公开(公告)号：US20150376460A1

公开(公告)日：2015-12-31

申请号：US14750050

申请日：2015-06-25

Applicant: Cabot Microelectronics Corporation

Inventor： Steven Grumbine ,  Jeffrey Dysard ,  Ernest Shen ,  Mary Cavanaugh ,  Daniel Clingerman

IPC: C09G1/02

CPC classification number: C09G1/02 ,  B24B1/00 ,  B24B37/044 ,  C09G1/00 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1436 ,  C09K3/1454 ,  C09K3/1463 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212

Abstract: Methods for fabricating a chemical-mechanical polishing composition include growing colloidal silica abrasive particles in a liquid including an aminosilane compound such that the aminosilane compound becomes incorporated in the abrasive particles. A dispersion including such colloidal silica abrasive particles may be further processed to obtain a chemical-mechanical polishing composition including colloidal silica particles having the aminosilane compound incorporated therein.

Abstract translation: 用于制造化学机械抛光组合物的方法包括在包括氨基硅烷化合物的液体中生长胶体二氧化硅磨料颗粒，使得氨基硅烷化合物掺入磨料颗粒中。 可以进一步处理包括这种胶体二氧化硅磨料颗粒的分散体，以获得包含其中并入氨基硅烷化合物的胶体二氧化硅颗粒的化学机械抛光组合物。

公开(公告)号：US09803106B2

公开(公告)日：2017-10-31

申请号：US14750050

申请日：2015-06-25

Applicant: Cabot Microelectronics Corporation

Inventor： Steven Grumbine ,  Jeffrey Dysard ,  Ernest Shen ,  Mary Cavanaugh ,  Daniel Clingerman

IPC: C09G1/02 ,  C09G1/06 ,  B24B37/04 ,  B24B1/00 ,  C09G1/00 ,  C09G1/04 ,  C09K3/14 ,  H01L21/306 ,  H01L21/321 ,  H01L21/3105

CPC classification number: C09G1/02 ,  B24B1/00 ,  B24B37/044 ,  C09G1/00 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1436 ,  C09K3/1454 ,  C09K3/1463 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212

Abstract: Methods for fabricating a chemical-mechanical polishing composition include growing colloidal silica abrasive particles in a liquid including an aminosilane compound such that the aminosilane compound becomes incorporated in the abrasive particles. A dispersion including such colloidal silica abrasive particles may be further processed to obtain a chemical-mechanical polishing composition including colloidal silica particles having the aminosilane compound incorporated therein.

公开(公告)号：US10968366B2

公开(公告)日：2021-04-06

申请号：US16208742

申请日：2018-12-04

Applicant: Cabot Microelectronics Corporation

Inventor： Steven Kraft ,  Fernando Hung Low ,  Daniel Clingerman ,  Roman A. Ivanov ,  Steven Grumbine

IPC: C09K3/14 ,  C09G1/04 ,  C09G1/02 ,  C09G1/00 ,  H01L21/321

Abstract: A chemical mechanical polishing composition for polishing a substrate includes a liquid carrier and cationic metal oxide abrasive particles dispersed in the liquid carrier. The cationic metal oxide abrasive particles have a surface modified with at least one compound consisting of a silyl group having at least one quaternary ammonium group. A method for chemical mechanical polishing a substrate including a metal layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the metal layer from the substrate and thereby polish the substrate.