Abstract:
An improved Universal Serial Bus (USB) connector mounted on a print circuit board for transmitting electric signals between a dock connector and the print circuit board. The improved Universal Serial Bus connector comprises a set of first terminals, a set of second terminals, an insulator, and a shielding shell. Each of the first terminals and the second terminals is respectively fixed on the insulator. The insulator includes a cap, on which each of the first terminals and the second terminals is disposed, and is substantially enclosed by the shielding shell.
Abstract:
An improved structure of a lift cover connector includes a base, a cover, a main body, a terminal module and a plurality of positioning members. The cover is rotatably pivoted to one end of the base, and the cover can be opened or closed relative to the base. The terminal module is received in the base, and is inserted and positioned in the main body. The base and the main body are engaged with each other, and the positioning members are inserted in the main body. This design enables the cover to automatically close the base in a normal state by a resilient function of the positioning members, thereby to facilitating reducing product loss and improving the overall yield.
Abstract:
A submount is used for disposing an illuminant element or a light-receiving element having an optical axis. The submount is disposed at a plane and has a main body. The main body includes a first surface and a second surface. The first surface is approximately parallel to the plane and far away from the plane. The second surface is approximately parallel to the plane and adjacent to the plane. A disposing part of the first surface is tilted with respect to the second surface at a predetermined angle. The illuminant element or the light-receiving element is disposed on the disposing part. The optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.
Abstract:
A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
Abstract:
A light source unit is disclosed for arranging on a plane and emitting a light beam oblique to the plane. The light source unit includes an illuminant element and a transparent encapsulator. The illuminant element has an upper surface and a lower surface both parallel to the plane. The transparent encapsulator physically contacts with the illuminant element and at least covers the upper surface of the illuminant element. The transparent encapsulator has an oblique surface above the upper surface and oblique to the upper surface. In addition, an optical inputting module having the light source unit mentioned above is disclosed.
Abstract:
An optical device is disclosed. The optical device includes a first packaging unit and a second packaging unit. The first packaging unit includes a first lead frame and a sensor electrically coupled to the first lead frame. The second packaging unit includes an emitting die and a second lead frame. The emitting die has an optical axis and is operable to emit a light. The second lead frame has a first portion disposed within the second packaging unit and a second portion extending into the first packaging unit so that an angle of about 5-85 degrees is formed between the optical axis of the emitting die and the sensing plane of the sensor.
Abstract:
A three-dimensional connector, which is used by a coordinate input device of a touch pad has a flat conductor cable with an end being connected to the touch pad and another end having multiple conductive lines. Each of the conductive lines is attached with a vertical guiding conductor pin. The guide conductor pin has a head section to press-fit with the flat conductor cable, and extends through a support to transmit electronic signals in a direction perpendicular to said flat conductor cable.
Abstract:
A vertical cavity-surface emitting laser (VCSEL) for emitting a single-mode laser including a multiple transverse mode VCSEL includes a top emitting region, and a dielectric film covering the top emitting region of the multiple transverse mode VCSEL completely, in order to limit the multiple transverse mode VCSEL to emit the single-mode laser.