公开(公告)号：US07394491B2

公开(公告)日：2008-07-01

申请号：US10749340

申请日：2003-12-30

申请人： Chang-Min Bae ,  Kwang-Ho Yoon

发明人： Chang-Min Bae ,  Kwang-Ho Yoon

IPC分类号： H04N5/217 ,  H04N5/16 ,  H04N3/14 ,  H04N5/335

CPC分类号： H04N5/378 ,  H04N5/3575 ,  H04N5/3598

摘要： An image sensor of the present invention prevents the phenomenon that surrounding background of a bright object reflecting or emitting strong light like the sun is presented at dark and improves image quality of the image sensor by controlling the brightness of the bright object. The image sensor using correlated double sampling technology which outputs data of an object by using difference between a reset voltage signal and a data voltage signal of a unit pixel includes a plurality of unit pixels arranged in a matrix, each outputting the reset voltage signal and the data voltage signal; a plurality of clamping means, each coupled to each unit pixels for clamping up the reset signal to a predetermined voltage level; and a voltage controlling block for adjusting voltage level supplied to a gate of each of clamping means.

摘要翻译： 本发明的图像传感器防止了通过控制亮物体的亮度而将反射或发出像太阳的强光的明亮物体的背景的暗色呈现在暗处并提高图像传感器的图像质量的现象。 使用相关双采样技术的图像传感器，其通过使用单位像素的复位电压信号和数据电压信号之间的差异来输出对象的数据，包括排列成矩阵的多个单位像素，每个输出复位电压信号和 数据电压信号; 多个夹紧装置，每个夹紧装置分别耦合到每个单元的像素，用于将复位信号夹紧到预定的电压电平; 以及用于调整提供给每个夹紧装置的门的电压电平的电压控制块。

公开(公告)号：US06650310B2

公开(公告)日：2003-11-18

申请号：US09939786

申请日：2001-08-28

申请人： Kwang-Ho Yoon

发明人： Kwang-Ho Yoon

IPC分类号： G09G336

CPC分类号： G09G3/3685 ,  G09G2310/0248 ,  G09G2330/023

摘要： A hybrid-level charge recycling method for use in implementing low power LCD column drivers. By having external capacitors of the column driver drive the same column lines of the LCD, the need for a polarity reversing circuit is eliminated, and the time necessary for charge recycling, as well as the amount of power consumed, is reduced. As a result, the multi-level recycling operation in column driving IC is made more practical.

公开(公告)号：US07498555B2

公开(公告)日：2009-03-03

申请号：US11481712

申请日：2006-07-06

申请人： Kyoung-Min Koh ,  Kwang-Ho Yoon

发明人： Kyoung-Min Koh ,  Kwang-Ho Yoon

IPC分类号： H01L27/00

CPC分类号： H04N5/347 ,  H04N5/343

摘要： An image sensor includes first and second pixel circuits and an output node coupled to the first and second pixel circuits. A bias circuit provides a higher bias current at the output node during a sub-sampling mode of operation of the image sensor for improved image quality.

摘要翻译： 图像传感器包括第一和第二像素电路以及耦合到第一和第二像素电路的输出节点。 在图像传感器的次采样模式下，偏置电路在输出节点处提供更高的偏置电流，以提高图像质量。

公开(公告)号：US20070018072A1

公开(公告)日：2007-01-25

申请号：US11481712

申请日：2006-07-06

申请人： Kyoung-Min Koh ,  Kwang-Ho Yoon

发明人： Kyoung-Min Koh ,  Kwang-Ho Yoon

IPC分类号： G01J1/44

CPC分类号： H04N5/347 ,  H04N5/343

摘要： An image sensor includes first and second pixel circuits and an output node coupled to the first and second pixel circuits. A bias circuit provides a higher bias current at the output node during a sub-sampling mode of operation of the image sensor for improved image quality.

摘要翻译： 图像传感器包括第一和第二像素电路以及耦合到第一和第二像素电路的输出节点。 在图像传感器的次采样模式下，偏置电路在输出节点处提供更高的偏置电流，以提高图像质量。

公开(公告)号：US07065869B2

公开(公告)日：2006-06-27

申请号：US10360106

申请日：2003-02-07

申请人： Tae-Hyeog Kang ,  Sang-Kab Park ,  Kwang-Ho Yoon ,  Bong-Kyu Choi

发明人： Tae-Hyeog Kang ,  Sang-Kab Park ,  Kwang-Ho Yoon ,  Bong-Kyu Choi

IPC分类号： H05K3/02

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49794 ,  H01L2924/00

摘要： Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB strip by modifying a sub-plating line of the PCB strip used to manufacture a semiconductor chip package, and a method of manufacturing the semiconductor chip package using the same. Therefore, an excellent semiconductor chip package is manufactured without a short when the PCB strip is cut using a sawing machine because misalignment of main plating lines of the solder side and the component side of the PCB strip is avoided, and an interval between PCB units is reduced to desirably increase the number of PCB units in the PCB strip without the short when the PCB strip is cut.

摘要翻译： 公开了一种用于电镀印刷电路板（PCB）条的设计方法，其中主电镀线可选地形成在PCB带的组件侧，焊料侧或内层上， 用于制造半导体芯片封装的PCB板的制造方法以及使用其制造半导体芯片封装的方法。 因此，当使用锯切机切割PCB板时，制造出优良的半导体芯片封装，因为避免了焊料侧的主电镀线和PCB板的部件侧的不对准，并且PCB单元之间的间隔为 减少以期望在PCB板条切割时PCB板的PCB单元的数量不增加，而不会短路。