摘要:
An array of storage cells include a first source/drain region underlying a first trench defined in a semiconductor substrate and a second source/drain region underlying a second trench in the substrate. A charge storage stack lines each of the trenches where the charge storage stack includes a layer of discontinuous storage elements (DSEs). A control gate overlies the first trench. The control gate may run perpendicular to the trenches and traverse the first and second trenches. In another implementation, the control gate runs parallel with the trenches. The storage cell may include one or more diffusion regions occupying an upper surface of the substrate between the first and second trenches. The diffusion region may reside between first and second control gates that are parallel to the trenches. Alternatively, a pair of diffusion regions may occur on either side of a control gate that is perpendicular to the trenches.
摘要:
An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.
摘要:
A process for forming an electronic device can include forming a first set of discontinuous storage elements over a primary surface of a substrate and forming a trench within the substrate. The process can also include forming a second set of discontinuous storage elements within the trench. The process can further include forming a first gate electrode within the trench, wherein a discontinuous storage element lies between the first gate electrode and a wall of the trench. The process can still further include removing a part of the second set of discontinuous storage elements and forming a second gate electrode over the first gate electrode. After forming the second gate electrode, substantially none of the second set of discontinuous storage elements lies along the wall of the trench at an elevation between an upper surface of the first gate electrode and the primary surface of the substrate.
摘要:
An electronic device can include a substrate having a trench that includes a wall and a bottom. The electronic device can also include a first set of discontinuous storage elements that overlie a primary surface of the substrate and a second set of discontinuous storage elements that lie within the trench. The electronic device can also include a first gate electrode, wherein substantially none of the discontinuous storage elements lies along the wall of the trench at an elevation between and upper surface of the first gate electrode and the primary surface of the substrate. The electronic device can also include a second gate electrode overlying the first gate electrode and the primary surface. In another embodiment, a conductive line can be electrically connected to one or more rows or columns of memory cells, and another conductive line can be more rows or more columns of memory cells.
摘要:
A method is provided which includes forming a first gate overlying a major surface of an electronic device substrate and forming a second gate overlying and spaced apart from the first gate. The method further includes forming a charge storage structure horizontally adjacent to, and continuous along, the first gate and the second gate, wherein a major surface of the charge storage structure is substantially vertical to the major surface of the substrate.
摘要:
An electronic device can include discontinuous storage elements that lie within a trench. In one embodiment, the electronic device can include a substrate having a trench that includes a wall and a bottom. The electronic device can also include a portion of discontinuous storage elements that lie within the trench. The electronic device can also include a first gate electrode, wherein at least one discontinuous storage element lies along the wall of the trench at an elevation between and upper surface of the first gate electrode and a primary surface of the substrate. The electronic device can also include a second gate electrode overlying the first gate electrode and the primary surface of the substrate. In another embodiment, a conductive line can be electrically connected to one or more rows or columns of memory cells, and another conductive line can be more rows or more columns of memory cells.
摘要:
An electronic device can include a substrate having a trench that includes a wall and a bottom. The electronic device can also include a first set of discontinuous storage elements that overlie a primary surface of the substrate and a second set of discontinuous storage elements that lie within the trench. The electronic device can also include a first gate electrode, wherein substantially none of the discontinuous storage elements lies along the wall of the trench at an elevation between and upper surface of the first gate electrode and the primary surface of the substrate. The electronic device can also include a second gate electrode overlying the first gate electrode and the primary surface. In another embodiment, a conductive line can be electrically connected to one or more rows or columns of memory cells, and another conductive line can be more rows or more columns of memory cells.
摘要:
A storage device has a two bit cell in which the select electrode is nearest the channel between two storage layers. Individual control electrodes are over individual storage layers. Adjacent cells are separated by a doped region that is shared between the adjacent cells. The doped region is formed by an implant in which the select gates of adjacent cells are used as a mask. This structure provides for reduced area while retaining the ability to perform programming by source side injection.
摘要:
A process for forming an electronic device can include forming a trench within a substrate, wherein the trench includes a wall and a bottom. The process can also include including forming a portion of discontinuous storage elements that lie within the trench, and forming a first gate electrode within the trench after forming the discontinuous storage elements. At least one discontinuous storage element lies along the wall of the trench at an elevation between an upper surface of the first gate electrode and a primary surface of the substrate. The process can also include forming a second gate electrode overlying the first gate electrode and the primary surface of the substrate.
摘要:
An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.