公开(公告)号：US20070163756A1

公开(公告)日：2007-07-19

申请号：US11592293

申请日：2006-11-03

申请人： Chih-Yao Wang ,  Chiung-I Lee ,  Heng-Chieh Chien ,  Shu-Jung Yang ,  Ra-Min Tain ,  Chih-Min Hsiung

发明人： Chih-Yao Wang ,  Chiung-I Lee ,  Heng-Chieh Chien ,  Shu-Jung Yang ,  Ra-Min Tain ,  Chih-Min Hsiung

IPC分类号： H05K7/20

CPC分类号： H05K7/20336

摘要： A closed-loop latent heat cooling method and a capillary force or non-nozzle module thereof are provided, wherein a cooling fluid in a storage tank flows to a gasification pipe via a liquid pipe; the gasification pipe connects with a capillary force or non-nozzle structure; the cooling fluid keeps a liquid thin film in the gasification pipe, and after absorbing the heat of electronic components, it keeps a thin film in a boiling state; then, it is gasified and rises to a vapor chamber more efficiently; the gasified cooling fluid in the vapor chamber flows to a condenser via a vapor pipe and flows back to the storage tank via the liquid pipe after condensed to be a liquid in the condenser.

摘要翻译： 提供闭环潜热冷却方法和毛细管力或非喷嘴组件，其中储罐中的冷却流体经由液体管流到气化管; 气化管与毛细管力或非喷嘴结构连接; 冷却液在气化管内保持液体薄膜，吸收电子部件的热量后，保持薄膜处于沸腾状态; 然后，它被气化并更有效地上升到蒸气室; 蒸气室中的气化冷却流体经由蒸汽管流入冷凝器，经冷凝后冷凝后回流至储罐，成为冷凝器中的液体。

公开(公告)号：US20070205690A1

公开(公告)日：2007-09-06

申请号：US11594832

申请日：2006-11-09

申请人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

发明人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

IPC分类号： H01L41/00

CPC分类号： H01L41/0906

摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.

摘要翻译： 公开了一种用于散热由发热元件产生的热的复合模式换能器。 复合模式换能器包括换能模块和连接元件。 换能模块包括并联连接的第一和第二换能元件。 连接元件连接到第一和第二换能元件的共振节点。 第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。 通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。 因此，克服了现有技术的缺点。 本发明还提供一种具有复合模式换能器的冷却装置。

公开(公告)号：US08408747B2

公开(公告)日：2013-04-02

申请号：US12575317

申请日：2009-10-07

申请人： Kung-Hsia Wang ,  Ra-Min Tain ,  Ping-Hsin Hsia ,  Hsien-Chang Lee ,  Shu-Jung Yang ,  Chao-Hsien Chang

发明人： Kung-Hsia Wang ,  Ra-Min Tain ,  Ping-Hsin Hsia ,  Hsien-Chang Lee ,  Shu-Jung Yang ,  Chao-Hsien Chang

IPC分类号： F21V29/00

CPC分类号： F21V29/74 ,  F21K9/23 ,  F21V3/00 ,  F21V23/002 ,  F21V29/004 ,  F21V29/89 ,  F21V31/005 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode.

摘要翻译： 发光装置可以包括散热基座，发光单元，外壳以​​及第一导电触点和第二导电触点。 散热基座具有顶部和底部。 散热基座的底部可包括暴露的散热表面。 发光单元在散热基座的顶部之上，并且布置成至少从发光单元向散热基底提供导热性。 发光单元可以包括用于发光的至少一个发光二极管和第一电极和第二电极。 可以在发光二极管发光时产生热量，并且至少一个发光二极管可以具有用于接收输入到至少一个发光二极管的功率的电力输入端子。 电源输入可以包括交流输入和直流输入之一。 第一电极和第二电极与至少一个发光二极管的输入端电耦合。 壳体包围发光单元的至少一部分并且覆盖散热基座的顶部。 第一导电接触和第二导电接触靠近或低于散热基部的一部分，并且被配置为接收外部电源。 第一导电接触可以与第一电极电耦合，并且第二导电接触可以与第二电极电耦合。

公开(公告)号：US08283613B2

公开(公告)日：2012-10-09

申请号：US11562420

申请日：2006-11-22

申请人： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

发明人： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

IPC分类号： H05B6/10 ,  F03C1/00 ,  F01K23/06 ,  H02K5/12 ,  H02K49/00

CPC分类号： F01K13/006 ,  F01K21/02

摘要： A heat-pipe electric-power generating device capable of converting thermal energy to electrical energy is provided. The device includes a heat pipe and the heat pipe has a sealed internal space that can produce a steam-flow from an evaporating end to a condensing end according to a pressure difference caused by a temperature difference between the ends. A steam-flow electric-power generating device has at least a rotating portion disposed in the internal space for generating electric power when driven by a steam-flow. An electrode structure is used for leading the electric power out. The heat pipe is maintained in a sealed condition. In addition, several heat-pipe electric-power generating devices can be arranged into an array to form a heat electric-power generator or disposed inside an apparatus with a heat source for recycling the conventional waste thermal energy into useful electrical energy.

摘要翻译： 提供了一种能够将热能转换成电能的热管式发电装置。 该装置包括热管，并且热管具有密封的内部空间，其可以根据由端部之间的温度差引起的压力差而产生从蒸发端到冷凝端的蒸汽流。 蒸汽流动发电装置至少具有设置在内部空间中的旋转部分，用于在由蒸汽流动驱动时产生电力。 电极结构用于引出电力。 热管保持密封状态。 此外，若干热管式发电装置可以排列成阵列以形成热发电机，或设置在具有用于将常规废热热能再循环到有用电能的热源的装置内。

公开(公告)号：US20100085754A1

公开(公告)日：2010-04-08

申请号：US12575317

申请日：2009-10-07

申请人： Kung-Hsia Wang ,  Ra-Min Tain ,  Ping-Hsin Hsia ,  Hsien-Chang Lee ,  Shu-Jung Yang ,  Chao-Hsien Chang

发明人： Kung-Hsia Wang ,  Ra-Min Tain ,  Ping-Hsin Hsia ,  Hsien-Chang Lee ,  Shu-Jung Yang ,  Chao-Hsien Chang

IPC分类号： F21S4/00

CPC分类号： F21V29/74 ,  F21K9/23 ,  F21V3/00 ,  F21V23/002 ,  F21V29/004 ,  F21V29/89 ,  F21V31/005 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode.

摘要翻译： 发光装置可以包括散热基座，发光单元，外壳以​​及第一导电触点和第二导电触点。 散热基座具有顶部和底部。 散热基座的底部可包括暴露的散热表面。 发光单元在散热基座的顶部之上，并且布置成至少从发光单元向散热基底提供导热性。 发光单元可以包括用于发光的至少一个发光二极管和第一电极和第二电极。 可以在发光二极管发光时产生热量，并且至少一个发光二极管可以具有用于接收输入到至少一个发光二极管的功率的电力输入端子。 电源输入可以包括交流输入和直流输入之一。 第一电极和第二电极与至少一个发光二极管的输入端电耦合。 壳体包围发光单元的至少一部分并且覆盖散热基座的顶部。 第一导电接触和第二导电接触靠近或低于散热基部的一部分，并且被配置为接收外部电源。 第一导电接触可以与第一电极电耦合，并且第二导电接触可以与第二电极电耦合。

公开(公告)号：US08004079B2

公开(公告)日：2011-08-23

申请号：US12464873

申请日：2009-05-13

申请人： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

发明人： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

摘要翻译： 芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。 衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。 芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。 导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。 此外，导热层具有暴露信号通孔的第一开口。 信号触点分别设置在第一开口中并连接到信号通路。 模塑料封装芯片。

公开(公告)号：US20080135213A1

公开(公告)日：2008-06-12

申请号：US12068722

申请日：2008-02-11

申请人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

发明人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

IPC分类号： F28D15/00

CPC分类号： H01L41/0906

摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.

摘要翻译： 公开了一种用于散热由发热元件产生的热的复合模式换能器。 复合模式换能器包括换能模块和连接元件。 换能模块包括并联连接的第一和第二换能元件。 连接元件连接到第一和第二换能元件的共振节点。 第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。 通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。 因此，克服了现有技术的缺点。 本发明还提供一种具有复合模式换能器的冷却装置。

公开(公告)号：US07683522B2

公开(公告)日：2010-03-23

申请号：US12068722

申请日：2008-02-11

申请人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

发明人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

IPC分类号： H01L41/08 ,  H01L41/09 ,  H02N2/00 ,  F28G13/00

CPC分类号： H01L41/0906

摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.

摘要翻译： 公开了一种用于散热由发热元件产生的热的复合模式换能器。 复合模式换能器包括换能模块和连接元件。 换能模块包括并联连接的第一和第二换能元件。 连接元件连接到第一和第二换能元件的共振节点。 第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。 通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。 因此，克服了现有技术的缺点。 本发明还提供一种具有复合模式换能器的冷却装置。

公开(公告)号：US20090294947A1

公开(公告)日：2009-12-03

申请号：US12464873

申请日：2009-05-13

申请人： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

发明人： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L25/11

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

摘要翻译： 芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。 衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。 芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。 导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。 此外，导热层具有暴露信号通孔的第一开口。 信号触点分别设置在第一开口中并连接到信号通路。 模塑料封装芯片。

公开(公告)号：US07567015B2

公开(公告)日：2009-07-28

申请号：US11594832

申请日：2006-11-09

申请人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

发明人： Syh-Yuh Cheng ,  Yun-Tien Chen ,  Ra-Min Tain ,  Shu-Jung Yang

IPC分类号： H01L41/08

CPC分类号： H01L41/0906

摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.

摘要翻译： 公开了一种用于散热由发热元件产生的热的复合模式换能器。 复合模式换能器包括换能模块和连接元件。 换能模块包括并联连接的第一和第二换能元件。 连接元件连接到第一和第二换能元件的共振节点。 第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。 通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。 因此，克服了现有技术的缺点。 本发明还提供一种具有复合模式换能器的冷却装置。