Processes for forming electronic devices including spaced-apart radiation regions
    6.
    发明授权
    Processes for forming electronic devices including spaced-apart radiation regions 有权
    用于形成包括间隔开的辐射区域的电子器件的工艺

    公开(公告)号:US07923276B2

    公开(公告)日:2011-04-12

    申请号:US12846979

    申请日:2010-07-30

    IPC分类号: H01L21/00

    摘要: Processes for forming an electronic device include forming a first radiation region, a second radiation region spaced apart from the first radiation region, and an insulating region. The insulating region can have a first side and a second side opposite the first side. The first radiation region can lie immediately adjacent to the first side, and the second radiation region can lie immediately adjacent to the second side. Within the insulating region, no other radiation region may lie between the first and second radiation regions, and the insulating region can include an insulating layer that includes a plurality of openings. A process for forming the electronic device can include patterning an insulating layer.

    摘要翻译: 用于形成电子器件的工艺包括形成第一辐射区域,与第一辐射区域间隔开的第二辐射区域和绝缘区域。 绝缘区域可以具有与第一侧相对的第一侧和第二侧。 第一辐射区域可以紧邻第一侧面,并且第二辐射区域可以紧邻第二侧面。 在绝缘区域内,在第一和第二辐射区域之间不会有其他辐射区域,并且绝缘区域可以包括包括多个开口的绝缘层。 形成电子器件的方法可以包括图案化绝缘层。

    Electronic device and process for forming same
    8.
    发明授权
    Electronic device and process for forming same 有权
    电子设备及其成型工艺

    公开(公告)号:US06992326B1

    公开(公告)日:2006-01-31

    申请号:US10910496

    申请日:2004-08-03

    IPC分类号: H01L35/24

    摘要: An electronic device includes a substrate, a structure having openings, and a first electrode overlying the structure and lying within the openings. From a cross-sectional view, the structure, at the openings, has a negative slope. From a plan view, each opening has a perimeter that may or may not substantially correspond to a perimeter of an organic electronic component. The portions of the first electrode overlying the structure and lying within the openings are connected to each other. In a process for forming the electronic device, an organic active layer may be deposited within the opening, wherein the organic active layer has a liquid composition.

    摘要翻译: 电子设备包括基板,具有开口的结构和覆盖该结构并位于开口内的第一电极。 从横截面图,开口处的结构具有负斜率。 从平面图可以看出,每个开口都具有一个可能基本上对应于有机电子元件周边的周边。 覆盖结构并位于开口内的第一电极的部分彼此连接。 在形成电子器件的方法中,可以在开口内沉积有机活性层,其中有机活性层具有液体组成。

    Processes for printing layers for electronic devices and printing apparatuses for performing the processes
    10.
    发明授权
    Processes for printing layers for electronic devices and printing apparatuses for performing the processes 有权
    印刷用于电子设备和打印设备的层的处理

    公开(公告)号:US07584701B2

    公开(公告)日:2009-09-08

    申请号:US11026265

    申请日:2004-12-30

    IPC分类号: B41L35/14

    CPC分类号: H01L51/0005 H01L51/56

    摘要: An electronic device includes a printed layer. In one embodiment, a process for forming the electronic device includes placing a workpiece over a chuck within a printing apparatus. A temperature difference is established between the workpiece and a liquid composition. The process further includes continuously printing the liquid composition over the workpiece. A viscosity of the liquid composition is allowed to increase at a rate significantly higher than an ambient viscosity increase rate. In another embodiment, the workpiece is allowed to cool to a temperature significantly below an ambient temperature before printing occurs. In still another embodiment, a printing apparatus is used for continuously printing the liquid composition over the workpiece. The printing apparatus includes the chuck, a printing head, a container, a feed line, and a first temperature-adjusting element thermally coupled to the chuck, the printing head, the container the feed line, or a combination thereof.

    摘要翻译: 电子设备包括印刷层。 在一个实施例中,用于形成电子设备的过程包括将工件放置在打印设备内的卡盘上。 在工件和液体组合物之间建立温度差。 该方法还包括将液体组合物连续地印刷在工件上。 允许液体组合物的粘度以显着高于环境粘度增加速率的速率增加。 在另一个实施例中,允许工件在印刷发生之前冷却到明显低于环境温度的温度。 在另一个实施例中,使用印刷设备将液体组合物连续地印刷在工件上。 打印装置包括卡盘,打印头,容器,进料管线和与卡盘热连接的第一温度调节元件,打印头,容器进料管线或其组合。