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Patent Agency Ranking
公开(公告)号：US20120205699A1
公开(公告)日：2012-08-16
申请号：US13365922
申请日：2012-02-03
Applicant: Cheol-jun YOO , Young-hee Song
Inventor： Cheol-jun YOO , Young-hee Song
CPC classification number: H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/15151 , H01L2924/00014
Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Abstract translation: 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。
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公开(公告)号：US20120205708A1
公开(公告)日：2012-08-16
申请号：US13365882
申请日：2012-02-03
Applicant: Cheol-jun YOO , Young-hee SONG
Inventor： Cheol-jun YOO , Young-hee SONG
CPC classification number: H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2933/005 , H01L2924/00014
Abstract: A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.
Abstract translation: 一种发光器件封装。 发光器件封装包括引线框架，该引线框架包括多个单独的引线; 模制构件，其固定所述多个引线并且包括暴露所述引线框架的开口部; 以及发光器件芯片，其安装在所述引线框架中的所述开口部分中并且通过所述发光器件芯片的上表面部分发射光，其中所述模制构件的高度低于所述发光器件芯片的高度， 相对于引线框架的发光器件芯片。
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3.发明申请公开(公告)号：US20120187437A1
公开(公告)日：2012-07-26
申请号：US13348369
申请日：2012-01-11
Applicant: Cheol-jun YOO , Young-hee SONG
Inventor： Cheol-jun YOO , Young-hee SONG
CPC classification number: H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.
Abstract translation: 具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。 发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发射面的发光元件的顶面的成型部件， 布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。
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公开(公告)号：US20120184056A1
公开(公告)日：2012-07-19
申请号：US13338678
申请日：2011-12-28
Applicant: Cheol-jun YOO , Seong-jae Hong , Tsuyoshi Tsutsui , Shin-kun Kim
Inventor： Cheol-jun YOO , Seong-jae Hong , Tsuyoshi Tsutsui , Shin-kun Kim
CPC classification number: B05C1/027 , H01L21/6715 , H01L21/6838 , H01L33/0079 , H01L33/50 , H01L2933/0041
Abstract: Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.
Abstract translation: 制造通过在晶片级在半导体发光元件的发射表面上形成荧光层而发出白光的半导体发光器件的制造方法和装置。 该方法包括：在晶片上形成多个发光器件; 使形成有多个发光装置的晶片变薄; 将薄的晶片设置在载体膜上; 以及在所述晶片上的所述多个发光器件的发射表面上形成荧光体层。
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5.发明申请METHOD AND APPARATUS FOR DEPOSITING PHOSPHOR ON SEMICONDUCTOR-LIGHT EMITTING DEVICE 有权在半导体发光器件上沉积磷光体的方法和装置公开(公告)号：US20120164759A1
公开(公告)日：2012-06-28
申请号：US13314783
申请日：2011-12-08
Applicant: Cheol-jun YOO , Seong-jae Hong
Inventor： Cheol-jun YOO , Seong-jae Hong
CPC classification number: H01L22/20 , H01L33/005 , H01L33/0095 , H01L33/50 , H01L33/52 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.
Abstract translation: 一种使用传递模塑沉积磷光体的方法和装置。 该方法包括：在晶片上形成多个发光器件，并通过检查多个发光器件的亮度特性，根据多个发光器件的亮度特性重新排列载体衬底上的发光器件 设备; 使用传递模塑将磷光体沉积在重排的发光器件上; 并分离载体基板上的发光装置。
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