公开(公告)号：US07722242B2

公开(公告)日：2010-05-25

申请号：US11846155

申请日：2007-08-28

申请人： Cheng-Hsiang Chen ,  Chih-Hung Hsu

发明人： Cheng-Hsiang Chen ,  Chih-Hung Hsu

IPC分类号： F21V7/04 ,  F21V21/00 ,  F21V15/00 ,  G09F13/04

CPC分类号： F21V19/008 ,  G02F1/133604 ,  G02F1/133608 ,  H01R13/025 ,  H01R13/193 ,  H01R33/0836

摘要： A lamp fixing structure is arranged with a lamp which has an electrode and a wire electrically connected to the electrode. The lamp fixing structure includes a lamp holder and at least one lamp protecting member. The lamp holder has at least one pressing part. The lamp protecting member has a first hole. The lamp is inserted into the lamp protecting member. The wire passes through the lamp protecting member from the first hole. The pressing part presses the lamp protecting member so that the first hole is fitted to the wire tightly.

摘要翻译： 灯固定结构布置有灯，其具有电极和电连接到电极的导线。 灯固定结构包括灯座和至少一个灯保护构件。 灯座具有至少一个按压部。 灯保护构件具有第一孔。 灯被插入灯保护构件中。 线从第一孔穿过灯保护构件。 按压部分按压灯保护构件，使得第一孔紧紧地装配到电线上。

公开(公告)号：US08378368B2

公开(公告)日：2013-02-19

申请号：US12772405

申请日：2010-05-03

申请人： Chia-Yun Hsu ,  Chih-Hung Hsu

发明人： Chia-Yun Hsu ,  Chih-Hung Hsu

IPC分类号： H01L33/00 ,  H01L23/495

CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting diode structure is provided. The light-emitting diode structure includes a light-emitting diode chip, a lead frame for electrically connecting and supporting the light-emitting diode chip, and a lens covering the light-emitting diode chip and to partially cover the lead frame. A recess disposed on the upper portion of the lens has a ladder-like inner wall formed of an upper inclined wall portion, a lower inclined wall portion, and a connecting wall portion connected to the upper and lower inclined wall portions. The slope of the upper inclined wall portion is greater than that of the lower inclined wall portion, and the slope of the connecting wall portion is greater than the upper and lower inclined wall portions.

摘要翻译： 提供了一种发光二极管结构。 发光二极管结构包括发光二极管芯片，用于电连接和支撑发光二极管芯片的引线框架，以及覆盖发光二极管芯片并部分地覆盖引线框架的透镜。 设置在透镜的上部的凹部具有由上倾斜壁部，下倾斜壁部和连接到上下倾斜壁部的连接壁部构成的梯状内壁。 上倾斜壁部的倾斜度大于下倾斜壁部的倾斜度，连接壁部的倾斜度大于上下倾斜壁部。

公开(公告)号：US08247830B2

公开(公告)日：2012-08-21

申请号：US12691720

申请日：2010-01-21

申请人： Ying-Zhong Chen ,  Chih-Hung Hsu ,  Chia-Yun Hsu

发明人： Ying-Zhong Chen ,  Chih-Hung Hsu ,  Chia-Yun Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

摘要： A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.

摘要翻译： 发光器件封装结构包括引线框架，设置在引线框架上的发光器件，电连接引线框架和发光器件的多根引线以及覆盖发光器件的密封剂，导线和 引导框架的一部分。 密封剂在其中具有气体空间，并且气体空间设置在发光器件上，其中气体空间包括至少一种气体。

公开(公告)号：US07714717B2

公开(公告)日：2010-05-11

申请号：US12068387

申请日：2008-02-06

申请人： Chih-Hung Hsu

发明人： Chih-Hung Hsu

IPC分类号： G08B13/08

CPC分类号： G08B13/08

摘要： A door alarm system comprises a door having a doorframe, a door body and a door alarm device mounted in the doorframe or door body. The door alarm device comprises a housing, a cover mounted on the housing and having a rear surface, a push button hole and four guideposts formed on and protruding from the rear surface, a battery compartment, a push button and a controller. The push button is mounted slidably in and protrudes from the push button hole and has a cap with a neck, an electrical pad mounted on the guideposts and having a through hole, a metallic plug and a resilient member. The metallic plug is mounted through the through hole in the electrical pad, connects to the neck and selectively makes contact with the electrical pad when the door is open. The controller mounted in the housing and provides an audible warning when the door body is open.

摘要翻译： 门报警系统包括门，其具有安装在门框或门体中的门框，门体和门报警装置。 门报警装置包括壳体，安装在壳体上并具有后表面的盖，按钮孔和形成在后表面上并从后表面突出的四个导轨，电池仓，按钮和控制器。 按钮可滑动地安装在按钮孔中并从按钮孔突出，并且具有带颈部的帽，安装在导轨上的电垫，并具有通孔，金属插塞和弹性构件。 金属插头通过电焊盘中的通孔安装，连接到颈部，并且当门打开时选择性地与电垫接触。 控制器安装在外壳中，并在门体打开时提供可听见的警告。

公开(公告)号：US08710529B2

公开(公告)日：2014-04-29

申请号：US13540612

申请日：2012-07-03

申请人： Ying-Zhong Chen ,  Chih-Hung Hsu ,  Chia-Yun Hsu

发明人： Ying-Zhong Chen ,  Chih-Hung Hsu ,  Chia-Yun Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

摘要： A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.

摘要翻译： 发光器件封装结构包括引线框架，设置在引线框架上的发光器件，电连接引线框架和发光器件的多个引线以及覆盖发光器件的密封剂，导线和 引导框架的一部分。 密封剂在其中具有气体空间，并且气体空间设置在发光器件上，其中气体空间包括至少一种气体。

公开(公告)号：US08210721B2

公开(公告)日：2012-07-03

申请号：US13077142

申请日：2011-03-31

申请人： Shang-Lin Chen ,  Chih-Hung Hsu

发明人： Shang-Lin Chen ,  Chih-Hung Hsu

IPC分类号： F21V3/00 ,  F21V5/00

CPC分类号： H05B33/0803 ,  Y10S362/80 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

摘要： An improved LED lamp manufacturing method and an improved LEP lamp device are described. In one aspect, an LEP lamp device includes an LED lamp bulb, a pair of electrical cables electrically coupled to the LED lamp bulb, and a main body. The main body encloses part of the LED lamp bulb, part of the pair of cables, a connection between the LED lamp bulb, and the pair of electrical cables. The main body includes a first plastic member and a second plastic member coupled to the first plastic member. Each of the first plastic member and second plastic member has a respective pair of cable grooves. The first plastic member or the second plastic member, or both, have one or more welding lines along an edge and between the respective pair of cable grooves.

摘要翻译： 描述了改进的LED灯制造方法和改进的LEP灯装置。 一方面，LEP灯装置包括LED灯泡，电耦合到LED灯泡的一对电缆以及主体。 主体包围LED灯泡的一部分，一对电缆的一部分，LED灯泡和一对电缆之间的连接。 主体包括第一塑料构件和联接到第一塑料构件的第二塑料构件。 第一塑料构件和第二塑料构件中的每一个具有相应的一对电缆槽。 第一塑料构件或第二塑料构件或两者具有沿着边缘并且在相应的一对电缆槽之间的一条或多条焊接线。

公开(公告)号：US08143101B2

公开(公告)日：2012-03-27

申请号：US12052815

申请日：2008-03-21

申请人： Yu-Ching Sun ,  Ren-Yi Cheng ,  Tsai Wan ,  Chih-Hung Hsu ,  Kuang-Hsiung Chen

发明人： Yu-Ching Sun ,  Ren-Yi Cheng ,  Tsai Wan ,  Chih-Hung Hsu ,  Kuang-Hsiung Chen

IPC分类号： H01L29/00

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a) providing a first substrate; (b) mounting a first chip onto a surface of the first substrate; (c) forming a plurality of conductive elements on the surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. Thus, the first molding compound encapsulates the entire surface of the first substrate, so that the mold flush of the first molding compound will not occur, and the rigidity of the first substrate is increased.

摘要翻译： 本发明涉及半导体封装及其制造方法。 本发明的方法包括以下步骤：（a）提供第一衬底; （b）将第一芯片安装到第一基板的表面上; （c）在所述第一基板的表面上形成多个导电元件; （d）用模具覆盖所述导电元件，所述模具具有容纳每个所述导电元件的顶端的多个空腔; 和（e）形成用于封装第一基板，第一芯片和导电元件的一部分的表面的第一模塑料，其中第一模塑料的高度小于每个导电元件的高度。 因此，第一模塑料封装第一衬底的整个表面，使得不会发生第一模塑料的冲模，并且第一衬底的刚性增加。

公开(公告)号：US20110049554A1

公开(公告)日：2011-03-03

申请号：US12870061

申请日：2010-08-27

申请人： Mao-Jen Wu ,  Hsiao-Chin Lan ,  An-Nong Wen ,  Chih-Hung Hsu ,  Hsu-Liang Hsiao ,  Chia-Chi Chang ,  Chia-Yu Lee ,  Siou-Ping Chen ,  Min-Hao Chung

发明人： Mao-Jen Wu ,  Hsiao-Chin Lan ,  An-Nong Wen ,  Chih-Hung Hsu ,  Hsu-Liang Hsiao ,  Chia-Chi Chang ,  Chia-Yu Lee ,  Siou-Ping Chen ,  Min-Hao Chung

IPC分类号： H01L33/48 ,  H01L21/3065

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01S5/02292 ,  H01L2924/00014

摘要： A package base structure for packaging a light-emitting element and a related manufacturing process are provided. The package base structure includes a semiconductor substrate having a top surface, a receiving space in the top surface and defined by slant surfaces, and a micro diffractive optical element on one of the slant surfaces. To produce the package base structure, a first etching mask with a first etching window is formed on the top surface. The etching window has a sidewall oriented at a bias angle with respect to a specific equivalent crystallographic orientation of the semiconductor substrate. Then, a selective anisotropic etching procedure is performed through the first etching window to form the slant surfaces on the semiconductor substrate. Afterwards, the micro diffractive optical element is formed on the slant surface for collimating or focusing a light beam emitted from the light-emitting element.

摘要翻译： 提供了用于封装发光元件的封装基底结构和相关制造工艺。 封装基底结构包括具有顶表面，顶表面中的接收空间和由倾斜表面限定的半导体衬底和在其中一个倾斜表面上的微衍射光学元件。 为了制造封装基底结构，在顶表面上形成具有第一蚀刻窗口的第一蚀刻掩模。 蚀刻窗具有相对于半导体衬底的特定等效晶体取向以偏压角取向的侧壁。 然后，通过第一蚀刻窗进行选择性各向异性蚀刻，以形成半导体衬底上的倾斜表面。 此后，微型衍射光学元件形成在倾斜表面上，用于使从发光元件发射的光束准直或聚焦。

公开(公告)号：US20100220575A1

公开(公告)日：2010-09-02

申请号：US12713961

申请日：2010-02-26

申请人： Wen-Hsin Sun ,  Mao-Jen Wu ,  Hsiao-Chin Lan ,  An-Nong Wen ,  Chih-Hung Hsu

发明人： Wen-Hsin Sun ,  Mao-Jen Wu ,  Hsiao-Chin Lan ,  An-Nong Wen ,  Chih-Hung Hsu

IPC分类号： G11B7/135

CPC分类号： G11B7/1275 ,  G11B7/123 ,  G11B7/1356 ,  G11B2007/0006

摘要： An optical pickup head includes a first light source, a second light source, a base, a light adjusting unit, and a light guiding unit. The first light source emits a first wavelength light beam to read a first data density optical storage medium. The second light source emits a second wavelength light beam to read a second data density optical storage medium. The base includes at least a slant surface for reflecting the first wavelength light beam and the second wavelength light beam, so that the first wavelength light beam and the second wavelength light beam are parallel with each other. The light adjusting unit adjusts the first wavelength light beam and the second wavelength light beam to the same optical axis. The light guiding unit guides the first wavelength light beam and the second wavelength light beam to the first data density optical storage medium or the second data density optical storage medium.

摘要翻译： 光拾取头包括第一光源，第二光源，基座，调光单元和导光单元。 第一光源发射第一波长光束以读取第一数据密度光存储介质。 第二光源发射第二波长光束以读取第二数据密度光存储介质。 该基部至少包括用于反射第一波长光束和第二波长光束的倾斜表面，使得第一波长光束和第二波长光束彼此平行。 光调整单元将第一波长光束和第二波长光束调整到相同的光轴。 导光单元将第一波长光束和第二波长光束引导到第一数据密度光存储介质或第二数据密度光存储介质。

公开(公告)号：US20100148211A1

公开(公告)日：2010-06-17

申请号：US12637765

申请日：2009-12-15

申请人： Sheng-Jia Sheu ,  Chih-Hung Hsu ,  Chung-Chuan Hsieh

发明人： Sheng-Jia Sheu ,  Chih-Hung Hsu ,  Chung-Chuan Hsieh

IPC分类号： H01L33/62

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2924/00014

摘要： A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.

摘要翻译： 提供了包括引线框，壳体，LED芯片和透光密封剂的发光二极管（LED）封装结构。 引线框架具有彼此分离的第一电极和第二电极。 壳体包裹第一电极和第二电极，并且包括具有底部和侧壁的凹部。 所述凹部的底部具有覆盖所述引线框架的覆盖层，并且具有暴露所述第一电极的端部，所述第二电极的端部和设置在其间并与之连接的间隔件的开口，其中所述间隔件，所述第一电极的端部和 第二电极的端部基本上共面。 LED芯片设置在凹槽中并电连接到引线框架。 透光密封剂填充在凹部中。