利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.053 秒)

    Molding composition and method, and molded article
    2.
    发明授权
    Molding composition and method, and molded article 失效
    成型组合物和成型品

    公开(公告)号：US07378455B2

    公开(公告)日：2008-05-27

    申请号：US11172308

    申请日：2005-06-30

    申请人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    发明人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    IPC分类号： C08F2/50 ,  B29C41/00 ,  B29C39/00

    CPC分类号： C08G59/68 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

    摘要翻译： 用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12） 全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

    Molding composition and method, and molded article
    7.
    发明申请
    Molding composition and method, and molded article 失效
    成型组合物和成型品

    公开(公告)号：US20070004819A1

    公开(公告)日：2007-01-04

    申请号：US11172308

    申请日：2005-06-30

    申请人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    发明人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    IPC分类号： C08F2/46 ,  C08L63/00 ,  C08L71/02

    CPC分类号： C08G59/68 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

    摘要翻译： 用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12） 全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

    Poly (arylene ether) composition and method
    9.
    发明申请
    Poly (arylene ether) composition and method 失效
    聚（亚芳基醚）组合物和方法

    公开(公告)号：US20050075463A1

    公开(公告)日：2005-04-07

    申请号：US10678459

    申请日：2003-10-03

    申请人： Kenneth Zarnoch ,  John Campbell ,  Glen Merfeld ,  John Rude ,  Prameela Susarla ,  Michael Vallance ,  Gary Yeager

    发明人： Kenneth Zarnoch ,  John Campbell ,  Glen Merfeld ,  John Rude ,  Prameela Susarla ,  Michael Vallance ,  Gary Yeager

    IPC分类号： C08F283/08 ,  C08F293/00 ,  C08F297/02 ,  C08G65/48 ,  C08L53/00 ,  C08L71/12

    CPC分类号： C08G65/48 ,  C08F293/005 ,  C08F297/02 ,  C08F297/026 ,  C08G65/485 ,  C08L53/00

    摘要： A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.

    摘要翻译： 可固化组合物包括官能化的聚（亚芳基醚），烯属不饱和单体，每100重量份官能化聚（亚芳基醚）和烯属不饱和单体的总量为约0.2至约5重量份的固化引发剂，以及 官能化聚（亚芳基醚）和烯属不饱和单体总量相对于100重量份固化抑制剂为约0.005〜约1重量份。 固化引发剂与固化抑制剂的重量比为约1.2:1至约50:1。 该组合物在模制的早期阶段提供了改进的和可重复的流动，而不损害固化时间。 该组合物可用于制备塑料封装的电子器件。