Electronic device with guard ring
    1.
    发明申请
    Electronic device with guard ring 有权
    带防护环的电子设备

    公开(公告)号:US20050035423A1

    公开(公告)日:2005-02-17

    申请号:US10887244

    申请日:2004-07-08

    摘要: An electronic device includes a substrate, an insulating layer arranged on the substrate, the insulating layer having an opening in an area of the surface of the substrate, an active layer arranged within the opening on the surface of the substrate, the active layer including a guard ring in those areas of the surface and of the active layer which are adjacent to the insulating layer, and a contacting layer arranged on an area of the active layer, the contact layer being adjacent to an area of the guard ring. The device may be produced by a process of three-fold self-alignment, to be precise utilizing a spacer process by means of which a diffusion source having a lateral extension far below the lithography limit is made possible.

    摘要翻译: 电子器件包括衬底,布置在衬底上的绝缘层,所述绝缘层在衬底的表面的区域中具有开口,布置在衬底的表面的开口内的有源层,所述活性层包括 保护环在与绝缘层相邻的表面和有源层的那些区域中,以及接触层,布置在有源层的区域上,接触层邻近保护环的区域。 该装置可以通过三重自对准的方法制造,以精确地利用间隔物工艺,通过该间隔工艺,具有远低于光刻极限的横向延伸的扩散源成为可能。

    Electronic device with guard ring
    2.
    发明授权
    Electronic device with guard ring 有权
    带防护环的电子设备

    公开(公告)号:US07307329B2

    公开(公告)日:2007-12-11

    申请号:US10887244

    申请日:2004-07-08

    IPC分类号: H01L29/47 H01L21/28

    摘要: An electronic device includes a substrate, an insulating layer arranged on the substrate, the insulating layer having an opening in an area of the surface of the substrate, an active layer arranged within the opening on the surface of the substrate, the active layer including a guard ring in those areas of the surface and of the active layer which are adjacent to the insulating layer, and a contacting layer arranged on an area of the active layer, the contact layer being adjacent to an area of the guard ring. The device may be produced by a process of three-fold self-alignment, to be precise utilizing a spacer process by means of which a diffusion source having a lateral extension far below the lithography limit is made possible.

    摘要翻译: 电子器件包括衬底,布置在衬底上的绝缘层,所述绝缘层在衬底的表面的区域中具有开口,布置在衬底的表面的开口内的有源层,所述活性层包括 保护环在与绝缘层相邻的表面和有源层的那些区域中,以及接触层,布置在有源层的区域上,接触层邻近保护环的区域。 该装置可以通过三重自对准的方法制造,以精确地利用间隔物工艺,通过该间隔工艺,具有远低于光刻极限的横向延伸的扩散源成为可能。

    Semiconductor structure for draining an overvoltage pulse, and method for manufacturing same
    4.
    发明申请
    Semiconductor structure for draining an overvoltage pulse, and method for manufacturing same 审中-公开
    用于排出过电压脉冲的半导体结构及其制造方法

    公开(公告)号:US20070085143A1

    公开(公告)日:2007-04-19

    申请号:US11540489

    申请日:2006-09-29

    IPC分类号: H01L23/62

    摘要: A semiconductor structure for draining an overvoltage pulse comprises a first semiconductor region having a first doping type and a semiconductor layer arranged adjacent the first semiconductor region. The semiconductor layer includes an isolation structure configured to electrically isolate a second semiconductor region from a surrounding region. The second semiconductor region has a second doping type. A third semiconductor region having the first doping type is arranged adjacent the second semiconductor region and is disposed within an area limited by the isolation structure. A first contacting structure is configured to provide an electrical contact with the first semiconductor region, and a second contacting structure is configured to provide an electrical contact with the third semiconductor region. The first and second semiconductor regions are more highly doped than the second semiconductor region.

    摘要翻译: 用于排出过电压脉冲的半导体结构包括具有第一掺杂类型的第一半导体区域和邻近第一半导体区域布置的半导体层。 半导体层包括被配置为将第二半导体区域与周围区域电隔离的隔离结构。 第二半导体区域具有第二掺杂型。 具有第一掺杂类型的第三半导体区域被布置成与第二半导体区域相邻并且被布置在由隔离结构限制的区域内。 第一接触结构被配置为提供与第一半导体区域的电接触,并且第二接触结构被配置为提供与第三半导体区域的电接触。 第一和第二半导体区域比第二半导体区域更高掺杂。

    Method for producing schottky diodes
    8.
    发明授权
    Method for producing schottky diodes 有权
    肖特基二极管的制造方法

    公开(公告)号:US06448162B1

    公开(公告)日:2002-09-10

    申请号:US09722081

    申请日:2000-11-27

    IPC分类号: H01L2128

    CPC分类号: H01L29/66143 H01L29/872

    摘要: A method for producing a Schottky diode formed of a doped guard ring in an edge area of the Schottky contact is described. The guard ring is produced by depositing a high barrier material, especially made of platinum, on the surface of the semiconductor layer. The surface is provided with a structured masking layer beforehand, and which is subsequently etch-backing.

    摘要翻译: 描述了在肖特基接触的边缘区域中由掺杂保护环形成的肖特基二极管的制造方法。 保护环通过在半导体层的表面上沉积高阻挡材料,特别是由铂制成。 表面预先设置有结构化掩模层,随后蚀刻背衬。

    Method for producing Schottky diodes and Schottky diodes
    10.
    发明授权
    Method for producing Schottky diodes and Schottky diodes 有权
    肖特基二极管和肖特基二极管的制造方法

    公开(公告)号:US06551911B1

    公开(公告)日:2003-04-22

    申请号:US09491767

    申请日:2000-01-26

    IPC分类号: H01L2128

    CPC分类号: H01L29/66143 H01L29/872

    摘要: A method for producing Schottky diodes having a protective ring in an edge region of a Schottky contact. The protective ring is produced by a protective ring material that is deposited onto a surface of a semiconductor layer, which surface is provided with a patterned masking layer beforehand, and the protective ring material subsequently being siliconized. In this case, the protective ring material constitutes a metal, in particular a high barrier metal, which has, in particular, platinum.

    摘要翻译: 一种在肖特基接触的边缘区域中制造具有保护环的肖特基二极管的方法。 保护环由沉积在半导体层的表面上的保护环材料制成,该表面预先设置有图案化掩模层,并且保护环材料随后被硅化。 在这种情况下,保护环材料构成特别是铂的金属,特别是高阻隔性金属。