公开(公告)号：US20090079044A1

公开(公告)日：2009-03-26

申请号：US12203314

申请日：2008-09-03

申请人： Chia-Fu Wu ,  Cheng-Yin Lee

发明人： Chia-Fu Wu ,  Cheng-Yin Lee

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/49572 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.

摘要翻译： 半导体封装包括引线框，至少一个芯片和封装。 引线框架具有多个引线，并且每个引线包括至少一个第一导电部件，至少一个第二导电部件和至少一个第三导电部件。 第一导电部不与第二导电部电连接，第二导电部与第三导电部电连接。 芯片电连接到第一导电部件。 封装封装芯片和引线框架的至少一部分，并形成与第一表面相对的第一表面和第二表面。 第一导电部分和第三导电部分从第一表面暴露，并且第二导电部分从第二表面露出。

公开(公告)号：US07719094B2

公开(公告)日：2010-05-18

申请号：US12203314

申请日：2008-09-03

申请人： Chia-Fu Wu ,  Cheng-Yin Lee

发明人： Chia-Fu Wu ,  Cheng-Yin Lee

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/49572 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.

摘要翻译： 半导体封装包括引线框，至少一个芯片和封装。 引线框架具有多个引线，并且每个引线包括至少一个第一导电部件，至少一个第二导电部件和至少一个第三导电部件。 第一导电部不与第二导电部电连接，第二导电部与第三导电部电连接。 芯片电连接到第一导电部件。 封装封装芯片和引线框架的至少一部分，并形成与第一表面相对的第一表面和第二表面。 第一导电部分和第三导电部分从第一表面暴露，并且第二导电部分从第二表面露出。

公开(公告)号：US20090065911A1

公开(公告)日：2009-03-12

申请号：US12208881

申请日：2008-09-11

申请人： Chia-Fu Wu ,  Cheng-Yin Lee

发明人： Chia-Fu Wu ,  Cheng-Yin Lee

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/48

CPC分类号： H01L23/495 ,  H01L23/29 ,  H01L23/31 ,  H01L23/3135 ,  H01L23/49517 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a carrier, at least one chip, an encapsulation, and a patterned conductive film. The carrier has a first surface and a second surface opposite to the first surface. The chip is disposed on the first surface of the carrier and electrically connected to the carrier. The encapsulation encapsulates the chip and at least a portion of the first surface of the carrier. The patterned conductive film is disposed on the encapsulation to electrically connect to the carrier. A manufacturing method of the semiconductor package is also disclosed.

摘要翻译： 半导体封装包括载体，至少一个芯片，封装和图案化导电膜。 载体具有与第一表面相对的第一表面和第二表面。 芯片设置在载体的第一表面上并电连接至载体。 封装封装芯片和载体的第一表面的至少一部分。 图案化导电膜设置在封装件上以电连接至载体。 还公开了半导体封装的制造方法。

公开(公告)号：US20070268345A1

公开(公告)日：2007-11-22

申请号：US11745467

申请日：2007-05-08

申请人： Chia-Fu Wu ,  Francis Chee-Shuen Lee ,  Shih-Chieh Yeh

发明人： Chia-Fu Wu ,  Francis Chee-Shuen Lee ,  Shih-Chieh Yeh

IPC分类号： B41J2/175

CPC分类号： B41J2/17513 ,  B41J2/17553

摘要： An ink cartridge is provided with a body, a channel module attached to the body, a plurality of first engaging parts, and a plurality of second engaging parts. The first engaging parts are arranged on one of the body and the channel module, while the second engaging parts corresponding to the first engaging parts are arranged on the other of the body and the channel module. The relative position of the body and the channel module on a two-dimension plane is substantially fixed by the engagement of the first engaging parts and the second engaging parts.

摘要翻译： 墨盒设置有主体，固定在主体上的通道模块，多个第一接合部分和多个第二接合部分。 第一接合部分布置在主体和通道模块中的一个上，而对应于第一接合部分的第二接合部分布置在主体和通道模块的另一个上。 主体和通道模块在二维平面上的相对位置通过第一接合部分和第二接合部分的接合而基本固定。

公开(公告)号：US08025377B2

公开(公告)日：2011-09-27

申请号：US11745467

申请日：2007-05-08

申请人： Chia-Fu Wu ,  Francis Chee-Shuen Lee ,  Shih-Chieh Yeh

发明人： Chia-Fu Wu ,  Francis Chee-Shuen Lee ,  Shih-Chieh Yeh

IPC分类号： B41J2/175 ,  B41J29/393 ,  B41J2/14 ,  B41J2/17

CPC分类号： B41J2/17513 ,  B41J2/17553

摘要： An ink cartridge is provided with a body, a channel module attached to the body, a plurality of first engaging parts, and a plurality of second engaging parts. The first engaging parts are arranged on one of the body and the channel module, while the second engaging parts corresponding to the first engaging parts are arranged on the other of the body and the channel module. The relative position of the body and the channel module on a two-dimension plane is substantially fixed by the engagement of the first engaging parts and the second engaging parts.

摘要翻译： 墨盒设置有主体，固定在主体上的通道模块，多个第一接合部分和多个第二接合部分。 第一接合部分布置在主体和通道模块中的一个上，而对应于第一接合部分的第二接合部分布置在主体和通道模块的另一个上。 主体和通道模块在二维平面上的相对位置通过第一接合部分和第二接合部分的接合而基本固定。