ,  Richard L. Knipe ,  Anartz Unamuno

    IPC分类号： H01G5/16 ,  H01G5/38 ,  H01H59/00 ,  H01G7/00

    CPC分类号： H01G5/16 ,  H01G5/38 ,  H01G7/00 ,  H01H59/0009 ,  Y10T29/43

    摘要： Utilizing a variable capacitor for RF and microwave applications provides for multiple levels of intra-cavity routing that advantageously reduce capacitive coupling. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.

    摘要翻译： 利用用于RF和微波应用的可变电容器可提供有利于减少电容耦合的多级腔内路由。 可变电容器包括具有与其电耦合的多个单元的接合焊盘。 多个单元中的每一个在其中具有多个MEMS器件。 MEMS器件共享公共RF电极，一个或多个接地电极和一个或多个控制电极。 RF电极，接地电极和控制电极都在电池内彼此平行布置。 RF电极使用不同级别的电路由金属电连接到一个或多个接合焊盘。

    Pull up electrode and waffle type microstructure
    10.
    发明授权
    Pull up electrode and waffle type microstructure 有权
    拉起电极和华夫饼型微结构

    公开(公告)号：US09018717B2

    公开(公告)日：2015-04-28

    申请号：US13237261

    申请日：2011-09-20

    申请人： Richard L. Knipe ,  Robertus Petrus van Kampen ,  Anartz Unamuno ,  Roberto Gaddi

    发明人： Richard L. Knipe ,  Robertus Petrus van Kampen ,  Anartz Unamuno ,  Roberto Gaddi

    IPC分类号： H01L41/02 ,  H01H1/00 ,  H01H59/00

    CPC分类号： H01H1/0036 ,  H01H59/0009 ,  H01H2001/0084

    摘要： The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.

    摘要翻译： 本发明一般涉及MEMS器件及其制造方法。 MEMS器件的悬臂可以具有华夫饼型微结构。 华夫饼形微结构利用支撑梁来赋予微结构刚度，同时允许支撑梁弯曲。 华夫饼型微结构允许将刚性结构与柔性支撑结合在一起。 此外，可以使用复合弹簧来产生非常硬的弹簧以改善MEMS装置的热开关性能。 为了允许MEMS器件利用更高的RF电压，可以将上拉电极定位在悬臂上方以帮助将悬臂从接触电极拉出。