公开(公告)号：US07811626B2

公开(公告)日：2010-10-12

申请号：US12328077

申请日：2008-12-04

申请人： Chang-soo Jang ,  Dong-kwan Won ,  Hyoung-ho Roh ,  Jae-chul Ryu

发明人： Chang-soo Jang ,  Dong-kwan Won ,  Hyoung-ho Roh ,  Jae-chul Ryu

IPC分类号： B05D5/12

CPC分类号： H05K1/0366 ,  H05K3/022 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.

摘要翻译： 提供一种制造印刷电路板的方法。 在一个实施例中，该方法包括通过卷轴方法形成预浸料层，在预浸料层的至少一个表面上形成用于形成电路图案的导电膜; 并在导电膜上形成预定的电路图案。 在一个实施例中，预浸料层具有至多约0.15mm的厚度，并且包含纤维材料和树脂材料。 在一个实施方式中，预浸料层中的树脂材料的含量为约70体积％以下。 在一个实施例中，预浸料层由至少一个预浸料层组成。

公开(公告)号：US07470461B2

公开(公告)日：2008-12-30

申请号：US11244649

申请日：2005-10-05

申请人： Chang-soo Jang ,  Dong-kwan Won ,  Hyoung-ho Roh ,  Jae-chul Ryu

发明人： Chang-soo Jang ,  Dong-kwan Won ,  Hyoung-ho Roh ,  Jae-chul Ryu

IPC分类号： B32B3/00

CPC分类号： H05K1/0366 ,  H05K3/022 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.

摘要翻译： 提供一种制造印刷电路板的方法。 在一个实施例中，该方法包括通过卷轴方法形成预浸料层，在预浸料层的至少一个表面上形成用于形成电路图案的导电膜; 并在导电膜上形成预定的电路图案。 在一个实施例中，预浸料层具有至多约0.15mm的厚度，并且包含纤维材料和树脂材料。 在一个实施方式中，预浸料层中的树脂材料的含量为约70体积％以下。 在一个实施例中，预浸料层由至少一个预浸料层组成。

公开(公告)号：US20060105153A1

公开(公告)日：2006-05-18

申请号：US11244649

申请日：2005-10-05

申请人： Chang-soo Jang ,  Jae-chul Ryu ,  Hyoung-ho Roh ,  Dong-kwan Won

发明人： Chang-soo Jang ,  Jae-chul Ryu ,  Hyoung-ho Roh ,  Dong-kwan Won

IPC分类号： B05D5/12

CPC分类号： H05K1/0366 ,  H05K3/022 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.

摘要翻译： 提供一种制造印刷电路板的方法。 在一个实施例中，该方法包括通过卷轴方法形成预浸料层，在预浸料层的至少一个表面上形成用于形成电路图案的导电膜; 并在导电膜上形成预定的电路图案。 在一个实施例中，预浸料层具有至多约0.15mm的厚度，并且包含纤维材料和树脂材料。 在一个实施方式中，预浸料层中的树脂材料的含量为约70体积％以下。 在一个实施例中，预浸料层由至少一个预浸料层组成。

公开(公告)号：US20090087547A1

公开(公告)日：2009-04-02

申请号：US12328077

申请日：2008-12-04

申请人： Chang-soo Jang ,  Jae-chul Ryu ,  Hyoung-ho Roh ,  Dong-kwan Won

发明人： Chang-soo Jang ,  Jae-chul Ryu ,  Hyoung-ho Roh ,  Dong-kwan Won

IPC分类号： H05K3/04

CPC分类号： H05K1/0366 ,  H05K3/022 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.

摘要翻译： 提供一种制造印刷电路板的方法。 在一个实施例中，该方法包括通过卷轴方法形成预浸料层，在预浸料层的至少一个表面上形成用于形成电路图案的导电膜; 并在导电膜上形成预定的电路图案。 在一个实施例中，预浸料层具有至多约0.15mm的厚度，并且包含纤维材料和树脂材料。 在一个实施方式中，预浸料层中的树脂材料的含量为约70体积％以下。 在一个实施例中，预浸料层由至少一个预浸料层组成。

公开(公告)号：US07750456B2

公开(公告)日：2010-07-06

申请号：US11651670

申请日：2007-01-10

申请人： Hyoung-ho Roh

发明人： Hyoung-ho Roh

IPC分类号： H01L23/06

CPC分类号： C23C26/00 ,  H01L23/13 ,  H01L23/145 ,  H01L23/4922 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/585 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/005 ,  H05K2201/09781 ,  H05K2201/09909 ,  Y10T428/24917 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a printed circuit board having a structure that can prevent the generation of cracks around a rectangular hole and a method of manufacturing a printed circuit board for a semiconductor package. The printed circuit board includes a base substrate in which at least one window slit is formed, a plurality of circuit patterns formed at least on a side surface of the base substrate, a protective layer formed on the base substrate and the circuit patterns, and a crack preventive layer that is formed along at least a portion of edges of the window slit and is not formed at least on the circuit patterns.

摘要翻译： 提供了具有可以防止在矩形孔周围产生裂纹的结构的印刷电路板以及制造用于半导体封装的印刷电路板的方法。 印刷电路板包括基底，其中形成至少一个窗口，至少在基底基板的侧表面上形成的多个电路图案，形成在基底基板上的保护层和电路图案，以及 防裂层，沿着窗口的至少一部分边缘形成，并且至少不形成在电路图案上。

公开(公告)号：US20070160817A1

公开(公告)日：2007-07-12

申请号：US11651670

申请日：2007-01-10

申请人： Hyoung-ho Roh

发明人： Hyoung-ho Roh

IPC分类号： C23C26/00

CPC分类号： C23C26/00 ,  H01L23/13 ,  H01L23/145 ,  H01L23/4922 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/585 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/005 ,  H05K2201/09781 ,  H05K2201/09909 ,  Y10T428/24917 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a printed circuit board having a structure that can prevent the generation of cracks around a rectangular hole and a method of manufacturing a printed circuit board for a semiconductor package. The printed circuit board includes a base substrate in which at least one window slit is formed, a plurality of circuit patterns formed at least on a side surface of the base substrate, a protective layer formed on the base substrate and the circuit patterns, and a crack preventive layer that is formed along at least a portion of edges of the window slit and is not formed at least on the circuit patterns.

摘要翻译： 提供了具有可以防止在矩形孔周围产生裂纹的结构的印刷电路板以及制造用于半导体封装的印刷电路板的方法。 印刷电路板包括基底，其中形成至少一个窗口，至少在基底基板的侧表面上形成的多个电路图案，形成在基底基板上的保护层和电路图案，以及 防裂层，沿着窗口的至少一部分边缘形成，并且至少不形成在电路图案上。

公开(公告)号：US5644164A

公开(公告)日：1997-07-01

申请号：US648832

申请日：1996-05-16

申请人： Hyoung-ho Roh

发明人： Hyoung-ho Roh

IPC分类号： H01L23/34 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/4951 ,  H01L23/49568 ,  H01L24/32 ,  H01L2224/32245

摘要： A semiconductor device includes a package accommodating a semiconductor chip, and a plurality of connecting leads. One end portion of each connecting lead being attached to the semiconductor chip by an adhesive member and the other end portion thereof being external to the package and connected to a circuit substrate. The semiconductor device further includes at least one heat-emitting lead whose one end portion is attached to the semiconductor chip by the adhesive member and whose other end portion is external to the package and is separated from the circuit substrate. The semiconductor device also includes a heat-emitting body inserted into the adhesive member and having one portion thereof connected to the heat-emitting lead.

摘要翻译： 半导体器件包括容纳半导体芯片的封装和多个连接引线。 每个连接引线的一个端部通过粘合部件附接到半导体芯片，另一个端部在封装外部连接到电路基板。 半导体器件还包括至少一个发热引线，其一端部通过粘合部件附接到半导体芯片，并且其另一端部分在封装外部并与电路基板分离。 半导体器件还包括插入到粘合构件中并且其一部分连接到发热引线的发热体。