摘要:
A high voltage PMOS transistor 7 has improved on resistance by adjusting impurity concentration in a lightly doped drift region rim 48 to compensate for impurity segregation which occurs during the growth phase of a thick field oxide 43. During fabrication of high voltage PMOS device 7, a shallow vertical junction 230 formed by impurity segregation into field oxide 43. Implanting an HV drift region p-tank rim adjustment 220 and annealing it forms a lateral junction 250 and isolates the shallow junction 230 under field oxide 43. Thereby, the on-resistance of high voltage PMOS transistor 7 is minimized.
摘要:
A portable computer having a display unit coupled to a base. The display unit includes an exterior display case, a screen, one or more liquid crystal display (LCD) panels, display electronics and a light source. The light source is a tubular shaped lamp which extends along a length of the display case and is held in place by a harness at one end of the display case. A section of the display case is an independently movable reflector, coated with a light reflective mirrored finish that distributes light evenly along the LCD panel surface. The computer has a storage mode and an active mode. When in active mode, the reflector is inclined and light from the light source reflects unto the LCD panel within the case. In storage mode, the reflector is closed and no light is reflected unto the LCD panel.
摘要:
An FED display (10) is provided which is formed from flexible materials. The flexible FED display (10) includes an anode element (12) having a face sheet layer (18) formed from a first layer of flexible insulating substrate material. A cathode element (14) is attached to the anode element (12). The cathode element (14) includes a backing sheet layer (26) formed from a second layer of flexible insulating substrate material (40).
摘要:
An improved high-voltage device structure (10, 50, or 60) is a hybrid silicon-based/non-silicon-based power device that has a low R.sub.ds(on) relative to devices formed using only a silicon substrate and includes control circuit (14, 14', or 14") formed on silicon substrate region (12 or 62). High-voltage circuit (16, 16' or 16") is formed in non-silicon substrate region (18). Connecting circuitry (34 and 66) connects control circuit (14, 14', and 14") with high-voltage circuit (16, 16' or 16") to form high-voltage device structure (10, 50 or 60) that has improved control circuit performance and improved high-voltage circuits performance over devices formed solely from a silicon substrate or solely from a non-silicon substrate.
摘要:
A method and apparatus is provided for miniaturizing battery overtemperature protection and voltage regulation circuits in which such protection and regulation circuits are formed in an integrated circuit (200, 600) and embedded in the casings of individual batteries. In one aspect of the invention, a MOSFET switch (Q1), a temperature sensitive diode (D1) and a control circuit (604) may be formed in an integrated circuit (600) and embedded in the casing of a battery. The MOSFET switch may be placed in the charging path of the battery to provide an open circuit when the battery temperature exceeds a predetermined value. In another aspect of the invention, the operation of the MOSFET switch (Q1) may be controlled by a control circuit (204) to provide a constant output voltage from the battery, thereby improving the operation of the portable system using the battery.
摘要:
A top drain trench based RESURF DMOS (reduced surface field double diffused MOS) transistor structure provides improved RDSon performance by minimizing transistor cell pitch. The transistor includes a gate, a source and drain. The trench may include a nonuniform dielectric lining. A drain drift region partially surrounds the trench. Current flows laterally enabling multiple trench based RESURF DMOS transistors to be formed on a single semiconductor die. The addition of an isolation region to electrically isolate the source from the substrate allows the power transistor to be incorporated into high side driver applications as well as other application mandating electrical isolation between the source and ground.
摘要:
A high voltage power transistor cell is developed that provides improved RDSon performance without sacrificing breakdown performance through utilization of trench based transistor technology. A source, drain and trench are formed within a substrate. A gate is formed on the surface over a spacing between the source and the trench. A drift region is formed around the trench. An isolation region may optionally be added allowing electrical isolation between the source and the substrate. The lateral current flow feature allows multiple high voltage power transistors, electrically isolated from one another, to exist on a single semiconductor chip. The drift region formed around the trench provides RESURF transistor characteristics without sacrificing die area.
摘要:
An improved high-voltage device structure (10, 50, or 60) is a hybrid silicon-based/non-silicon-based power device that has a low R.sub.ds(on) relative to devices formed using only a silicon substrate and includes control circuit (14, 14' or 14") formed on silicon substrate region (12 or 62). High-voltage circuit (16, 16' or 16") is formed in non-silicon substrate region (18). Connecting circuitry (34 and 66) connects control circuit (14, 14', and 14") with high-voltage circuit (16, 16' or 16") to form high-voltage device structure (10, 50 or 60) that has improved control circuit performance and improved high-voltage circuits performance over devices formed solely from a silicon substrate or solely from a non-silicon substrate.
摘要:
A silicon carbide structure (10) and method capable of using existing silicon wafer fabrication facilities. A silicon wafer (20) is provided which has a first diameter. At least one silicon carbide wafer (30) is provided which has a given width and length (or diameter). The width and length (or diameter) of the silicon carbide wafer (30) are smaller than the diameter of the silicon wafer (20). The silicon wafer (20) and the silicon carbide wafer (30) are then bonded together. The bonding layer (58) may comprise silicon germanium, silicon dioxide, silicate glass or other materials. Structures such as MOSFET (62) may be then formed in silicon carbide wafer (30).
摘要:
A transistor device (10) includes an epitaxial layer (14) formed on a semiconductor substrate layer (12). A base layer (16) is formed on the epitaxial layer (14) and a source layer (18) is formed on the base layer (16). A trench region (22) is formed extending through the source layer (18), the base layer (16), and the epitaxial layer (14) and into the semiconductor substrate layer (12). An oxide layer (24) is formed on the source layer (18) and on the internal walls of the trench region (22) such that the oxide layer (24) is wider at the bottom of the trench region (22) than at the top in order to handle high voltage applications. A gate layer (26) is formed within the trench region (22) on the oxide layer (24). The gate layer (26) causes a drift region formed within the epitaxial layer (14) to fully deplete under full rated blocking conditions, decreasing the drift region component of the on-resistance which is the dominant parameter in very high voltage devices.